JP2011258772A5 - - Google Patents

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Publication number
JP2011258772A5
JP2011258772A5 JP2010132303A JP2010132303A JP2011258772A5 JP 2011258772 A5 JP2011258772 A5 JP 2011258772A5 JP 2010132303 A JP2010132303 A JP 2010132303A JP 2010132303 A JP2010132303 A JP 2010132303A JP 2011258772 A5 JP2011258772 A5 JP 2011258772A5
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JP
Japan
Prior art keywords
pad
insulating layer
wiring board
layer
forming
Prior art date
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Application number
JP2010132303A
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English (en)
Japanese (ja)
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JP2011258772A (ja
JP5711472B2 (ja
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Priority to JP2010132303A priority Critical patent/JP5711472B2/ja
Priority claimed from JP2010132303A external-priority patent/JP5711472B2/ja
Priority to US13/154,565 priority patent/US8749073B2/en
Publication of JP2011258772A publication Critical patent/JP2011258772A/ja
Publication of JP2011258772A5 publication Critical patent/JP2011258772A5/ja
Application granted granted Critical
Publication of JP5711472B2 publication Critical patent/JP5711472B2/ja
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JP2010132303A 2010-06-09 2010-06-09 配線基板及びその製造方法並びに半導体装置 Active JP5711472B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010132303A JP5711472B2 (ja) 2010-06-09 2010-06-09 配線基板及びその製造方法並びに半導体装置
US13/154,565 US8749073B2 (en) 2010-06-09 2011-06-07 Wiring board, method of manufacturing the same, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010132303A JP5711472B2 (ja) 2010-06-09 2010-06-09 配線基板及びその製造方法並びに半導体装置

Publications (3)

Publication Number Publication Date
JP2011258772A JP2011258772A (ja) 2011-12-22
JP2011258772A5 true JP2011258772A5 (enExample) 2013-05-16
JP5711472B2 JP5711472B2 (ja) 2015-04-30

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Family Applications (1)

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JP2010132303A Active JP5711472B2 (ja) 2010-06-09 2010-06-09 配線基板及びその製造方法並びに半導体装置

Country Status (2)

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US (1) US8749073B2 (enExample)
JP (1) JP5711472B2 (enExample)

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US9679841B2 (en) * 2014-05-13 2017-06-13 Qualcomm Incorporated Substrate and method of forming the same
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CN109803481B (zh) * 2017-11-17 2021-07-06 英业达科技有限公司 多层印刷电路板及制作多层印刷电路板的方法
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JP2021093417A (ja) * 2019-12-09 2021-06-17 イビデン株式会社 プリント配線板、及び、プリント配線板の製造方法
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