AU2012201295B2 - Multi plate board embedded capacitor and methods for fabricating the same - Google Patents

Multi plate board embedded capacitor and methods for fabricating the same Download PDF

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Publication number
AU2012201295B2
AU2012201295B2 AU2012201295A AU2012201295A AU2012201295B2 AU 2012201295 B2 AU2012201295 B2 AU 2012201295B2 AU 2012201295 A AU2012201295 A AU 2012201295A AU 2012201295 A AU2012201295 A AU 2012201295A AU 2012201295 B2 AU2012201295 B2 AU 2012201295B2
Authority
AU
Australia
Prior art keywords
pwb
conductive
conductive plates
plates
normal axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2012201295A
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English (en)
Other versions
AU2012201295A1 (en
Inventor
Daniel Zahi Abawi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of AU2012201295A1 publication Critical patent/AU2012201295A1/en
Application granted granted Critical
Publication of AU2012201295B2 publication Critical patent/AU2012201295B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AU2012201295A 2011-03-04 2012-03-02 Multi plate board embedded capacitor and methods for fabricating the same Active AU2012201295B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/040,841 US8717773B2 (en) 2011-03-04 2011-03-04 Multi-plate board embedded capacitor and methods for fabricating the same
US13/040,841 2011-03-04

Publications (2)

Publication Number Publication Date
AU2012201295A1 AU2012201295A1 (en) 2012-09-20
AU2012201295B2 true AU2012201295B2 (en) 2015-05-14

Family

ID=45841250

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2012201295A Active AU2012201295B2 (en) 2011-03-04 2012-03-02 Multi plate board embedded capacitor and methods for fabricating the same

Country Status (7)

Country Link
US (1) US8717773B2 (enExample)
EP (1) EP2496059B1 (enExample)
JP (1) JP2012191203A (enExample)
CN (1) CN102711374A (enExample)
AU (1) AU2012201295B2 (enExample)
CA (1) CA2769923C (enExample)
IN (1) IN2012DE00544A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963615B1 (en) 2013-01-31 2015-02-24 General Electric Company Automatic bipolar signal switching
US20220104344A1 (en) * 2019-01-18 2022-03-31 Nano Dimension Technologies Ltd. Integrated printed circuit boards and methods of fabrication
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
CN112435984B (zh) * 2020-11-24 2022-09-06 复旦大学 半导体衬底、制备方法以及电子元器件
CN113503939A (zh) * 2021-08-23 2021-10-15 石河子大学 非接触式种箱料位实时监测系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
EP1260998A1 (en) * 2000-11-16 2002-11-27 TDK Corporation Electronic component-use substrate and electronic component
EP1695947A1 (en) * 2005-01-26 2006-08-30 E.I.Du pont de nemours and company Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board
WO2011047012A2 (en) * 2009-10-13 2011-04-21 National Semiconductor Corporation Integrated driver system architecture for light emitting diodes (leds)

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US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
JPH0479203A (ja) * 1990-07-20 1992-03-12 Tdk Corp Ｌｃ共振器内蔵の多層基板
JPH05205966A (ja) * 1992-01-24 1993-08-13 Murata Mfg Co Ltd 積層コンデンサ
US5643804A (en) * 1993-05-21 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a hybrid integrated circuit component having a laminated body
JP3651925B2 (ja) * 1994-04-27 2005-05-25 京セラ株式会社 積層コンデンサ基板の製造方法
JPH0878804A (ja) * 1994-09-07 1996-03-22 Nikon Corp 配線基板
US5774326A (en) * 1995-08-25 1998-06-30 General Electric Company Multilayer capacitors using amorphous hydrogenated carbon
US6344951B1 (en) * 1998-12-14 2002-02-05 Alps Electric Co., Ltd. Substrate having magnetoresistive elements and monitor element capable of preventing a short circuit
US6252760B1 (en) * 1999-05-26 2001-06-26 Sun Microsystems, Inc. Discrete silicon capacitor
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
JP4945842B2 (ja) * 2000-04-05 2012-06-06 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
JP2001237144A (ja) * 2001-01-25 2001-08-31 Matsushita Electric Ind Co Ltd レーザートリマブルコンデンサおよびその製造方法
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KR100793916B1 (ko) 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1260998A1 (en) * 2000-11-16 2002-11-27 TDK Corporation Electronic component-use substrate and electronic component
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
EP1695947A1 (en) * 2005-01-26 2006-08-30 E.I.Du pont de nemours and company Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board
WO2011047012A2 (en) * 2009-10-13 2011-04-21 National Semiconductor Corporation Integrated driver system architecture for light emitting diodes (leds)

Also Published As

Publication number Publication date
CA2769923A1 (en) 2012-09-04
IN2012DE00544A (enExample) 2015-06-05
JP2012191203A (ja) 2012-10-04
EP2496059B1 (en) 2025-05-21
US8717773B2 (en) 2014-05-06
AU2012201295A1 (en) 2012-09-20
EP2496059A3 (en) 2013-10-09
CA2769923C (en) 2020-01-07
US20120224333A1 (en) 2012-09-06
EP2496059A2 (en) 2012-09-05
CN102711374A (zh) 2012-10-03

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FGA Letters patent sealed or granted (standard patent)