TW444308B - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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Publication number
TW444308B
TW444308B TW89101562A TW89101562A TW444308B TW 444308 B TW444308 B TW 444308B TW 89101562 A TW89101562 A TW 89101562A TW 89101562 A TW89101562 A TW 89101562A TW 444308 B TW444308 B TW 444308B
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor wafer
lead
time
layers
Prior art date
Application number
TW89101562A
Other languages
English (en)
Chinese (zh)
Inventor
Yuji Yano
Atsuya Namii
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Application granted granted Critical
Publication of TW444308B publication Critical patent/TW444308B/zh

Links

Classifications

    • H10W90/00—
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B53/00—Golf clubs
    • A63B53/14—Handles
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B53/00—Golf clubs
    • A63B53/08—Golf clubs with special arrangements for obtaining a variable impact
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B60/00—Details or accessories of golf clubs, bats, rackets or the like
    • A63B60/06—Handles
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B2102/00—Application of clubs, bats, rackets or the like to the sporting activity ; particular sports involving the use of balls and clubs, bats, rackets, or the like
    • A63B2102/32—Golf
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/537—
    • H10W72/5434—
    • H10W72/547—
    • H10W72/5473—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W72/952—
    • H10W74/00—
    • H10W90/20—
    • H10W90/732—
    • H10W90/734—
    • H10W90/752—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Physical Education & Sports Medicine (AREA)
  • Wire Bonding (AREA)
TW89101562A 1999-02-17 2000-01-29 Semiconductor device and manufacturing method thereof TW444308B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3890999 1999-02-17
JP2000004034A JP3662461B2 (ja) 1999-02-17 2000-01-12 半導体装置、およびその製造方法

Publications (1)

Publication Number Publication Date
TW444308B true TW444308B (en) 2001-07-01

Family

ID=26378208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89101562A TW444308B (en) 1999-02-17 2000-01-29 Semiconductor device and manufacturing method thereof

Country Status (4)

Country Link
US (3) US20020158325A1 (enExample)
JP (1) JP3662461B2 (enExample)
KR (1) KR100379608B1 (enExample)
TW (1) TW444308B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114783884A (zh) * 2022-03-01 2022-07-22 山东山铝电子技术有限公司 一种新型智能卡非接触模块封装工艺

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JP5205173B2 (ja) * 2008-08-08 2013-06-05 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114783884A (zh) * 2022-03-01 2022-07-22 山东山铝电子技术有限公司 一种新型智能卡非接触模块封装工艺

Also Published As

Publication number Publication date
US7276437B2 (en) 2007-10-02
US20070232054A1 (en) 2007-10-04
JP3662461B2 (ja) 2005-06-22
KR100379608B1 (ko) 2003-04-10
US20020158325A1 (en) 2002-10-31
JP2000307057A (ja) 2000-11-02
KR20000058032A (ko) 2000-09-25
US20050148175A1 (en) 2005-07-07
US7528011B2 (en) 2009-05-05

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