JP2017103366A5 - - Google Patents
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- JP2017103366A5 JP2017103366A5 JP2015235905A JP2015235905A JP2017103366A5 JP 2017103366 A5 JP2017103366 A5 JP 2017103366A5 JP 2015235905 A JP2015235905 A JP 2015235905A JP 2015235905 A JP2015235905 A JP 2015235905A JP 2017103366 A5 JP2017103366 A5 JP 2017103366A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate portion
- unit
- fixed
- substrate unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015235905A JP2017103366A (ja) | 2015-12-02 | 2015-12-02 | 電子部品モジュールおよびその製造方法 |
| CN201680071521.3A CN108370642A (zh) | 2015-12-02 | 2016-12-01 | 具备安装电子部件的基板和散热板的电子部件模块及其制造方法 |
| US15/780,728 US20200258805A1 (en) | 2015-12-02 | 2016-12-01 | Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the same |
| PCT/JP2016/085719 WO2017094834A1 (ja) | 2015-12-02 | 2016-12-01 | 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法 |
| KR1020187016114A KR20180081767A (ko) | 2015-12-02 | 2016-12-01 | 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법 |
| TW105139926A TW201733414A (zh) | 2015-12-02 | 2016-12-02 | 安裝有電子零件之基板和具備有散熱板之電子零件模組及其製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015235905A JP2017103366A (ja) | 2015-12-02 | 2015-12-02 | 電子部品モジュールおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017103366A JP2017103366A (ja) | 2017-06-08 |
| JP2017103366A5 true JP2017103366A5 (enExample) | 2018-01-18 |
Family
ID=58796963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015235905A Pending JP2017103366A (ja) | 2015-12-02 | 2015-12-02 | 電子部品モジュールおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20200258805A1 (enExample) |
| JP (1) | JP2017103366A (enExample) |
| KR (1) | KR20180081767A (enExample) |
| CN (1) | CN108370642A (enExample) |
| TW (1) | TW201733414A (enExample) |
| WO (1) | WO2017094834A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7398877B2 (ja) * | 2019-04-18 | 2023-12-15 | 新光電気工業株式会社 | 半導体装置用ステム及び半導体装置 |
| US11456231B2 (en) * | 2021-01-18 | 2022-09-27 | Fortinet, Inc. | Heatsink arrangement for integrated circuit assembly and method for assembling thereof |
| WO2022195865A1 (ja) * | 2021-03-19 | 2022-09-22 | サンケン電気株式会社 | 四面冷却パワーモジュール |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62118492U (enExample) * | 1986-01-20 | 1987-07-28 | ||
| US5265322A (en) * | 1990-02-05 | 1993-11-30 | Motorola, Inc. | Electronic module assembly and method of forming same |
| US5925298A (en) * | 1995-06-26 | 1999-07-20 | Ford Motor Company | Method for reworking a multi-layer circuit board using a shape memory alloy material |
| JP3411512B2 (ja) * | 1998-12-15 | 2003-06-03 | ティーディーケイ株式会社 | 電子機器 |
| JP2006100302A (ja) * | 2004-09-28 | 2006-04-13 | Sharp Corp | 高周波モジュールおよびその製造方法 |
| JP4697037B2 (ja) | 2006-05-09 | 2011-06-08 | 株式会社デンソー | 部品内蔵基板及びその配線不良検査方法 |
| DE102009060777A1 (de) * | 2009-12-22 | 2011-06-30 | Automotive Lighting Reutlingen GmbH, 72762 | Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät |
| CN201869439U (zh) * | 2010-12-05 | 2011-06-15 | 新高电子材料（中山）有限公司 | 高散热金属基电路板 |
| JP2013012508A (ja) * | 2011-06-28 | 2013-01-17 | Ntt Electornics Corp | 電子機器 |
| CN204560003U (zh) * | 2015-02-09 | 2015-08-12 | 江阴通利光电科技有限公司 | 一种可弯曲电路板组件 |
-
2015
- 2015-12-02 JP JP2015235905A patent/JP2017103366A/ja active Pending
-
2016
- 2016-12-01 CN CN201680071521.3A patent/CN108370642A/zh not_active Withdrawn
- 2016-12-01 US US15/780,728 patent/US20200258805A1/en not_active Abandoned
- 2016-12-01 KR KR1020187016114A patent/KR20180081767A/ko not_active Withdrawn
- 2016-12-01 WO PCT/JP2016/085719 patent/WO2017094834A1/ja not_active Ceased
- 2016-12-02 TW TW105139926A patent/TW201733414A/zh unknown
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