JP2013524486A - 半導体チップの多チップ・アセンブリを形成する方法 - Google Patents
半導体チップの多チップ・アセンブリを形成する方法 Download PDFInfo
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Abstract
【解決手段】第1のはんだボール(250)のアレイをリフローすることによって、第1のはんだパッド(192)のアレイを有する第1の基板(101)の前側に暫定基板(901)を接合する。裏側を除去することによって第1の基板(101)を薄くし、第1の基板(101)の裏側面に第2のはんだパッド(142)のアレイを形成する。第1の基板(101)および暫定基板(901)のアセンブリをダイシングして複数の積層を形成する。その各々は、第1の半導体チップ(100)およびハンドル部分(900)のアセンブリを含む。第2のはんだボール(150)のアレイを介して、アセンブリに第2の半導体チップ(200)を接合する。第1のはんだボール(250)のアレイをリフローすることによって各アセンブリからハンドル部分(900)を除去するが、第2のはんだボール(150)のアレイはリフローしない。続いて、第1のはんだボール(250)のアレイを用いてパッケージング基板(300)にアセンブリを搭載する。
【選択図】図7
Description
Claims (20)
- 半導体チップの多チップ・アセンブリを形成する方法であって、
半導体基板(101)上の第1のはんだパッド(192)のアレイに接合する第1のはんだボール(250)のアレイを介して、前記半導体基板(101)を暫定基板(901)に接合することによって、積層基板アセンブリを形成することと、
前記積層基板アセンブリをダイシングして複数の積層暫定構造を形成することであって、前記複数の積層暫定構造の各々が、前記半導体基板(101)の部分である第1の半導体チップ(100)および前記暫定基板(901)の部分であるハンドル部分(900)を含む、ことと、
前記複数の積層暫定構造間で積層暫定構造に第2の半導体チップ(200)を接合することであって、前記積層暫定構造における前記第1の半導体チップ(100)上に位置する第2のはんだパッド(142)のアレイおよび前記第2の半導体チップ(200)上に位置する第3のはんだパッド(242)のアレイに第2のはんだボール(150)のアレイを接合する、ことと、
前記積層暫定構造から前記ハンドル部分(900)を取り外して積層半導体チップ構造(400)を形成することと、
前記積層半導体チップ構造(400)を含む少なくとも1つの積層半導体チップ構造をパッケージング基板(300)に接合することによって半導体チップの多チップ・アセンブリを形成することと、
を含む、方法。 - 前記積層半導体チップ構造(400)が、上方から下方に、前記第2の半導体チップ(200)、前記第3のはんだパッド(242)のアレイ、前記第2のはんだボール(150)のアレイ、前記第2のはんだパッド(142)のアレイ、第1の半導体チップ(100)、前記第1のはんだパッド(192)のアレイの部分、および前記第1のはんだボール(250)のアレイの部分を含む、請求項1に記載の方法。
- 前記積層半導体チップ構造(400)が、前記第1のはんだボール(250)の前記アレイの部分を介して前記パッケージング基板(300)に接合される、請求項1に記載の方法。
- 前記パッケージング基板(300)の表面上にパッケージ側接合パッド(292)のアレイを形成することを更に含み、前記積層半導体チップ構造(400)が、前記パッケージ側接合パッド(292)のアレイおよび前記積層半導体チップ構造(400)における前記第1の半導体チップ(100)上の前記第1のはんだパッド(192)のアレイの部分に接合する前記第1のはんだボール(250)のアレイの部分を介して、前記パッケージング基板(300)に接合される、請求項3に記載の方法。
- 前記パッケージング基板(300)に別の積層半導体チップ構造を接合することを更に含み、前記積層半導体チップ構造(400)が、上方から下方に、前記第2の半導体チップ(200)、前記第3のはんだパッド(242)のアレイ、前記第2のはんだボール(150)のアレイ、前記第2のはんだパッド(142)のアレイ、前記第1の半導体チップ(100)、前記第1のはんだパッド(192)のアレイの部分、および前記第1のはんだボール(250)のアレイの部分を含み、前記別の積層半導体チップ構造が、上方から下方に、別の第2の半導体チップ、別の第3のはんだパッドのアレイ、別の第2のはんだボールのアレイ、別の第2のはんだパッドのアレイ、別の第1の半導体チップ、前記第1のはんだパッドのアレイの別の部分、および前記第1のはんだボールのアレイの別の部分を含む、請求項3に記載の方法。
- 前記半導体基板(101)が金属相互接続構造層および半導体層(110)の積層を含み、前記第1のはんだパッド(192)のアレイが前記金属相互接続構造層の外面上に直接形成されている、請求項1に記載の方法。
- 前記暫定基板(901)が前記半導体基板(101)に接合されている間であって前記ダイシングの前に前記半導体基板(101)を薄くすることを更に含む、請求項1に記載の方法。
- 前記第2のはんだパッド(142)のアレイが、前記薄くすることの後であって前記ダイシングの前に、薄くした半導体層の表面上に形成される、請求項7に記載の方法。
- 前記暫定基板(901)に対する前記半導体基板(101)の前記接合の前に、前記半導体基板(101)の半導体層において導電性スタッド(111)のアレイを形成することを更に含み、前記導電性スタッド(111)の前記アレイが、少なくとも前記半導体層(110)と金属相互接続構造層との間の界面から前記半導体層(110)内のある深さまで延在する、請求項1に記載の方法。
- 前記暫定基板(901)が前記半導体基板(101)に接合されている間であって前記ダイシングの前に前記半導体基板(101)を薄くすることを更に含み、前記導電性スタッド(111)の前記アレイが、前記薄くすることの後に少なくとも前記界面から前記半導体層(110)の露出面まで延在する基板貫通バイア(TSV)(112)のアレイを構成する、請求項9に記載の方法。
- 前記第2のはんだパッド(142)の前記アレイが、前記薄くすることの後に前記半導体層(110)の前記露出面上に直接形成される、請求項10に記載の方法。
- 前記半導体基板(101)が第1の半導体層(110)および第1の金属相互接続構造層の積層を含み、前記第2の半導体チップ(200)が第2の半導体層(210)および第2の金属相互接続層の積層を含み、前記第1のはんだパッド(192)の前記アレイが前記第1の金属相互接続構造層の上に直接形成され、前記第3のはんだパッド(242)の前記アレイが前記第2の金属相互接続構造層の上に直接形成される、請求項1に記載の方法。
- 前記第2のはんだパッド(142)の前記アレイが、前記第1の半導体層(110)の表面上に直接形成され、前記第1の金属相互接続構造層に接触しない、請求項12に記載の方法。
- 前記第1の半導体層(110)が少なくとも1つの第1の半導体デバイス(120)を含み、前記第2の半導体層(210)が少なくとも1つの第2の半導体デバイス(220)を含む、請求項12に記載の方法。
- 前記暫定基板(901)が半導体デバイスを含まない、請求項14に記載の方法。
- 前記積層暫定構造内の前記第1の半導体チップ(100)およびハンドル部分が、相互に一致する水平方向の断面形状を有する、請求項1に記載の方法。
- 前記第1のはんだボール(250)の前記アレイが第1のはんだ材料から成り、前記第2のはんだボール(150)の前記アレイが第2のはんだ材料から成り、前記第1のはんだ材料が前記第2のはんだ材料よりもリフロー温度が低い、請求項1に記載の方法。
- 前記暫定基板(901)上にはんだパッド(992)のアレイを形成することを更に含み、前記第1のはんだボール(250)のアレイにおける各第1のはんだボールについて、前記はんだパッド(992)のアレイのはんだパッドとの接触面積が、前記第1のはんだパッド(192)のアレイの第1のはんだパッドとの接触面積よりも小さい、請求項1に記載の方法。
- 前記第1の半導体チップ(100)と前記第2の半導体チップ(200)との間に第1の誘電アンダーフィル層(152)を形成することと、
前記第1の半導体チップ(100)と前記パッケージング基板(300)との間に第2の誘電アンダーフィル層(252)を形成することと、
を更に含む、請求項1に記載の方法。 - 前記パッケージング基板(300)がセラミック・パッケージング基板またはラミネート・パッケージング基板であり、前記第1の半導体チップ(100)がプロセッサ・チップであり、前記第2の半導体チップ(200)がスタティック・ランダム・アクセス・メモリ(SRAM)・チップ、ダイナミック・ランダム・アクセス・メモリ(DRAM)・チップ、または不揮発性メモリ・チップである、請求項1に記載の方法。
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US12/731,487 | 2010-03-25 | ||
PCT/US2011/026957 WO2011119308A2 (en) | 2010-03-25 | 2011-03-03 | Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip |
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GB2492026B (en) | 2013-09-04 |
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US20110237026A1 (en) | 2011-09-29 |
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