JP2000307057A5 - - Google Patents

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Publication number
JP2000307057A5
JP2000307057A5 JP2000004034A JP2000004034A JP2000307057A5 JP 2000307057 A5 JP2000307057 A5 JP 2000307057A5 JP 2000004034 A JP2000004034 A JP 2000004034A JP 2000004034 A JP2000004034 A JP 2000004034A JP 2000307057 A5 JP2000307057 A5 JP 2000307057A5
Authority
JP
Japan
Prior art keywords
bonding
wire
layer
semiconductor device
lower layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000004034A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000307057A (ja
JP3662461B2 (ja
Filing date
Publication date
Priority claimed from JP2000004034A external-priority patent/JP3662461B2/ja
Priority to JP2000004034A priority Critical patent/JP3662461B2/ja
Application filed filed Critical
Priority to TW89101562A priority patent/TW444308B/zh
Priority to KR10-2000-0006756A priority patent/KR100379608B1/ko
Publication of JP2000307057A publication Critical patent/JP2000307057A/ja
Priority to US10/162,864 priority patent/US20020158325A1/en
Priority to US11/028,861 priority patent/US7276437B2/en
Publication of JP2000307057A5 publication Critical patent/JP2000307057A5/ja
Publication of JP3662461B2 publication Critical patent/JP3662461B2/ja
Application granted granted Critical
Priority to US11/802,969 priority patent/US7528011B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000004034A 1999-02-17 2000-01-12 半導体装置、およびその製造方法 Expired - Fee Related JP3662461B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000004034A JP3662461B2 (ja) 1999-02-17 2000-01-12 半導体装置、およびその製造方法
TW89101562A TW444308B (en) 1999-02-17 2000-01-29 Semiconductor device and manufacturing method thereof
KR10-2000-0006756A KR100379608B1 (ko) 1999-02-17 2000-02-14 반도체장치 및 그의 제조방법
US10/162,864 US20020158325A1 (en) 1999-02-17 2002-06-06 Semiconductor device and manufacturing method thereof
US11/028,861 US7276437B2 (en) 1999-02-17 2005-01-05 Semiconductor device and manufacturing method thereof
US11/802,969 US7528011B2 (en) 1999-02-17 2007-05-29 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3890999 1999-02-17
JP11-38909 1999-02-17
JP2000004034A JP3662461B2 (ja) 1999-02-17 2000-01-12 半導体装置、およびその製造方法

Publications (3)

Publication Number Publication Date
JP2000307057A JP2000307057A (ja) 2000-11-02
JP2000307057A5 true JP2000307057A5 (enExample) 2005-04-14
JP3662461B2 JP3662461B2 (ja) 2005-06-22

Family

ID=26378208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000004034A Expired - Fee Related JP3662461B2 (ja) 1999-02-17 2000-01-12 半導体装置、およびその製造方法

Country Status (4)

Country Link
US (3) US20020158325A1 (enExample)
JP (1) JP3662461B2 (enExample)
KR (1) KR100379608B1 (enExample)
TW (1) TW444308B (enExample)

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US8399973B2 (en) * 2007-12-20 2013-03-19 Mosaid Technologies Incorporated Data storage and stackable configurations
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JP5205173B2 (ja) * 2008-08-08 2013-06-05 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
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KR100935854B1 (ko) 2009-09-22 2010-01-08 테세라 리써치 엘엘씨 와이어 본딩 및 기준 와이어 본딩에 의해 제어되는 임피던스를 가진 마이크로전자 어셈블리
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JP5062283B2 (ja) * 2009-04-30 2012-10-31 日亜化学工業株式会社 半導体装置及びその製造方法
JP5497392B2 (ja) 2009-09-25 2014-05-21 ルネサスエレクトロニクス株式会社 半導体装置
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JP5266371B2 (ja) * 2011-08-04 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP2011244022A (ja) * 2011-09-09 2011-12-01 Renesas Electronics Corp 半導体装置の製造方法
KR20130042210A (ko) 2011-10-18 2013-04-26 삼성전자주식회사 멀티-칩 패키지 및 그의 제조 방법
TWI518814B (zh) 2013-04-15 2016-01-21 新川股份有限公司 半導體裝置以及半導體裝置的製造方法
JP6196092B2 (ja) * 2013-07-30 2017-09-13 ルネサスエレクトロニクス株式会社 半導体装置
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US11373974B2 (en) 2016-07-01 2022-06-28 Intel Corporation Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size
CN111933605A (zh) * 2020-08-10 2020-11-13 紫光宏茂微电子(上海)有限公司 芯片焊接结构及焊接方法
CN114783884A (zh) * 2022-03-01 2022-07-22 山东山铝电子技术有限公司 一种新型智能卡非接触模块封装工艺

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