JP2011049311A5 - - Google Patents

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Publication number
JP2011049311A5
JP2011049311A5 JP2009195737A JP2009195737A JP2011049311A5 JP 2011049311 A5 JP2011049311 A5 JP 2011049311A5 JP 2009195737 A JP2009195737 A JP 2009195737A JP 2009195737 A JP2009195737 A JP 2009195737A JP 2011049311 A5 JP2011049311 A5 JP 2011049311A5
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JP
Japan
Prior art keywords
semiconductor
heat sink
semiconductor element
semiconductor device
convex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009195737A
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English (en)
Japanese (ja)
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JP2011049311A (ja
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Publication date
Application filed filed Critical
Priority to JP2009195737A priority Critical patent/JP2011049311A/ja
Priority claimed from JP2009195737A external-priority patent/JP2011049311A/ja
Priority to US12/861,008 priority patent/US20110049702A1/en
Publication of JP2011049311A publication Critical patent/JP2011049311A/ja
Publication of JP2011049311A5 publication Critical patent/JP2011049311A5/ja
Pending legal-status Critical Current

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JP2009195737A 2009-08-26 2009-08-26 半導体パッケージ及び製造方法 Pending JP2011049311A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009195737A JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法
US12/861,008 US20110049702A1 (en) 2009-08-26 2010-08-23 Semiconductor package and method of producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009195737A JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法

Publications (2)

Publication Number Publication Date
JP2011049311A JP2011049311A (ja) 2011-03-10
JP2011049311A5 true JP2011049311A5 (enExample) 2012-09-06

Family

ID=43623617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009195737A Pending JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法

Country Status (2)

Country Link
US (1) US20110049702A1 (enExample)
JP (1) JP2011049311A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103954260A (zh) * 2014-05-28 2014-07-30 苏州艾酷玛赫设备制造有限公司 汽车散热器检测装置
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
TR201816893A2 (tr) * 2018-11-09 2019-02-21 Kale Oto Radyatoer Sanayi Ve Ticaret Anonim Sirketi Çok Sıra Tüplü Otomatik Radyatör Dizme Makinesi
US11710677B2 (en) * 2019-07-08 2023-07-25 Intel Corporation Ultraviolet (UV)-curable sealant in a microelectronic package
US11842944B2 (en) * 2019-12-26 2023-12-12 Intel Corporation IC assemblies including die perimeter frames suitable for containing thermal interface materials

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01220852A (ja) * 1988-02-29 1989-09-04 Hitachi Ltd 半導体装置
JPH0269962A (ja) * 1988-09-05 1990-03-08 Sumitomo Electric Ind Ltd 半導体デバイス製造装置
JP2744740B2 (ja) * 1992-09-30 1998-04-28 三菱電機株式会社 半導体装置
US5900675A (en) * 1997-04-21 1999-05-04 International Business Machines Corporation Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
US6288900B1 (en) * 1999-12-02 2001-09-11 International Business Machines Corporation Warpage compensating heat spreader
JP3881488B2 (ja) * 1999-12-13 2007-02-14 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する電子機器
US7061102B2 (en) * 2001-06-11 2006-06-13 Xilinx, Inc. High performance flipchip package that incorporates heat removal with minimal thermal mismatch
JP3868777B2 (ja) * 2001-09-11 2007-01-17 株式会社東芝 半導体装置
US6748350B2 (en) * 2001-09-27 2004-06-08 Intel Corporation Method to compensate for stress between heat spreader and thermal interface material
US6848172B2 (en) * 2001-12-21 2005-02-01 Intel Corporation Device and method for package warp compensation in an integrated heat spreader
US20050155743A1 (en) * 2002-06-28 2005-07-21 Getz George Jr. Composite heat sink with metal base and graphite fins
US6930884B2 (en) * 2003-06-11 2005-08-16 Hewlett-Packard Development Company, L.P. Land grid array assembly using a compressive liquid
JP2005217295A (ja) * 2004-01-30 2005-08-11 Renesas Technology Corp 半導体装置の製造方法
JP2006049732A (ja) * 2004-08-09 2006-02-16 Sony Corp 半導体パッケージの製造方法および半導体パッケージの製造装置
US7319591B2 (en) * 2005-05-26 2008-01-15 International Business Machines Corporation Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
US20070166554A1 (en) * 2006-01-18 2007-07-19 Ruchert Brian D Thermal interconnect and interface systems, methods of production and uses thereof
US20080157345A1 (en) * 2006-12-29 2008-07-03 Daoqiang Lu Curved heat spreader design for electronic assemblies
US7851906B2 (en) * 2007-03-26 2010-12-14 Endicott Interconnect Technologies, Inc. Flexible circuit electronic package with standoffs
JP5309472B2 (ja) * 2007-05-30 2013-10-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7795724B2 (en) * 2007-08-30 2010-09-14 International Business Machines Corporation Sandwiched organic LGA structure
US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation

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