WO2017094834A1 - 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法 - Google Patents

電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法 Download PDF

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Publication number
WO2017094834A1
WO2017094834A1 PCT/JP2016/085719 JP2016085719W WO2017094834A1 WO 2017094834 A1 WO2017094834 A1 WO 2017094834A1 JP 2016085719 W JP2016085719 W JP 2016085719W WO 2017094834 A1 WO2017094834 A1 WO 2017094834A1
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WIPO (PCT)
Prior art keywords
substrate
electronic component
substrate portion
component module
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/085719
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English (en)
French (fr)
Japanese (ja)
Inventor
横地　智宏
長谷川　賢一郎
梶野　秀忠
康徳 笠間
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Denso Corp
Original Assignee
Denso Corp
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Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN201680071521.3A priority Critical patent/CN108370642A/zh
Priority to US15/780,728 priority patent/US20200258805A1/en
Priority to KR1020187016114A priority patent/KR20180081767A/ko
Publication of WO2017094834A1 publication Critical patent/WO2017094834A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the present disclosure relates to an electronic component module in which a plurality of electronic components are integrated and a method for manufacturing the same.
  • Japanese Unexamined Patent Application Publication No. 2007-305675 discloses a component built-in board in which an electronic component is built in the board.
  • a method for manufacturing the component-embedded substrate there is a method in which a plurality of sealing substrates for sealing the surface-mounted substrate are sequentially stacked after the surface-mounted substrate on which the electronic component is surface-mounted is manufactured.
  • the above-described method for manufacturing a component-embedded substrate requires a step of laminating a plurality of sealing substrates in addition to the step of manufacturing a surface mount substrate. For this reason, compared with the case of manufacturing the conventional surface mount substrate, the manufacturing time is significantly increased.
  • the present disclosure provides an electronic component module capable of reducing manufacturing time and improving heat dissipation as compared with a conventional component-embedded substrate, and a manufacturing method thereof.
  • an electronic component module in which a plurality of electronic components are integrated, A substrate (10); A plurality of electronic components (21, 22) mounted on the surface (11a, 12a) of the substrate; A heat sink (30) made of metal and fixed to the substrate, The substrate has a first substrate portion (11), a second substrate portion (12), and a third substrate portion (13),
  • the plurality of electronic components include one or more first components (21) mounted on one surface (11a) of the first substrate unit and one or more second components mounted on one surface (12a) of the second substrate unit.
  • the first substrate portion and the second substrate portion are arranged with one surface of the first substrate portion facing one surface of the second substrate portion,
  • the heat sink is sandwiched between the first substrate unit, the second substrate unit, the fixed unit (31, 32, 33) fixed to at least one of the first substrate unit, the second substrate unit, and the third substrate unit.
  • Side portions (34, 35, 36) located on the sides of the region (R1), The side portion is connected to the fixed portion via a bent portion having a bent shape.
  • This electronic component module is manufactured by bending a substrate and a heat sink after mounting a plurality of electronic components on the surfaces of the first substrate portion and the second substrate portion. That is, the electronic component module is manufactured by bending the surface mounting substrate after manufacturing the surface mounting substrate. Therefore, the manufacturing time can be shortened as compared with the case where a plurality of sealing substrates are stacked after the surface mounting substrate is manufactured.
  • a part of the heat radiating plate is arranged on the side of the region sandwiched between the first substrate portion and the second substrate portion. For this reason, compared with the case where the heat sink is not arrange
  • An electronic component module is A method of manufacturing an electronic component module in which a plurality of electronic components are integrated, Preparing a substrate (10) to which a heat sink (30) is fixed; Mounting a plurality of electronic components (21, 22) on the surface (11a, 12a) of the substrate; Folding each of the mounted substrate and the heat sink,
  • the prepared substrate has a first substrate unit (11), a second substrate unit (12), and a third substrate unit (13) connected to both the first substrate unit and the second substrate unit,
  • the heat sink fixed to the substrate is connected to the fixed portion (31, 32, 33) fixed to overlap at least one of the first substrate portion, the second substrate portion, and the third substrate portion, and to the fixed portion.
  • the mounting includes mounting one or more first components (21) on one surface (11a) of the first substrate portion and one or more second components (22 on one surface (12a) of the second substrate portion. ) Bending means that the substrate is bent so that one surface of the first substrate portion and one surface of the second substrate portion face each other, and the third substrate portion that connects between the first substrate portion and the second substrate portion is formed. And bending the side portion to position the side portion on the side of the region (R1) sandwiched between the first substrate portion and the second substrate portion.
  • a part of the heat radiating plate is disposed on the side of the region sandwiched between the first substrate portion and the second substrate portion by bending the heat radiating plate. For this reason, compared with the case where the heat sink is not arrange
  • FIG. 2 is a cross-sectional view of the electronic component module taken along line II-II in FIG. 1. It is a side view of the electronic component module of FIG. It is a flowchart which shows the manufacturing process of the electronic component module in 1st Embodiment. It is a top view of the mounting substrate which shows a part of manufacturing process of the electronic component module in 1st Embodiment.
  • FIG. 6 is a cross-sectional view of the mounting board taken along line VI-VI in FIG. 5. It is a top view of the heat sink in 1st Embodiment. It is a top view of the printed wiring board in a 1st embodiment.
  • the electronic component module 1 of this embodiment includes a plurality of electronic components, and is mounted on the motherboard 2 in a state where the electronic components are integrated in the module.
  • the electronic component module 1 realizes a component built-in substrate in which a plurality of electronic components are built in in a pseudo manner.
  • the electronic component module 1 includes one printed wiring board 10, a plurality of electronic components 21, 22, 23, and 24, and a heat sink 30.
  • the printed wiring board 10 includes a first substrate unit 11, a second substrate unit 12, and a third substrate unit 13.
  • the first substrate unit 11 and the second substrate unit 12 have a flat plate shape.
  • the third substrate unit 13 is connected to both the first substrate unit 11 and the second substrate unit 12.
  • a portion 131 on the first substrate portion 11 side and a portion 132 on the second substrate portion 12 side of the third substrate portion 13 are bent portions having a bent shape.
  • a portion 131 on the first substrate portion 11 side and a portion 132 on the second substrate portion 12 side of the third substrate portion 13 are bent at right angles.
  • a portion of the third substrate portion 13 between the portion 131 on the first substrate portion 11 side and the portion 132 on the second substrate portion 12 side has a flat plate shape.
  • the thickness of the third substrate unit 13 is formed to be thinner than the thickness of the first substrate unit 11 and the second substrate unit 12. Accordingly, the third substrate unit 13 is more flexible than the first substrate unit 11 and the second substrate unit 12. The thickness of the first substrate unit 11 and the second substrate unit 12 is thicker than that of the third substrate unit 13. Accordingly, the first substrate unit 11 and the second substrate unit 12 are configured to be harder than the third substrate unit 13.
  • the plurality of electronic components include a plurality of first components 21 mounted on the one surface 11 a of the first substrate unit 11 and a plurality of second components 22 mounted on the one surface 12 a of the second substrate unit 12. .
  • the first substrate portion 11 and the second substrate portion 12 are arranged with the mounted surface 11a and the surface 12a facing each other.
  • the planar shape of the first substrate unit 11 and the planar shape of the second substrate unit 12 are quadrangular and the same.
  • the tall component 211 among the plurality of first components 21 and the tall component 221 among the second components 22 are arranged at different positions in a direction parallel to the one surface 11a of the first substrate unit 11. Has been.
  • the heat sink 30 includes a fixed portion fixed to the first substrate portion 11, the second substrate portion 12, and the third substrate portion 13, and a side of the region R ⁇ b> 1 sandwiched between the first substrate portion 11 and the second substrate portion 12. And a side portion located at the side.
  • the fixing unit overlaps the first substrate unit 11, the second substrate unit 12, and the third substrate unit 13.
  • the side portions do not overlap the first substrate portion 11, the second substrate portion 12, and the third substrate portion 13.
  • the side of the region R1 is the side of the arrangement direction of the first substrate unit 11 and the second substrate unit 12. That is, the side of the region R1 is a lateral direction when the arrangement direction of the first substrate unit 11 and the second substrate unit 12 is the vertical direction.
  • the side of the region R ⁇ b> 1 is a direction that intersects the arrangement direction of the first substrate unit 11 and the second substrate unit 12. Moreover, being located to the side of the region R1 has the same meaning as being located around the region R1 not surrounded by the first substrate unit 11 and the second substrate unit 12 in the region R1.
  • the fixing part has a first fixing part 31, a second fixing part 32, and a third fixing part 33.
  • the first fixing portion 31 is fixed to the other surface 11 b opposite to the one surface 11 a of the first substrate portion 11.
  • the second fixing portion 32 is fixed to the other surface 12 b opposite to the one surface 12 a of the second substrate portion 12.
  • the third fixing portion 33 is fixed to the other surface 13 b opposite to the one surface 13 a of the third substrate portion 13.
  • the planar shape of each of the first fixing unit 31, the second fixing unit 32, and the third fixing unit 33 is the same quadrangle as the planar shape of each of the first substrate unit 11, the second substrate unit 12, and the third substrate unit 13. is there. As shown in FIG. 1, the third fixing portion 33 is continuous with one side of the first fixing portion 31.
  • the side portion includes a first side portion 34, a second side portion 35, and a third side portion 36 that are continuous with the other three sides of the first fixing portion 31.
  • the first side portion 34 is a bent portion in which a part on the first fixing portion 31 side is bent.
  • the part except a bending part is flat plate shape.
  • the second side portion 35 and the third side portion 36 have the same shape as the first side portion 34.
  • the third side portion 36 is located on the side surface of the electronic component module 1. Similarly to the third side portion 36, the first side portion 34 and the second side portion 35 are also located on the side surface of the electronic component module 1.
  • the first side portion 34 is on the side of the region R ⁇ b> 1 between the first substrate portion 11 and the second substrate portion 12 where the first component 21 and the second component 22 are disposed. And the side of the second substrate portion 12.
  • the 1st side part 34 should just be located in the side of area
  • the length of the first substrate portion 11 and the second substrate portion 12 in the opposite direction may be longer than the distance between them.
  • the second side part 35 and the third side part 36 are also located on the side of the region R1.
  • fixed part 32 among the heat sinks 30 are arrange
  • fixed part 33 among the heat sinks 30 are arrange
  • the heat sink 30 is made of metal. As for the 1st side part 34, the 2nd side part 35, and the 3rd side part 36, the metal surface is exposed in each whole region.
  • the heat sink 30 is electrically connected to a ground electrode (not shown) of the printed wiring board 10. Thereby, the heat sink 30 is set to the ground potential.
  • the plurality of electronic components have electronic components 23 and 24 mounted on the other surface 11 b opposite to the one surface 11 a of the first substrate unit 11.
  • the manufacturing method of the electronic component module 1 includes a substrate preparation step, a mounting step of manufacturing a mounting substrate by mounting a plurality of electronic components on the substrate, and a bending step of bending the mounting substrate.
  • the printed wiring board 10 to which the heat sink 30 is fixed is prepared.
  • the printed wiring board 10 to which the heat radiating plate 30 is fixed is obtained by fixing the flat plate-shaped heat radiating plate 30 shown in FIG. 7 and the flat plate-shaped printed wiring board 10 shown in FIG. .
  • the heat sink 30 is larger than the printed wiring board 10.
  • the heat radiating plate 30 is fixed to the printed wiring board 10 with the side portions 34, 35, 36 not overlapping the printed wiring board 10.
  • the heat sink 30 is made of a metal foil such as a copper foil.
  • the thickness of the heat sink 30 is made larger than the thickness of a conductor pattern 102 described later.
  • openings 301 and 302 for mounting the electronic components 23 and 24 are formed in the heat radiating plate 30.
  • the printed wiring board 10 has a first substrate part 11, a second substrate part 12, and a third substrate part 13 (before the bending step).
  • FIG. 9 shows a specific cross-sectional structure of the printed wiring board 10 of FIG.
  • the printed wiring board 10 has a plurality of film-like insulating base materials 101 laminated thereon.
  • Each insulating substrate 101 has one or more conductor patterns 102 formed on the surface.
  • the conductor pattern 102 is made of a metal foil such as a copper foil.
  • the insulating base material 101 has one or more vias 103 formed in the thickness direction.
  • the conductor pattern 102 and the via 103 constitute a conductive wiring.
  • the insulating base 101 is made of a thermoplastic resin.
  • the insulating base material 101 may be made of a resin material other than the thermoplastic resin.
  • the insulating base material 101 is not limited to being composed of only a resin material, and may include a material other than the resin material.
  • the third substrate portion 13 has a smaller number of laminated insulating base materials 101 than the first substrate portion 11 and the second substrate portion 12. Thereby, the thickness of the third substrate unit 13 is formed smaller than the thicknesses of the first substrate unit 11 and the second substrate unit 12.
  • a laminated body 200 is formed by laminating a plurality of insulating base materials 101 on which conductive patterns 102 and vias 103 are formed and a heat radiating plate 30. Thereafter, the laminate 200 is heated and pressurized. As a result, the plurality of insulating base materials 101 are joined together to form the printed wiring board 10. Further, as shown in FIGS. 5 and 6, the heat sink 30 is bonded to the surface of the printed wiring board 10.
  • the surface mounting substrate 300 shown in FIGS. 5 and 6 is bent so as to have the shape shown in FIGS.
  • the third substrate part 13 is bent together with the third fixing part 33.
  • the first side portion 34, the second side portion 35, and the third side portion 36 of the heat sink 30 are bent.
  • the third substrate portion 13 may be bent after the side portions 34, 35, and 36 are bent.
  • the first side part 34, the second side part 35, and the third side part 36 are joined to the side surface of the second substrate part 12.
  • the electronic component module 1 of the present embodiment is manufactured. Thereafter, as shown in FIGS. 2 and 3, the electronic component module 1 is soldered using a solder ball or the like and mounted on the mother board 2.
  • the electronic component module 1 has a plurality of electronic components 21 and 22 mounted on the surfaces 11a and 12a of the first substrate portion 11 and the second substrate portion 12, and then the third substrate portion 13 and the side portions. It is manufactured by bending the portions 34, 35 and 36. That is, the electronic component module 1 is manufactured by bending the surface mounting substrate 300 after manufacturing the surface mounting substrate 300. Therefore, the manufacturing time can be shortened as compared with the case where a plurality of sealing substrates are stacked after the surface mounting substrate is manufactured.
  • a part of the heat radiating plate 30 is disposed around the region R1 sandwiched between the first substrate unit 11 and the second substrate unit 12. According to this, compared with the case where the heat sink is not arrange
  • the first side portion 34, the second side portion 35, and the third side portion 36 are disposed in the entire region excluding the third substrate portion 13 on the side of the region R1.
  • a part of the heat radiating plate 30 is disposed around the entire region R1 by the first side portion 34, the second side portion 35, the third side portion 36, and the third fixing portion 33. ing. Thereby, compared with the case where a heat sink is arrange
  • the side portions 34, 35, 36 are connected to the fixing portions 31, 32, 33.
  • the side portions 34, 35 and 36 are arranged around the region R1 by being bent.
  • the step of attaching the side portions 34, 35, and 36 is unnecessary. For this reason, manufacturing time can be shortened compared with the case where the side parts 34, 35, 36 are comprised separately from the fixing parts 31, 32, 33.
  • the heat sink 30 is set to the ground potential. Thereby, the heat sink 30 can be functioned as an electromagnetic wave shield. That is, the first component 21, the second fixing portion 32, the third fixing portion 33, the first side portion 34, the second side portion 35, and the third side portion 36 are externally connected to the first component 21 and the second side portion 36. The electromagnetic wave toward the two parts 22 can be blocked. Therefore, the reliability of the electronic components in the electronic component module is improved.
  • the electronic components 211 and 221 are arranged at different positions in the direction parallel to the one surface 11a of the first substrate unit 11. Thereby, the height of the electronic component module 1 can be suppressed low. Therefore, the electronic component module 1 can be downsized.
  • the mounted first component 21 and the second component 22 can be inspected and repaired after the mounting step and before the bending step. is there.
  • the first side portion 34 of the heat sink 30 contacts the second component 22 that is the electronic component to be radiated.
  • Other configurations of the electronic component module 1 are the same as those of the electronic component module 1 of the first embodiment.
  • the contact surface of the first side portion 34 with the second component 22 is made of metal.
  • the first side portion 34 is fixed by an adhesive such as a metal paste applied around the contact surface with the second component 22.
  • the manufacturing method of the electronic component module 1 of the present embodiment differs from the manufacturing method of the first embodiment in the following points.
  • the arrangement of the second component 22 in the mounting process was changed.
  • the first side portion 34 is bent in the bending step, the first side portion 34 is brought into contact with the second component 22. Thereafter, the first side portion 34 was bonded to the second component 22.
  • the first side portion 34 is in contact with the second component 22. Thereby, the heat dissipation of the 2nd component 22 can be improved rather than the case where the 1st side part 34 is not contacting the 2nd component 22.
  • the first side portion 34 is brought into contact with the second component 22, but the present invention is not limited to this.
  • a first side portion 34, a second side portion 35, and a third side portion Any one of the side portions of 36 may be brought into contact.
  • the electronic component module 1 of the present embodiment is different from that of the first embodiment in that a plurality of electronic components 25 and 26 are mounted on the surface of the first side portion 34 of the heat sink 30. Different from the electronic component module 1. Other configurations of the electronic component module 1 are the same as those of the electronic component module 1 of the first embodiment.
  • a plurality of electronic components 25 and 26 may be mounted on the first side portion 34.
  • a plurality of electronic components 25 and 26 may be mounted on the side portions 35 and 36 other than the first side portion 34.
  • the electronic component module 1 of the present embodiment does not have the second side portion 35 and the third side portion 36 of the heat sink 30. Different from the component module 1.
  • Other configurations of the electronic component module 1 are the same as those of the electronic component module 1 of the first embodiment.
  • illustration of a plurality of electronic components is omitted.
  • the side part of the heat sink 30 may be located not in the whole area except the third substrate part 13 on the side of the region R1. Also in this embodiment, compared with the case where the side part of the heat sink 30 is not arrange
  • the electronic component module 1 of the present embodiment is different from the electronic component module 1 of the first embodiment in that the planar shape is circular. Other configurations are the same as those of the electronic component module 1 of the first embodiment. 15 and 16, illustration of a plurality of electronic components is omitted.
  • the planar shape of the first substrate part 11 and the second substrate part 12 of the printed wiring board 10 is circular.
  • the planar shape of the first fixing portion 31 and the second fixing portion 32 of the heat radiating plate 30 is also circular.
  • the heat sink 30 has side portions 37 and 38.
  • the heat dissipation plate 30 of the present embodiment is formed into a cylindrical shape by bending the third fixing portion 33 and the side portions 37 and 38.
  • the 1st board part 11 and the 2nd board part 12 serve as the bottom of a cylinder.
  • the side portions 37 and 38 are the side surfaces of the cylinder. Also in the present embodiment, the side portions 37 and 38 are located around the region between the first substrate portion 11 and the second substrate portion 12. For this reason, the effect similar to 1st Embodiment is acquired.
  • each of the first side part 34, the second side part 35, and the third side part 36 is connected to the first fixing part 31, but the first fixing part 31 Instead of the part 31, the second fixing part 32 may be connected. Further, the present invention is not limited to the case where each of the first side part 34, the second side part 35, and the third side part 36 is continuous with only one of the first fixing part 31 and the second fixing part 32. Each of the first side part 34, the second side part 35, and the third side part 36 may be continuous with both the first fixing part 31 and the second fixing part 32. In this case, for example, the first side portion 34 is divided into a portion continuous with the first fixed portion 31 and a portion continuous with the second fixed portion 32.
  • the metal surfaces of the side portions 34, 35, and 36 of the heat radiating plate 30 are exposed in the entire side portion, but the present invention is not limited to this.
  • the side portions 34, 35, and 36 may be covered with an insulating layer such as a resin at a part of the portion where insulation is required.
  • the portions 131 and 132 of the third substrate portion 13 are bent, but the present invention is not limited to this.
  • the entire third substrate portion 13 may be bent.
  • the heat sink 30 is fixed to the surface of the printed wiring board 10, but is not limited thereto.
  • the heat sink 30 may be fixed inside the printed wiring board 10. That is, the heat radiating plate 30 may be joined to the printed wiring board 10 while being sandwiched between the insulating base material 101 and the insulating base material 101 constituting the printed wiring board 10.
  • an electronic component module is provided with a board
  • the substrate includes a first substrate unit, a second substrate unit, and a third substrate unit.
  • the first substrate portion and the second substrate portion are arranged with one surface of the first substrate portion facing one surface of the second substrate portion.
  • the first substrate unit, the third substrate unit, and the second substrate unit are connected.
  • the heat radiating plate is located on a side of a fixed portion fixed to at least one of the first substrate portion, the second substrate portion, and the third substrate portion, and a region sandwiched between the first substrate portion and the second substrate portion.
  • Side portions to be The side portion is connected to the fixed portion via a bent portion having a bent shape.
  • the side portion is in contact with at least one electronic component of the first component and the second component.
  • the heat sink is at ground potential.
  • a heat sink can be functioned as an electromagnetic wave shield. That is, it is possible to block electromagnetic waves traveling from the outside to the plurality of electronic components by the heat sink.
  • the fixing portion is fixed to each of the first substrate portion, the second substrate portion, and the third substrate portion.
  • the side portion is disposed in the entire area excluding the third substrate portion on the side of the region sandwiched between the first substrate portion and the second substrate portion.
  • the electronic component module manufacturing method includes preparing a substrate on which the heat sink is fixed, mounting a plurality of electronic components on the surface of the substrate, Folding each of the heat sinks. Bending means that the substrate is bent so that one surface of the first substrate portion and one surface of the second substrate portion face each other, and the third substrate portion that connects between the first substrate portion and the second substrate portion is formed. Including doing. Bending further includes bending the side portion and positioning the side portion to the side of the region sandwiched between the first substrate portion and the second substrate portion.
  • the side portion by positioning the side portion on the side of the region, the side portion is brought into contact with at least one electronic component of the first component and the second component. Let Thereby, the heat dissipation of an electronic component can be improved more.
  • a substrate in which the heat sink is electrically connected to the ground electrode of the substrate is prepared.
  • the electromagnetic wave which goes to a some electronic component from the outside can be interrupted
  • the fixing portion is overlapped and fixed on each of the first substrate portion, the second substrate portion, and the third substrate portion.
  • the side portion is positioned on the entire region excluding the third substrate portion on the side of the region.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PCT/JP2016/085719 2015-12-02 2016-12-01 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法 Ceased WO2017094834A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680071521.3A CN108370642A (zh) 2015-12-02 2016-12-01 具备安装电子部件的基板和散热板的电子部件模块及其制造方法
US15/780,728 US20200258805A1 (en) 2015-12-02 2016-12-01 Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the same
KR1020187016114A KR20180081767A (ko) 2015-12-02 2016-12-01 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법

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JP2015235905A JP2017103366A (ja) 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法
JP2015-235905 2015-12-02

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JP7398877B2 (ja) * 2019-04-18 2023-12-15 新光電気工業株式会社 半導体装置用ステム及び半導体装置
US11456231B2 (en) * 2021-01-18 2022-09-27 Fortinet, Inc. Heatsink arrangement for integrated circuit assembly and method for assembling thereof
WO2022195865A1 (ja) * 2021-03-19 2022-09-22 サンケン電気株式会社 四面冷却パワーモジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118492U (enExample) * 1986-01-20 1987-07-28
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
JP2000183574A (ja) * 1998-12-15 2000-06-30 Tdk Corp 電子機器
JP2006100302A (ja) * 2004-09-28 2006-04-13 Sharp Corp 高周波モジュールおよびその製造方法
JP2013012508A (ja) * 2011-06-28 2013-01-17 Ntt Electornics Corp 電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925298A (en) * 1995-06-26 1999-07-20 Ford Motor Company Method for reworking a multi-layer circuit board using a shape memory alloy material
JP4697037B2 (ja) 2006-05-09 2011-06-08 株式会社デンソー 部品内蔵基板及びその配線不良検査方法
DE102009060777A1 (de) * 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät
CN201869439U (zh) * 2010-12-05 2011-06-15 新高电子材料（中山）有限公司 高散热金属基电路板
CN204560003U (zh) * 2015-02-09 2015-08-12 江阴通利光电科技有限公司 一种可弯曲电路板组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118492U (enExample) * 1986-01-20 1987-07-28
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
JP2000183574A (ja) * 1998-12-15 2000-06-30 Tdk Corp 電子機器
JP2006100302A (ja) * 2004-09-28 2006-04-13 Sharp Corp 高周波モジュールおよびその製造方法
JP2013012508A (ja) * 2011-06-28 2013-01-17 Ntt Electornics Corp 電子機器

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JP2017103366A (ja) 2017-06-08
KR20180081767A (ko) 2018-07-17
TW201733414A (zh) 2017-09-16
US20200258805A1 (en) 2020-08-13
CN108370642A (zh) 2018-08-03

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