EP2670212B1 - A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator - Google Patents

A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator Download PDF

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Publication number
EP2670212B1
EP2670212B1 EP12170390.4A EP12170390A EP2670212B1 EP 2670212 B1 EP2670212 B1 EP 2670212B1 EP 12170390 A EP12170390 A EP 12170390A EP 2670212 B1 EP2670212 B1 EP 2670212B1
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EP
European Patent Office
Prior art keywords
housing
induction heating
capacitors
heating generator
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12170390.4A
Other languages
German (de)
French (fr)
Other versions
EP2670212A1 (en
Inventor
Laurent Jeanneteau
Thibaut Rigolle
Alex Viroli
Andrea Fattorini
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Electrolux Home Products Corp NV
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Electrolux Home Products Corp NV
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Filing date
Publication date
Application filed by Electrolux Home Products Corp NV filed Critical Electrolux Home Products Corp NV
Priority to EP12170390.4A priority Critical patent/EP2670212B1/en
Priority to US14/396,482 priority patent/US9781775B2/en
Priority to CN201380027645.8A priority patent/CN104641724B/en
Priority to AU2013269817A priority patent/AU2013269817B2/en
Priority to PCT/EP2013/060412 priority patent/WO2013178505A1/en
Publication of EP2670212A1 publication Critical patent/EP2670212A1/en
Application granted granted Critical
Publication of EP2670212B1 publication Critical patent/EP2670212B1/en
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/04—Sources of current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/4815—Resonant converters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Definitions

  • the present invention relates to a half bridge induction heating generator according to the preamble of claim 1. Further, the present invention relates to a capacitor assembly according to the preamble of claim 10.
  • FIG 2 illustrates a half bridge induction heating generator according to the prior art.
  • Said half bridge induction heating generator comprises two transistors Q1 and Q2, two diodes D1 and D2, an induction coil L and five capacitors C1, C2, C3, C4 and C5.
  • the first capacitors C1 acts as a link filter for the direct current.
  • the second and third capacitors C2 and C3 are resonant capacitors.
  • the resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator.
  • the fourth and fifth capacitors C4 and C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • the induction heating generator includes a relative large amount of capacitors C1, C2, C3, C4 and C5. Further, the capacitances of the capacitors C1, C2, C3, C4 and C5 are also relative high.
  • the capacitors C1, C2, C3, C4 and C5 have to be placed on a printed circuit board of the converter in a careful way. The stray inductance has to be minimized.
  • the power track should be able to carry on the large amount of switching current.
  • a space on the printed circuit board should be provided for other components of the induction heating generator.
  • High power terminals should be provided for the supply voltage and the induction coil L.
  • EP 1 255 421 A2 discloses a half bridge induction heating generator similar to that half bridge induction heating generator shown in FIG 2 .
  • US 6, 346, 743 B1 discloses an embedded capacitor assembly in a package having integrated circuits.
  • the package includes a core layer, a metal layer on said core layer and a connection layer on said metal layer.
  • Each embedded capacitor has plural pairs of first and second electrodes.
  • the core layer has plural sets of first and second vias dispersed over and connected to the plural pairs of electrodes.
  • the metal layer includes a first portion having one or more metal strips and a second portion electrically isolated from each strip. Each metal strip overlies the first electrode of a distinct pair of electrodes and the second electrode of an adjacent, succeeding pair of electrodes.
  • the metal strip effects a mutual electric connection between the first electrode of the distinct pair and the second electrode of the adjacent, succeeding pair through the first and second vias.
  • the connection layer has third vias to provide electrical connections.
  • the capacitors are provided as bypass capacitors in the package assembly for integrated circuits.
  • US 3, 706, 980 discloses a radio frequency system for measuring the level of materials.
  • the system includes a measuring electrode, a guard shield and a conductive member.
  • the guard shield is interposed between the measuring electrode and the conductive member.
  • the variable capacitance between the measuring electrode and the conductive member is a measurement of the level of the material.
  • the variable capacitance is an integrated part of a capacitance bridge.
  • a capacitor body includes a plurality of dielectric layers.
  • a plurality of pairs of first and second inner electrodes are formed on the plurality of dielectric layers, wherein one electrode of one pair of inner electrodes faces the other electrode of said one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween.
  • At least one first outer terminal and a plurality of second outer terminals are formed on at least one surface of a top surface and a bottom surface of the capacitor body.
  • the object of the present invention is achieved by the half bridge induction heating generator according to claim 1.
  • the four capacitors of the bridge circuit and the further capacitor are arranged inside a common housing, wherein said housing and the capacitors form a capacitor assembly, which is a single component and mounted or mountable on and electrically connected or connectable to a printed circuit board, wherein the power terminal is arranged at the outside of the housing of the capacitor assembly, and wherein the power terminal is connected or connectable to a corresponding wiring counterpart.
  • the main idea of the present invention is that the capacitors are arranged inside the common housing and form the capacitor assembly.
  • the capacitor assembly with the housing and the capacitors reduces the components to be installed on the printed circuit board. This result in a faster production process and lower production costs. Additional components may be arranged inside the capacitor assembly.
  • the capacitor assembly allows a better performance of the power management of the induction heating generator.
  • the capacitor assembly saves space on the printed circuit board.
  • the housing is filled with a hardening liquid, so that the capacitor assembly form a robust block. This contributes to the stability of the housing and the capacitor assembly. Further, no heat sinks occur inside the capacitor assembly.
  • the arrangement of the power terminal at the outside of the housing of the capacitor assembly, wherein the power terminal is connected or connectable to a corresponding wiring counterpart, is particularly advantageous, if the housing is mounted on an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
  • IMS insulated metal substrate
  • SMD surface mount device
  • the housing comprises a plurality of terminals corresponding with the electrodes of the capacitors, wherein the electric connections of the capacitors are performed or performable on the printed circuit board.
  • the space between the housing and the printed circuit board is provided for further electric and/or electronic components.
  • This constellation saves space on the printed circuit board.
  • the induction heating generator includes at least two diodes at all, wherein one diode is connected in parallel to one of the both semiconductor switches in each case.
  • the housing is mounted or mountable on and electrically connected or connectable to the printed circuit board with through-hole-technology.
  • the housing is mounted or mountable on and electrically connected or connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
  • IMS insulated metal substrate
  • SMD surface mount device
  • the power terminal is preferably arranged at the housing of the capacitor assembly.
  • a first input terminal is connected to a control input of the one semiconductor switch, and a second input terminal is connected to a control input of the other semiconductor switch.
  • the semiconductor switches are bipolar transistors.
  • the first input terminal and the second input terminal may be connected to the base electrodes of the bipolar transistors in each case.
  • the semiconductor switches are field effect transistors, wherein the first input terminal and the second input terminal may be connected to the gate electrodes of the field effect transistors in each case.
  • the object of the present invention is further achieved by the capacitor assembly according to claim 10.
  • the four capacitors of the bridge circuit and the further capacitor are arranged inside a common housing, wherein said housing and the capacitors form a capacitor assembly, which is a single component and mountable on and electrically connectable to a printed circuit board, wherein the power terminal is arranged at the housing of the capacitor assembly, wherein the power terminal is provided for the connection to a corresponding wiring counterpart.
  • the housing is filled with a hardening liquid, so that the capacitor assembly form a robust block. This contributes to the stability of the housing and the capacitor assembly. Further, no heat sinks occur inside the capacitor assembly.
  • the housing is mountable on and electrically connectable to a printed circuit board with through-hole-technology.
  • the housing is mountable on and electrically connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
  • IMS insulated metal substrate
  • SMD surface mount device
  • the power terminal is preferably arranged at the housing of the capacitor assembly.
  • FIG 1 illustrates a circuit diagram of a half bridge induction heating generator according to a preferred embodiment of the present invention.
  • the half bridge induction heating generator comprises a first transistor Q1, a second transistor Q2, a first diode D1, a second diode D2, an induction coil L and five capacitors C1, C2, C3, C4 and C5.
  • the first transistor Q1 and the second transistor Q2 are connected in series.
  • the first diode D1 is connected in parallel to the first transistor Q1.
  • the second diode D2 is connected in parallel to the second transistor Q2.
  • the second capacitor C2 and the third capacitor C3 are connected in series and form a first capacitor series.
  • the fourth capacitor C4 and the fifth capacitor C5 are connected in series and form a second capacitor series.
  • the first capacitor series, the second capacitor series and the first capacitor C1 are connected in parallel and installed inside a common housing 20.
  • Said housing 20 is formed as a single component installed or installable on the printed board.
  • the housing 20 and the capacitors C1, C2, C3, C4 and C5 inside said housing 20 form a capacitor assembly.
  • the series of the first transistor Q1 and the second transistor Q2 is connected in parallel to the first capacitor series, the second capacitor series and the first capacitor C1.
  • This parallel arrangement is interconnected between a power terminal 10 and a ground 12.
  • the power terminal 10 is provided for the supply of a direct current voltage.
  • the connecting point of the first transistor Q1 and the second transistor Q2 is connected to the connecting point of the fourth capacitor C4 and the fifth capacitor C5.
  • the fourth capacitor C4 is connected in parallel to the first transistor Q1 and the first diode D1.
  • the fifth capacitor C5 is connected in parallel to the second transistor Q2 and the second diode D2.
  • the induction coil L is connected to the connecting point of the first transistor Q1 and the second transistor Q2 on the one end. On the other end, the induction coil L is connected to the connecting point of the second capacitor C2 and the third capacitor C3.
  • a first input terminal 14 is connected to the base electrode of the first transistor Q1.
  • a second input terminal 16 is connected to the base electrode of the second transistor Q2.
  • the first input terminal 14 and the second input terminal 16 are provided for the supply of rectangular signals.
  • the first capacitor C1 acts as a link filter for the direct current supplied to the power terminal 10.
  • the second capacitor C2 and the third capacitor C3 are resonant capacitors.
  • the resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator.
  • the fourth capacitor C4 and the fifth capacitor C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • the capacitor assembly i.e. the housing 20 including the capacitors C1, C2, C3, C4 and C5 may be provided for a printed circuit board with through-hole-technology as well as for an insulated metal substrate (IMS) printed circuit board.
  • IMS insulated metal substrate
  • the power terminal 10 may be formed according to the standard "RAST5" in both cases. The power terminal 10 is provided for the connection to a corresponding wiring counterpart.
  • the capacitor assembly is provided for the printed circuit board with through-hole-technology, then the capacitor assembly comprises a number of pins penetrating through the printed circuit board. Said pins are connectable or connected by solder points on the printed circuit board.
  • the capacitor assembly is provided for the IMS printed circuit board, then the capacitor assembly is fastened on the IMS printed circuit board by the surface mount device (SMD) technology.
  • the capacitor assembly comprises a number of solder joints formed as L-shaped pins. Said solder joints are fastened on the IMS printed circuit board by the SMD technology in each case.
  • the power terminal 10 is preferably a part of the capacitor assembly.
  • the occurrent force between the power terminal 10 and the IMS printed circuit board is distributed to the solder joints.
  • the capacitor assembly allows an attachment of the power terminal 10 with a sufficient stability on the IMS printed circuit board.
  • the capacitor assembly with the housing 20 and the capacitors C1, C2, C3, C4 and C5 reduces the components to be installed on the printed circuit board. This result in a faster production process and lower production costs. Additional components may be arranged inside the capacitor assembly.
  • the capacitor assembly allows a better performance of the power management of the induction heating generator. At last, the capacitor assembly saves space on the printed circuit board.
  • FIG 2 illustrates a circuit diagram of the half bridge induction heating generator according to the prior art.
  • the conventional half bridge induction heating generator comprises the two transistors Q1 and Q2, the two diodes D1 and D2, the induction coil L and the five capacitors C1, C2, C3, C4 and C5.
  • the first capacitor C1 acts as the link filter for the direct current.
  • the second and third capacitors C2 and C3 are the resonant capacitors.
  • the resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator.
  • the fourth and fifth capacitors C4 and C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • This conventional half bridge induction heating generator is equal in view of the electric connections with the half bridge induction heating generator according to the preferred embodiment of the present invention.
  • the capacitors C1, C2, C3, C4 and C5 of the conventional half bridge induction heating generator are formed as separate components in each case.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Induction Heating (AREA)
  • Inverter Devices (AREA)
  • Control Of Resistance Heating (AREA)

Description

  • The present invention relates to a half bridge induction heating generator according to the preamble of claim 1. Further, the present invention relates to a capacitor assembly according to the preamble of claim 10.
  • A half bridge induction heating generator is used in an induction heating converter. FIG 2 illustrates a half bridge induction heating generator according to the prior art. Said half bridge induction heating generator comprises two transistors Q1 and Q2, two diodes D1 and D2, an induction coil L and five capacitors C1, C2, C3, C4 and C5. The first capacitors C1 acts as a link filter for the direct current. The second and third capacitors C2 and C3 are resonant capacitors. The resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator. The fourth and fifth capacitors C4 and C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • The induction heating generator includes a relative large amount of capacitors C1, C2, C3, C4 and C5. Further, the capacitances of the capacitors C1, C2, C3, C4 and C5 are also relative high. The capacitors C1, C2, C3, C4 and C5 have to be placed on a printed circuit board of the converter in a careful way. The stray inductance has to be minimized. The power track should be able to carry on the large amount of switching current. A space on the printed circuit board should be provided for other components of the induction heating generator. High power terminals should be provided for the supply voltage and the induction coil L.
  • EP 1 255 421 A2 discloses a half bridge induction heating generator similar to that half bridge induction heating generator shown in FIG 2.
  • US 6, 346, 743 B1 discloses an embedded capacitor assembly in a package having integrated circuits. The package includes a core layer, a metal layer on said core layer and a connection layer on said metal layer. Each embedded capacitor has plural pairs of first and second electrodes. The core layer has plural sets of first and second vias dispersed over and connected to the plural pairs of electrodes. The metal layer includes a first portion having one or more metal strips and a second portion electrically isolated from each strip. Each metal strip overlies the first electrode of a distinct pair of electrodes and the second electrode of an adjacent, succeeding pair of electrodes. The metal strip effects a mutual electric connection between the first electrode of the distinct pair and the second electrode of the adjacent, succeeding pair through the first and second vias. The connection layer has third vias to provide electrical connections. The capacitors are provided as bypass capacitors in the package assembly for integrated circuits.
  • US 3, 706, 980 discloses a radio frequency system for measuring the level of materials. The system includes a measuring electrode, a guard shield and a conductive member. The guard shield is interposed between the measuring electrode and the conductive member. The variable capacitance between the measuring electrode and the conductive member is a measurement of the level of the material. The variable capacitance is an integrated part of a capacitance bridge.
  • US 2006/0092595 A1 discloses a multi-layered chip capacitor array. A capacitor body includes a plurality of dielectric layers. A plurality of pairs of first and second inner electrodes are formed on the plurality of dielectric layers, wherein one electrode of one pair of inner electrodes faces the other electrode of said one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween. At least one first outer terminal and a plurality of second outer terminals are formed on at least one surface of a top surface and a bottom surface of the capacitor body.
  • It is an object of the present invention to provide a half bridge induction heating generator, which satisfies the above conditions by low complexity.
  • The object of the present invention is achieved by the half bridge induction heating generator according to claim 1.
  • According to the present invention the four capacitors of the bridge circuit and the further capacitor are arranged inside a common housing, wherein said housing and the capacitors form a capacitor assembly, which is a single component and mounted or mountable on and electrically connected or connectable to a printed circuit board, wherein the power terminal is arranged at the outside of the housing of the capacitor assembly, and wherein the power terminal is connected or connectable to a corresponding wiring counterpart.
  • The main idea of the present invention is that the capacitors are arranged inside the common housing and form the capacitor assembly. The capacitor assembly with the housing and the capacitors reduces the components to be installed on the printed circuit board. This result in a faster production process and lower production costs. Additional components may be arranged inside the capacitor assembly. The capacitor assembly allows a better performance of the power management of the induction heating generator. The capacitor assembly saves space on the printed circuit board.
  • In particular, the housing is filled with a hardening liquid, so that the capacitor assembly form a robust block. This contributes to the stability of the housing and the capacitor assembly. Further, no heat sinks occur inside the capacitor assembly.
  • The arrangement of the power terminal at the outside of the housing of the capacitor assembly, wherein the power terminal is connected or connectable to a corresponding wiring counterpart, is particularly advantageous, if the housing is mounted on an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
  • Further, the housing comprises a plurality of terminals corresponding with the electrodes of the capacitors, wherein the electric connections of the capacitors are performed or performable on the printed circuit board.
  • For example, the space between the housing and the printed circuit board is provided for further electric and/or electronic components. This constellation saves space on the printed circuit board.
  • Additionally, further electric and/or electronic components are arranged inside the housing.
  • Further, at least one diode is connected in parallel to each of the both semiconductor switches. Thus, the induction heating generator includes at least two diodes at all, wherein one diode is connected in parallel to one of the both semiconductor switches in each case.
  • For example, the housing is mounted or mountable on and electrically connected or connectable to the printed circuit board with through-hole-technology.
  • Alternatively, the housing is mounted or mountable on and electrically connected or connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology. In this case, the power terminal is preferably arranged at the housing of the capacitor assembly.
  • Preferably, a first input terminal is connected to a control input of the one semiconductor switch, and a second input terminal is connected to a control input of the other semiconductor switch.
  • For example, the semiconductor switches are bipolar transistors. In this case, the first input terminal and the second input terminal may be connected to the base electrodes of the bipolar transistors in each case.
  • Alternatively, the semiconductor switches are field effect transistors, wherein the first input terminal and the second input terminal may be connected to the gate electrodes of the field effect transistors in each case.
  • The object of the present invention is further achieved by the capacitor assembly according to claim 10.
  • According to the present invention the four capacitors of the bridge circuit and the further capacitor are arranged inside a common housing, wherein said housing and the capacitors form a capacitor assembly, which is a single component and mountable on and electrically connectable to a printed circuit board, wherein the power terminal is arranged at the housing of the capacitor assembly, wherein the power terminal is provided for the connection to a corresponding wiring counterpart.
  • Preferably, the housing is filled with a hardening liquid, so that the capacitor assembly form a robust block. This contributes to the stability of the housing and the capacitor assembly. Further, no heat sinks occur inside the capacitor assembly.
  • For example, the housing is mountable on and electrically connectable to a printed circuit board with through-hole-technology.
  • Alternatively, the housing is mountable on and electrically connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
    In this case, the power terminal is preferably arranged at the housing of the capacitor assembly.
  • Novel and inventive features of the present invention are set forth in the appended claims.
  • The present invention will be described in further detail with reference to the drawings, in which
    • FIG 1 illustrates a circuit diagram of a half bridge induction heating generator according to a preferred embodiment of the present invention, and
    • FIG 2 illustrates a circuit diagram of a half bridge induction heating generator according to the prior art.
  • FIG 1 illustrates a circuit diagram of a half bridge induction heating generator according to a preferred embodiment of the present invention.
  • The half bridge induction heating generator comprises a first transistor Q1, a second transistor Q2, a first diode D1, a second diode D2, an induction coil L and five capacitors C1, C2, C3, C4 and C5.
  • The first transistor Q1 and the second transistor Q2 are connected in series. The first diode D1 is connected in parallel to the first transistor Q1. In a similar way, the second diode D2 is connected in parallel to the second transistor Q2.
  • The second capacitor C2 and the third capacitor C3 are connected in series and form a first capacitor series. The fourth capacitor C4 and the fifth capacitor C5 are connected in series and form a second capacitor series. The first capacitor series, the second capacitor series and the first capacitor C1 are connected in parallel and installed inside a common housing 20. Said housing 20 is formed as a single component installed or installable on the printed board. The housing 20 and the capacitors C1, C2, C3, C4 and C5 inside said housing 20 form a capacitor assembly.
  • Further, the series of the first transistor Q1 and the second transistor Q2 is connected in parallel to the first capacitor series, the second capacitor series and the first capacitor C1. This parallel arrangement is interconnected between a power terminal 10 and a ground 12. The power terminal 10 is provided for the supply of a direct current voltage.
  • Moreover, the connecting point of the first transistor Q1 and the second transistor Q2 is connected to the connecting point of the fourth capacitor C4 and the fifth capacitor C5. Thus, the fourth capacitor C4 is connected in parallel to the first transistor Q1 and the first diode D1. In a similar way, the fifth capacitor C5 is connected in parallel to the second transistor Q2 and the second diode D2.
  • The induction coil L is connected to the connecting point of the first transistor Q1 and the second transistor Q2 on the one end. On the other end, the induction coil L is connected to the connecting point of the second capacitor C2 and the third capacitor C3.
  • A first input terminal 14 is connected to the base electrode of the first transistor Q1. In a similar way, a second input terminal 16 is connected to the base electrode of the second transistor Q2. The first input terminal 14 and the second input terminal 16 are provided for the supply of rectangular signals.
  • The first capacitor C1 acts as a link filter for the direct current supplied to the power terminal 10. The second capacitor C2 and the third capacitor C3 are resonant capacitors. The resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator. The fourth capacitor C4 and the fifth capacitor C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • The capacitor assembly, i.e. the housing 20 including the capacitors C1, C2, C3, C4 and C5, may be provided for a printed circuit board with through-hole-technology as well as for an insulated metal substrate (IMS) printed circuit board. For example, the power terminal 10 may be formed according to the standard "RAST5" in both cases. The power terminal 10 is provided for the connection to a corresponding wiring counterpart.
  • If the capacitor assembly is provided for the printed circuit board with through-hole-technology, then the capacitor assembly comprises a number of pins penetrating through the printed circuit board. Said pins are connectable or connected by solder points on the printed circuit board.
  • If the capacitor assembly is provided for the IMS printed circuit board, then the capacitor assembly is fastened on the IMS printed circuit board by the surface mount device (SMD) technology. In this case, the capacitor assembly comprises a number of solder joints formed as L-shaped pins. Said solder joints are fastened on the IMS printed circuit board by the SMD technology in each case.
  • If the capacitor assembly is provided for the IMS printed circuit board, then the power terminal 10 is preferably a part of the capacitor assembly. When the wiring counterpart of the power terminal 10 is plugged to or unplugged from the power terminal 10, then the occurrent force between the power terminal 10 and the IMS printed circuit board is distributed to the solder joints. Thus, the capacitor assembly allows an attachment of the power terminal 10 with a sufficient stability on the IMS printed circuit board.
  • The capacitor assembly with the housing 20 and the capacitors C1, C2, C3, C4 and C5 reduces the components to be installed on the printed circuit board. This result in a faster production process and lower production costs. Additional components may be arranged inside the capacitor assembly. The capacitor assembly allows a better performance of the power management of the induction heating generator. At last, the capacitor assembly saves space on the printed circuit board.
  • FIG 2 illustrates a circuit diagram of the half bridge induction heating generator according to the prior art.
  • The conventional half bridge induction heating generator comprises the two transistors Q1 and Q2, the two diodes D1 and D2, the induction coil L and the five capacitors C1, C2, C3, C4 and C5. The first capacitor C1 acts as the link filter for the direct current. The second and third capacitors C2 and C3 are the resonant capacitors. The resonant capacitors C2 and C3 match the resonant frequency of the induction heating generator. The fourth and fifth capacitors C4 and C5 are snubber capacitors managing the switching behaviour of the transistors Q1 and Q2, respectively.
  • This conventional half bridge induction heating generator is equal in view of the electric connections with the half bridge induction heating generator according to the preferred embodiment of the present invention. However, the capacitors C1, C2, C3, C4 and C5 of the conventional half bridge induction heating generator are formed as separate components in each case.
  • Although an illustrative embodiment of the present invention has been described herein, it is to be understood that the present invention is not limited to that precise embodiment, and that various other changes and modifications are intended to be included within the scope of the invention as defined by the appended claims.
    • List of reference numerals
    • 10
    power terminal
    12
    ground terminal
    14
    first input terminal
    16
    second input terminal
    20
    housing
    Q1
    first transistor
    Q2
    second transistor
    D1
    first diode
    D2
    second diode
    C1
    first capacitor
    C2
    second capacitor
    C3
    third capacitor
    C4
    fourth capacitor
    C5
    fifth capacitor
    L
    induction coil

Claims (13)

  1. A half bridge induction heating generator, comprising:
    - at least one power terminal (10) provided for a direct current voltage,
    - at least one ground terminal (12),
    - four capacitors (C2, C3, C4, C5) forming a bridge circuit between the power terminal (10) and the ground terminal (12),
    - an induction coil (L) interconnected in the centre of said bridge circuit,
    - two semiconductor switches (Q1, Q2) connected in each case parallel to one of the both capacitors (C4, C5) on one side of the bridge circuit, and
    - a further capacitor (C1) interconnected between the power terminal (10) and the ground terminal (12),
    characterized in that
    the four capacitors (C2, C3, C4, C5) of the bridge circuit and the further capacitor (C1) are arranged inside a common housing (20), wherein said housing (20) and the capacitors (C1, C2, C3, C4, C5) form a capacitor assembly, which is a single component and mounted or mountable on and electrically connected or connectable to a printed circuit board, wherein the power terminal (10) is arranged at the outside of the housing (20) of the capacitor assembly, and wherein the power terminal (10) is connected or connectable to a corresponding wiring counterpart.
  2. The induction heating generator according to claim 1,
    characterized in that
    the housing (20) is filled with a hardening liquid, so that the capacitor assembly form a robust block.
  3. The induction heating generator according to any one of the preceding claims,
    characterized in that
    the housing (20) comprises a plurality of terminals corresponding with the electrodes of the capacitors (C1, C2, C3, C4, C5), wherein the electric connections of the capacitors (C1, C2, C3, C4, C5) are performed or performable on the printed circuit board.
  4. The induction heating generator according to any one of the preceding claims,
    characterized in that
    the space between the housing (20) and the printed circuit board is provided for further electric and/or electronic components.
  5. The induction heating generator according to any one of the preceding claims,
    characterized in that
    further electric and/or electronic components are arranged inside the housing (20).
  6. The induction heating generator according to any one of the preceding claims,
    characterized in that
    at least one diode (D1, D2) is connected in parallel to each of the both semiconductor switches (Q1, Q2).
  7. The induction heating generator according to any one of the preceding claims,
    characterized in that
    the housing (20) is mounted or mountable on and electrically connected or connectable to the printed circuit board with through-hole-technology.
  8. The induction heating generator according to any one of the claims 1 to 6,
    characterized in that
    the housing (20) is mounted or mountable on and electrically connected or connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
  9. The induction heating generator according to any one of the preceding claims,
    characterized in that
    a first input terminal (14) is connected to a control electrode of the one semiconductor switch (Q1), and a second input terminal (16) is connected to a control electrode of the other semiconductor switch (Q2), wherein the first input terminal (14) and the second input terminal (16) are connected to the base electrodes of the semiconductor switches (Q1, Q2), if said semiconductor switches (Q1, Q2) are bipolar transistors, and wherein the first input terminal (14) and the second input terminal (16) are connected to the gate electrodes of the semiconductor switches (Q1, Q2), if said the semiconductor switches (Q1, Q2) are field effect transistors.
  10. A capacitor assembly for a half bridge induction heating generator according to any one of the claims 1 to 9, comprising:
    - four capacitors (C2, C3, C4, C5) forming a bridge circuit, and
    - a further capacitor (C1) connected in parallel to the bridge circuit,
    characterized in that
    the four capacitors (C2, C3, C4, C5) of the bridge circuit and the further capacitor (C1) are arranged inside a common housing (20), wherein said housing (20) and the capacitors (C1, C2, C3, C4, C5) form a capacitor assembly, which is a single component and mountable on and electrically connectable to a printed circuit board, wherein the power terminal (10) is arranged at the outside of the housing (20) of the capacitor assembly, and wherein the power terminal (10) is provided for the connection to a corresponding wiring counterpart.
  11. The capacitor assembly according to claim 10,
    characterized in that
    the housing (20) is filled with a hardening liquid, so that the capacitor assembly form a robust block.
  12. The capacitor assembly according to claim 10 or 11,
    characterized in that
    the housing (20) is mountable on and electrically connectable to a printed circuit board with through-hole-technology.
  13. The capacitor assembly according to claim 10 or 11,
    characterized in that
    the housing (20) is mountable on and electrically connectable to an insulated metal substrate (IMS) printed circuit board by the surface mount device (SMD) technology.
EP12170390.4A 2012-06-01 2012-06-01 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator Active EP2670212B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP12170390.4A EP2670212B1 (en) 2012-06-01 2012-06-01 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator
US14/396,482 US9781775B2 (en) 2012-06-01 2013-05-21 Half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator
CN201380027645.8A CN104641724B (en) 2012-06-01 2013-05-21 A kind of semibridge system senses heater and a kind of capacitor assembly sensing heater for semibridge system
AU2013269817A AU2013269817B2 (en) 2012-06-01 2013-05-21 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator
PCT/EP2013/060412 WO2013178505A1 (en) 2012-06-01 2013-05-21 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12170390.4A EP2670212B1 (en) 2012-06-01 2012-06-01 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator

Publications (2)

Publication Number Publication Date
EP2670212A1 EP2670212A1 (en) 2013-12-04
EP2670212B1 true EP2670212B1 (en) 2016-03-09

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EP12170390.4A Active EP2670212B1 (en) 2012-06-01 2012-06-01 A half bridge induction heating generator and a capacitor assembly for a half bridge induction heating generator

Country Status (5)

Country Link
US (1) US9781775B2 (en)
EP (1) EP2670212B1 (en)
CN (1) CN104641724B (en)
AU (1) AU2013269817B2 (en)
WO (1) WO2013178505A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7338279B2 (en) * 2019-07-11 2023-09-05 富士電機株式会社 Power semiconductor module and its leakage current test method
EP4009339A1 (en) * 2020-12-02 2022-06-08 Siemens Energy Global GmbH & Co. KG Capacitor assembly, method of manufacturing the same, and converter assembly including the capacitor assembly

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Publication number Priority date Publication date Assignee Title
US3706980A (en) * 1970-04-27 1972-12-19 Drexelbrook Controls Rf system for measuring the level of materials
US4025864A (en) * 1972-02-22 1977-05-24 Inductotherm Corporation Direct current modulator for providing variable double frequency electrical power to a load
JPS63281380A (en) 1987-05-14 1988-11-17 Matsushita Electric Ind Co Ltd High frequency heating device
FR2783370B1 (en) * 1998-09-11 2000-12-08 Cepem INVERTER SUPPLY DEVICE WITH CONTROLLED POWER SUPPLY
US6229124B1 (en) * 1998-10-10 2001-05-08 TRUCCO HORACIO ANDRéS Inductive self-soldering printed circuit board
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
ITMI20010910A1 (en) * 2001-05-03 2002-11-03 C P E S R L Consultants Plasti INDUCTION COOKING EQUIPMENT HAVING IMPROVED FEATURES
JP2004200005A (en) * 2002-12-18 2004-07-15 Harison Toshiba Lighting Corp Induction heating roller arrangement, fixing device, and image forming apparatus
KR100674830B1 (en) * 2004-11-04 2007-01-25 삼성전기주식회사 Multilayered chip capacitor array
US7149072B2 (en) * 2004-11-04 2006-12-12 Samsung Electro-Mechanics Co., Ltd. Multilayered chip capacitor array
US7658247B2 (en) * 2006-09-20 2010-02-09 Gatekeeper Systems, Inc. Systems and methods for power storage and management from intermittent power sources
JP4406733B2 (en) * 2006-10-05 2010-02-03 国立大学法人東京工業大学 Inverter power supply

Also Published As

Publication number Publication date
CN104641724B (en) 2017-03-08
AU2013269817B2 (en) 2016-07-14
CN104641724A (en) 2015-05-20
US20150144618A1 (en) 2015-05-28
US9781775B2 (en) 2017-10-03
AU2013269817A1 (en) 2014-11-13
EP2670212A1 (en) 2013-12-04
WO2013178505A1 (en) 2013-12-05

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