JP2013524486A5 - - Google Patents

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Publication number
JP2013524486A5
JP2013524486A5 JP2013501282A JP2013501282A JP2013524486A5 JP 2013524486 A5 JP2013524486 A5 JP 2013524486A5 JP 2013501282 A JP2013501282 A JP 2013501282A JP 2013501282 A JP2013501282 A JP 2013501282A JP 2013524486 A5 JP2013524486 A5 JP 2013524486A5
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JP
Japan
Prior art keywords
array
solder
semiconductor
semiconductor chip
substrate
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JP2013501282A
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English (en)
Japanese (ja)
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JP5505918B2 (ja
JP2013524486A (ja
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Priority claimed from US12/731,487 external-priority patent/US8114707B2/en
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Publication of JP2013524486A publication Critical patent/JP2013524486A/ja
Publication of JP2013524486A5 publication Critical patent/JP2013524486A5/ja
Application granted granted Critical
Publication of JP5505918B2 publication Critical patent/JP5505918B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013501282A 2010-03-25 2011-03-03 半導体チップの多チップ・アセンブリを形成する方法 Expired - Fee Related JP5505918B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/731,487 US8114707B2 (en) 2010-03-25 2010-03-25 Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip
US12/731,487 2010-03-25
PCT/US2011/026957 WO2011119308A2 (en) 2010-03-25 2011-03-03 Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip

Publications (3)

Publication Number Publication Date
JP2013524486A JP2013524486A (ja) 2013-06-17
JP2013524486A5 true JP2013524486A5 (enExample) 2013-10-10
JP5505918B2 JP5505918B2 (ja) 2014-05-28

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ID=44656947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013501282A Expired - Fee Related JP5505918B2 (ja) 2010-03-25 2011-03-03 半導体チップの多チップ・アセンブリを形成する方法

Country Status (5)

Country Link
US (1) US8114707B2 (enExample)
JP (1) JP5505918B2 (enExample)
CN (1) CN103003938B (enExample)
GB (1) GB2492026B (enExample)
WO (1) WO2011119308A2 (enExample)

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US10797039B2 (en) * 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
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CN111293046B (zh) * 2020-02-20 2022-05-03 西安微电子技术研究所 一种芯片与tsv硅基板的倒扣焊接方法
US11532582B2 (en) 2020-08-25 2022-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device package and method of manufacture
US20230093258A1 (en) * 2021-09-23 2023-03-23 Intel Corporation Glass patch integration into an electronic device package
CN114446806A (zh) * 2021-12-28 2022-05-06 深圳市紫光同创电子有限公司 裸片到裸片的互连电路中半导体组件、集成电路封装方法
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