JP2013069808A5 - - Google Patents

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Publication number
JP2013069808A5
JP2013069808A5 JP2011206550A JP2011206550A JP2013069808A5 JP 2013069808 A5 JP2013069808 A5 JP 2013069808A5 JP 2011206550 A JP2011206550 A JP 2011206550A JP 2011206550 A JP2011206550 A JP 2011206550A JP 2013069808 A5 JP2013069808 A5 JP 2013069808A5
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JP
Japan
Prior art keywords
insulating layer
semiconductor chip
sealing insulating
support
forming
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JP2011206550A
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English (en)
Japanese (ja)
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JP2013069808A (ja
JP5864180B2 (ja
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Priority to JP2011206550A priority Critical patent/JP5864180B2/ja
Priority claimed from JP2011206550A external-priority patent/JP5864180B2/ja
Priority to US13/604,912 priority patent/US9041211B2/en
Publication of JP2013069808A publication Critical patent/JP2013069808A/ja
Publication of JP2013069808A5 publication Critical patent/JP2013069808A5/ja
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Publication of JP5864180B2 publication Critical patent/JP5864180B2/ja
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JP2011206550A 2011-09-21 2011-09-21 半導体パッケージ及びその製造方法 Active JP5864180B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011206550A JP5864180B2 (ja) 2011-09-21 2011-09-21 半導体パッケージ及びその製造方法
US13/604,912 US9041211B2 (en) 2011-09-21 2012-09-06 Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011206550A JP5864180B2 (ja) 2011-09-21 2011-09-21 半導体パッケージ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013069808A JP2013069808A (ja) 2013-04-18
JP2013069808A5 true JP2013069808A5 (enExample) 2014-09-04
JP5864180B2 JP5864180B2 (ja) 2016-02-17

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Family Applications (1)

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JP2011206550A Active JP5864180B2 (ja) 2011-09-21 2011-09-21 半導体パッケージ及びその製造方法

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US (1) US9041211B2 (enExample)
JP (1) JP5864180B2 (enExample)

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DE112013004495T5 (de) * 2012-09-14 2015-06-11 Ps5 Luxco S.A.R.L. Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements
KR101999114B1 (ko) * 2013-06-03 2019-07-11 에스케이하이닉스 주식회사 반도체 패키지
KR102161173B1 (ko) * 2013-08-29 2020-09-29 삼성전자주식회사 패키지 온 패키지 장치 및 이의 제조 방법
US9443758B2 (en) 2013-12-11 2016-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. Connecting techniques for stacked CMOS devices
TWI517343B (zh) * 2014-03-25 2016-01-11 恆勁科技股份有限公司 覆晶堆疊封裝結構及其製作方法
JP6388202B2 (ja) * 2014-08-07 2018-09-12 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
JP2016048768A (ja) * 2014-08-28 2016-04-07 日立化成株式会社 配線板及び半導体装置の製造方法
RU2663688C1 (ru) 2014-09-26 2018-08-08 Интел Корпорейшн Корпусированная интегральная схема, содержащая соединенный проволочными перемычками многокристальный пакет
US10325853B2 (en) 2014-12-03 2019-06-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming semiconductor packages having through package vias
JP6620989B2 (ja) * 2015-05-25 2019-12-18 パナソニックＩｐマネジメント株式会社 電子部品パッケージ
DE112017001101T5 (de) * 2016-03-01 2018-11-29 Sony Corporation Halbleitervorrichtung, elektronisches Modul, elektronische Einrichtung und Herstellungsverfahren für eine Halbleitervorrichtung
JP6771308B2 (ja) * 2016-05-02 2020-10-21 三菱電機株式会社 回路基板および半導体集積回路の実装構造
US9818729B1 (en) * 2016-06-16 2017-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package structure and method
US10840180B2 (en) 2016-10-06 2020-11-17 Mitsui Mining & Smelting Co., Ltd. Production method for multilayer wiring board
CN109716871B (zh) * 2016-10-06 2023-02-17 三井金属矿业株式会社 多层布线板的制造方法
CN116709672A (zh) 2016-11-28 2023-09-05 三井金属矿业株式会社 多层布线板的制造方法
JP6780710B2 (ja) * 2016-12-28 2020-11-04 株式会社村田製作所 回路モジュール
CN108695265A (zh) * 2017-04-11 2018-10-23 财团法人工业技术研究院 芯片封装结构及其制造方法
US11139262B2 (en) * 2019-02-07 2021-10-05 Micron Technology, Inc. Use of pre-channeled materials for anisotropic conductors
EP3934913B1 (en) * 2019-03-08 2024-09-11 H.B. Fuller Company Systems and methods for encapsulating an electronic component
US11398408B2 (en) * 2019-09-24 2022-07-26 Advanced Semiconductor Engineering, Inc. Semiconductor substrate with trace connected to via at a level within a dielectric layer
KR102765266B1 (ko) 2020-02-25 2025-02-07 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
KR20220008168A (ko) 2020-07-13 2022-01-20 삼성전자주식회사 반도체 패키지
CN112103193B (zh) * 2020-08-21 2021-12-03 珠海越亚半导体股份有限公司 一种嵌埋结构及制备方法、基板
JP7669236B2 (ja) * 2021-09-03 2025-04-28 富士フイルム株式会社 半導体実装構造体

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WO2001018864A1 (en) 1999-09-03 2001-03-15 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JP2007150346A (ja) 1999-09-03 2007-06-14 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6271469B1 (en) * 1999-11-12 2001-08-07 Intel Corporation Direct build-up layer on an encapsulated die package
JP2002134653A (ja) * 2000-10-23 2002-05-10 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法
US6680529B2 (en) * 2002-02-15 2004-01-20 Advanced Semiconductor Engineering, Inc. Semiconductor build-up package
JP2006222164A (ja) * 2005-02-08 2006-08-24 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
KR100813625B1 (ko) * 2006-11-15 2008-03-14 삼성전자주식회사 반도체 소자 패키지
JP5496445B2 (ja) 2007-06-08 2014-05-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2009260165A (ja) * 2008-04-21 2009-11-05 Casio Comput Co Ltd 半導体装置
JP2009289862A (ja) * 2008-05-28 2009-12-10 Casio Comput Co Ltd 半導体装置
JP5147755B2 (ja) * 2009-02-20 2013-02-20 新光電気工業株式会社 半導体装置及びその製造方法
TWI501376B (zh) * 2009-10-07 2015-09-21 精材科技股份有限公司 晶片封裝體及其製造方法
JP5715334B2 (ja) * 2009-10-15 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置
JP5460388B2 (ja) * 2010-03-10 2014-04-02 新光電気工業株式会社 半導体装置及びその製造方法

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