JP2009158764A5 - - Google Patents

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Publication number
JP2009158764A5
JP2009158764A5 JP2007336212A JP2007336212A JP2009158764A5 JP 2009158764 A5 JP2009158764 A5 JP 2009158764A5 JP 2007336212 A JP2007336212 A JP 2007336212A JP 2007336212 A JP2007336212 A JP 2007336212A JP 2009158764 A5 JP2009158764 A5 JP 2009158764A5
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dummy
semiconductor substrate
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JP2007336212A
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Japanese (ja)
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JP2009158764A (ja
JP5157427B2 (ja
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JP2007336212A 2007-12-27 2007-12-27 積層型半導体装置、半導体基板及び積層型半導体装置の製造方法。 Active JP5157427B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007336212A JP5157427B2 (ja) 2007-12-27 2007-12-27 積層型半導体装置、半導体基板及び積層型半導体装置の製造方法。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007336212A JP5157427B2 (ja) 2007-12-27 2007-12-27 積層型半導体装置、半導体基板及び積層型半導体装置の製造方法。

Publications (3)

Publication Number Publication Date
JP2009158764A JP2009158764A (ja) 2009-07-16
JP2009158764A5 true JP2009158764A5 (enExample) 2011-05-12
JP5157427B2 JP5157427B2 (ja) 2013-03-06

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ID=40962449

Family Applications (1)

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JP2007336212A Active JP5157427B2 (ja) 2007-12-27 2007-12-27 積層型半導体装置、半導体基板及び積層型半導体装置の製造方法。

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JP (1) JP5157427B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5271562B2 (ja) * 2008-02-15 2013-08-21 本田技研工業株式会社 半導体装置および半導体装置の製造方法
US8012802B2 (en) * 2010-02-04 2011-09-06 Headway Technologies, Inc. Method of manufacturing layered chip package
KR101242614B1 (ko) 2010-12-17 2013-03-19 에스케이하이닉스 주식회사 반도체 집적회로
JP5780498B2 (ja) * 2011-01-25 2015-09-16 独立行政法人国立高等専門学校機構 Ｃｍｏｓ論理ｉｃパッケージの検査方法および検査装置
KR20130016466A (ko) 2011-08-08 2013-02-18 삼성전자주식회사 반도체 패키지
JP2013183120A (ja) * 2012-03-05 2013-09-12 Elpida Memory Inc 半導体装置
JP6021378B2 (ja) 2012-03-29 2016-11-09 オリンパス株式会社 基板および半導体装置
JP6616143B2 (ja) * 2015-09-28 2019-12-04 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
CN108288590B (zh) * 2017-01-09 2020-03-10 中芯国际集成电路制造(上海)有限公司 凸块封装方法
JP2023045675A (ja) 2021-09-22 2023-04-03 キオクシア株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076247A (ja) * 2000-08-25 2002-03-15 Matsushita Electric Ind Co Ltd 積層型半導体装置およびその製造方法
TWI425604B (zh) * 2004-07-26 2014-02-01 倫巴士公司 半導體裝置

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