CN102711374A - 多盘板嵌入式电容器及其制造方法 - Google Patents

多盘板嵌入式电容器及其制造方法 Download PDF

Info

Publication number
CN102711374A
CN102711374A CN2012101543665A CN201210154366A CN102711374A CN 102711374 A CN102711374 A CN 102711374A CN 2012101543665 A CN2012101543665 A CN 2012101543665A CN 201210154366 A CN201210154366 A CN 201210154366A CN 102711374 A CN102711374 A CN 102711374A
Authority
CN
China
Prior art keywords
pwb
conductive
conductive plate
vertical axis
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101543665A
Other languages
English (en)
Chinese (zh)
Inventor
D·Z·阿巴维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN102711374A publication Critical patent/CN102711374A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN2012101543665A 2011-03-04 2012-03-02 多盘板嵌入式电容器及其制造方法 Pending CN102711374A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/040,841 US8717773B2 (en) 2011-03-04 2011-03-04 Multi-plate board embedded capacitor and methods for fabricating the same
US13/040,841 2011-03-04

Publications (1)

Publication Number Publication Date
CN102711374A true CN102711374A (zh) 2012-10-03

Family

ID=45841250

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101543665A Pending CN102711374A (zh) 2011-03-04 2012-03-02 多盘板嵌入式电容器及其制造方法

Country Status (7)

Country Link
US (1) US8717773B2 (enExample)
EP (1) EP2496059B1 (enExample)
JP (1) JP2012191203A (enExample)
CN (1) CN102711374A (enExample)
AU (1) AU2012201295B2 (enExample)
CA (1) CA2769923C (enExample)
IN (1) IN2012DE00544A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963615B1 (en) 2013-01-31 2015-02-24 General Electric Company Automatic bipolar signal switching
US20220104344A1 (en) * 2019-01-18 2022-03-31 Nano Dimension Technologies Ltd. Integrated printed circuit boards and methods of fabrication
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
CN112435984B (zh) * 2020-11-24 2022-09-06 复旦大学 半导体衬底、制备方法以及电子元器件
CN113503939A (zh) * 2021-08-23 2021-10-15 石河子大学 非接触式种箱料位实时监测系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
CN1401127A (zh) * 2000-11-16 2003-03-05 Tdk株式会社 电子部件用基板和电子部件
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224685A (ja) * 1985-07-24 1987-02-02 臼井　一紀 コンデンサ組込み配線基板
US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
JPH0479203A (ja) * 1990-07-20 1992-03-12 Tdk Corp Ｌｃ共振器内蔵の多層基板
JPH05205966A (ja) * 1992-01-24 1993-08-13 Murata Mfg Co Ltd 積層コンデンサ
US5643804A (en) * 1993-05-21 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a hybrid integrated circuit component having a laminated body
JP3651925B2 (ja) * 1994-04-27 2005-05-25 京セラ株式会社 積層コンデンサ基板の製造方法
JPH0878804A (ja) * 1994-09-07 1996-03-22 Nikon Corp 配線基板
US5774326A (en) * 1995-08-25 1998-06-30 General Electric Company Multilayer capacitors using amorphous hydrogenated carbon
US6344951B1 (en) * 1998-12-14 2002-02-05 Alps Electric Co., Ltd. Substrate having magnetoresistive elements and monitor element capable of preventing a short circuit
US6252760B1 (en) * 1999-05-26 2001-06-26 Sun Microsystems, Inc. Discrete silicon capacitor
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
JP4945842B2 (ja) * 2000-04-05 2012-06-06 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
JP2001237144A (ja) * 2001-01-25 2001-08-31 Matsushita Electric Ind Co Ltd レーザートリマブルコンデンサおよびその製造方法
TW586205B (en) * 2001-06-26 2004-05-01 Intel Corp Electronic assembly with vertically connected capacitors and manufacturing method
KR100455890B1 (ko) 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
JP2004235374A (ja) * 2003-01-29 2004-08-19 Kyocera Corp コンデンサ内蔵基板及びチップ状コンデンサ
US7327554B2 (en) * 2003-03-19 2008-02-05 Ngk Spark Plug Co., Ltd. Assembly of semiconductor device, interposer and substrate
JP4377617B2 (ja) * 2003-06-20 2009-12-02 日本特殊陶業株式会社 コンデンサ、コンデンサ付き半導体素子、コンデンサ付き配線基板、および、半導体素子とコンデンサと配線基板とを備える電子ユニット
TW200404706A (en) * 2003-12-05 2004-04-01 Chung Shan Inst Of Science Composite material structure for rotary-wings and its producing method
US20060162844A1 (en) 2005-01-26 2006-07-27 Needes Christopher R Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US20070002551A1 (en) * 2005-07-01 2007-01-04 Hon Hai Precision Industry Co., Ltd. Printed circuit board assembly
JP5089880B2 (ja) * 2005-11-30 2012-12-05 日本特殊陶業株式会社 配線基板内蔵用キャパシタ、キャパシタ内蔵配線基板及びその製造方法
KR100793916B1 (ko) 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
US20070290321A1 (en) 2006-06-14 2007-12-20 Honeywell International Inc. Die stack capacitors, assemblies and methods
JP4544241B2 (ja) * 2006-11-23 2010-09-15 株式会社デンソー 放電灯制御装置
JP2009032741A (ja) * 2007-07-24 2009-02-12 Nec Saitama Ltd 回路基板、回路基板装置、携帯電話装置および基板接続方法
TWI397933B (zh) * 2008-02-22 2013-06-01 Ind Tech Res Inst 電容器模組
JP2010052970A (ja) * 2008-08-27 2010-03-11 Murata Mfg Co Ltd セラミック組成物、セラミックグリーンシート、及びセラミック電子部品
US20100244585A1 (en) * 2009-03-26 2010-09-30 General Electric Company High-temperature capacitors and methods of making the same
WO2011047012A2 (en) * 2009-10-13 2011-04-21 National Semiconductor Corporation Integrated driver system architecture for light emitting diodes (leds)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1401127A (zh) * 2000-11-16 2003-03-05 Tdk株式会社 电子部件用基板和电子部件
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board

Also Published As

Publication number Publication date
CA2769923A1 (en) 2012-09-04
IN2012DE00544A (enExample) 2015-06-05
JP2012191203A (ja) 2012-10-04
EP2496059B1 (en) 2025-05-21
US8717773B2 (en) 2014-05-06
AU2012201295A1 (en) 2012-09-20
EP2496059A3 (en) 2013-10-09
CA2769923C (en) 2020-01-07
AU2012201295B2 (en) 2015-05-14
US20120224333A1 (en) 2012-09-06
EP2496059A2 (en) 2012-09-05

Similar Documents

Publication Publication Date Title
US9236186B2 (en) Multi-layered ceramic capacitor
US7733207B2 (en) Vertically formed inductor and electronic device having the same
US6819543B2 (en) Multilayer capacitor with multiple plates per layer
CN104112589B (zh) 多层陶瓷电容器及其用于安装的板
CN102065632B (zh) 电磁带隙结构和包括该电磁带隙结构的印刷电路板
KR102494324B1 (ko) 적층형 커패시터 및 그 실장 기판
CN102956354A (zh) 上面具有多层陶瓷电容器的电路板的安装结构
CN107644735A (zh) 电容器和具有该电容器的板
CN102711374A (zh) 多盘板嵌入式电容器及其制造方法
CN103456494A (zh) 片式层压电子元件、用于安装该元件的板及其封装单元
CN101211693A (zh) 电容器和嵌入该电容器的多层板
US20150022948A1 (en) Capacitor structure
CN109767913A (zh) 多层电容器
CN104810152A (zh) 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板
CN104810149A (zh) 多层陶瓷电容器及其上安装有该多层陶瓷电容器的板
US20140131084A1 (en) Capacitor embedded substrate
CN104584153A (zh) 平面传送器
US20060261394A1 (en) Capacitor structure
KR102192553B1 (ko) 집적 회로, 휴대폰 및 디스플레이 장치
KR100769536B1 (ko) 공통 커플링 영역을 갖는 매립식 커패시터 장치
US6600209B1 (en) Mesh capacitor structure in an integrated circuit
KR20140036426A (ko) 캐패시터 내장형 안테나
TWI580057B (zh) 半導體電容
CN103310990A (zh) 固态电解电容基板模块及包括其的电路板
CN219303484U (zh) 一种电容器及电子设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121003