CN101394707B - 软性电路板 - Google Patents

软性电路板 Download PDF

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Publication number
CN101394707B
CN101394707B CN2007102018194A CN200710201819A CN101394707B CN 101394707 B CN101394707 B CN 101394707B CN 2007102018194 A CN2007102018194 A CN 2007102018194A CN 200710201819 A CN200710201819 A CN 200710201819A CN 101394707 B CN101394707 B CN 101394707B
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Prior art keywords
circuit board
transmission lines
flexible circuit
difference transmission
layer
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Expired - Fee Related
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CN2007102018194A
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CN101394707A (zh
Inventor
白育彰
许寿国
刘建宏
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2007102018194A priority Critical patent/CN101394707B/zh
Priority to US11/951,290 priority patent/US7781680B2/en
Publication of CN101394707A publication Critical patent/CN101394707A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种软性电路板，包括一信号层、一接地层及一差分对，所述信号层与接地层之间填充一层绝缘介质，所述差分对包括两条差分传输线，其中一条差分传输线布设于所述信号层中，另一条差分传输线布设于所述接地层中，所述接地层中与所述信号层中的差分传输线垂直相对的部分为一挖空区域，所述两条差分传输线在水平方向上有一错位间距。所述软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。所述软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Description

软性电路板
技术领域
本发明涉及一种软性电路板，特别涉及一种可传输高速差分信号的软性电路板。
背景技术
软性电路板是用柔性的绝缘基材制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如软性电路板厚度较薄，可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用软性电路板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠性方向发展的需要。因此，软性电路板在航天、军事、移动通讯、手提电脑、计算机外设、PDA、数码相机等领域或产品上得到了广泛的应用。
因为软性电路板厚度极薄，软性电路板上的传输线的阻抗偏低，因为传输高速信号要求较高的传输线阻抗，在软性电路板上，即使一般制程可达到的最细传输线宽度，例如4密尔(1密尔＝0.0254毫米)，也难以达到高速信号传输线阻抗的要求。
参考图1，现有技术提高传输线阻抗的方法，是将软性电路板50的接地层铜箔切割成网格状。但如果在信号层上通过布设差分对51传输差分信号时，会因为差分传输线52和差分传输线54对应的接地层铜箔网格排布不同，导致共模噪音的产生，这也是一般软性电路板无法传输高速差分信号的原因。
发明内容
鉴于上述内容，有必要提供一种可传输高速差分信号的软性电路板。
一种软性电路板，包括一信号层、一接地层及一差分对，所述信号层与接地层之间填充一层绝缘介质，所述差分对包括两条差分传输线，其中一条差分传输线布设于所述信号层中，另一条差分传输线布设于所述接地层中，所述接地层中与所述信号层中的差分传输线垂直相对的部分为一挖空区域，所述两条差分传输线在水平方向上有一错位间距。
所述软性电路板将差分对的两条差分传输线分别布设在信号层及接地层中，并将信号层中差分传输线竖直对应的接地层铜箔部分挖空，避免信号层中的差分传输线与接地层的间距太近所导致的传输线阻抗偏低问题的产生，所述接地层中的差分传输线与所述信号层中的差分传输线相隔一错位间距设置。所述软性电路板可传输高速信号，并可消除现有技术中网格化接地层所衍生的共模噪音问题。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有技术软性电路板的结构示意图。
图2为本发明软性电路板的较佳实施方式的结构示意图。
具体实施方式
请参照图2，本发明软性电路板的较佳实施方式包括一信号层10及一接地层30，在信号层10及接地层30之间填充一层绝缘介质20。一差分对11包括两条差分传输线12及14，其中差分传输线12布设于信号层10中，差分传输线14布设于接地层30中。所述差分传输线12下方竖直对应的接地层30的部分作挖空处理，以避免差分传输线12与接地层30的间距太近所导致的传输线阻抗偏低问题的产生。由于差分传输线12下方对应的接地层30的部分为挖空区域，所以信号层10中布设的差分传输线12与接地层30中布设的差分传输线14之间在水平方向会产生一错位间距d，所述错位间距d根据差分对11传输的信号不同而不同，所述间距d可根据差分对11传输不同信号时的阻抗要求，考虑软性电路板中每条差分传输线12及14的线宽，经由仿真软件仿真后确定。如每条差分传输线12及14的线宽为4密尔，当所述差分对11传输IEEE 1394信号时，所述错位间距d的宽度约为4密尔，当所述差分对11传输PCI-EXPRESS信号时，所述错位间距d的宽度约为2.5密尔，当所述差分对11传输USB信号时，所述错位间距d的宽度约为1.5密尔。
所述软性电路板将差分对11的两条差分传输线12及14分别布设在信号层10及接地层30中，并将差分传输线12竖直对应的接地层铜箔部分挖空，避免上层的差分传输线12与接地层30的间距太近所导致的传输线阻抗偏低问题的产生，并通过仿真软体仿真后设定所述错位间距d，以使差分传输线12及14的阻抗满足所传输信号的要求。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Claims (5)

1.一种软性电路板，包括一信号层、一接地层及一差分对，所述信号层与接地层之间填充一层绝缘介质，所述差分对包括两条差分传输线，其特征在于：其中一条差分传输线布设于所述信号层中，另一条差分传输线布设于所述接地层中，所述接地层中与所述信号层中的差分传输线垂直相对的部分为一挖空区域，所述两条差分传输线在水平方向上有一错位间距。
2.如权利要求1所述的软性电路板，其特征在于：当所述差分对传输IEEE1394信号时，每条差分传输线的线宽为4密尔，所述错位间距的宽度为4密尔。
3.如权利要求1所述的软性电路板，其特征在于：所述差分对传输PCI-EXPRESS信号时，每条差分传输线的线宽为4密尔，所述错位间距的宽度为2.5密尔。
4.如权利要求1所述的软性电路板，其特征在于：当所述差分对传输USB信号时，每条差分传输线的线宽为4密尔，所述错位间距的宽度为1.5密尔。
5.如权利要求1所述的软性电路板，其特征在于：所述挖空区域为铜箔挖空区域。
CN2007102018194A 2007-09-21 2007-09-21 软性电路板 Expired - Fee Related CN101394707B (zh)

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CN2007102018194A CN101394707B (zh) 2007-09-21 2007-09-21 软性电路板
US11/951,290 US7781680B2 (en) 2007-09-21 2007-12-05 Flexible printed circuit board

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CN2007102018194A CN101394707B (zh) 2007-09-21 2007-09-21 软性电路板

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562939B (zh) * 2008-04-18 2011-05-04 鸿富锦精密工业（深圳）有限公司 软性电路板
KR101102337B1 (ko) * 2008-05-28 2012-01-03 엘지전자 주식회사 연성필름
CN101990222A (zh) * 2009-08-07 2011-03-23 鸿富锦精密工业（深圳）有限公司 信号传输装置
TWI445462B (zh) * 2010-04-20 2014-07-11 Hon Hai Prec Ind Co Ltd 軟性電路板
CN102300395A (zh) * 2010-06-23 2011-12-28 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN107889344A (zh) * 2012-08-15 2018-04-06 深圳迈辽技术转移中心有限公司 软性电路板装置
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판
KR102553177B1 (ko) 2016-06-13 2023-07-10 삼성전자주식회사 고주파 전송회로를 포함하는 전자 장치

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US6373740B1 (en) * 1999-07-30 2002-04-16 Micron Technology, Inc. Transmission lines for CMOS integrated circuits
US6420778B1 (en) * 2001-06-01 2002-07-16 Aralight, Inc. Differential electrical transmission line structures employing crosstalk compensation and related methods
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JP4195731B2 (ja) * 1996-07-25 2008-12-10 富士通株式会社 多層プリント板及びこれを利用した高周波回路装置
US6384341B1 (en) * 2001-04-30 2002-05-07 Tyco Electronics Corporation Differential connector footprint for a multi-layer circuit board

Patent Citations (3)

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US6373740B1 (en) * 1999-07-30 2002-04-16 Micron Technology, Inc. Transmission lines for CMOS integrated circuits
US6420778B1 (en) * 2001-06-01 2002-07-16 Aralight, Inc. Differential electrical transmission line structures employing crosstalk compensation and related methods
CN1753597A (zh) * 2004-09-22 2006-03-29 鸿富锦精密工业（深圳）有限公司 可实现阻抗控制的两层印制电路板

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CN101394707A (zh) 2009-03-25
US20090078452A1 (en) 2009-03-26

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