JP5768023B2 - 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 - Google Patents
電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 Download PDFInfo
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- 229920005989 resin Polymers 0.000 title claims description 76
- 239000011347 resin Substances 0.000 title claims description 76
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 41
- 229920000647 polyepoxide Polymers 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 229920005992 thermoplastic resin Polymers 0.000 claims description 17
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 16
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000004744 fabric Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000004898 kneading Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000005011 phenolic resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000005350 fused silica glass Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- -1 tetraphenylphosphonium tetraphenylborate Chemical compound 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- UHKPXKGJFOKCGG-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical compound CC(C)=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 UHKPXKGJFOKCGG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 description 1
- 230000001256 tonic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesive Tapes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
なお、平均粒径は、例えば、母集団から任意に抽出される試料を用い、レーザー回折散乱式粒度分布測定装置を用いて測定することにより導き出すことができる。
本発明の樹脂シートは、難燃剤成分を含むことが好ましい。これにより、部品のショート等による発火や燃焼の拡大を防ぐ事ができる。難燃剤組成分としては、例えば水酸化アルミニウム、水酸化マグネシウム、水酸化鉄、水酸化カルシウム、水酸化スズ、複合化金属水酸化物などの各種金属水酸化物を用いることができる。比較的少ない添加量で難燃性を発揮できる点や、コスト的な観点から水酸化アルミニウム又は水酸化マグネシウムを用いることが好ましく、水酸化アルミニウムを用いることが特に好ましい。
混練条件として、温度は、上述の各成分の軟化点以上であることが好ましく、例えば30〜150℃、エポキシ樹脂の熱硬化性を考慮すると、好ましくは40〜140℃、さらに好ましくは60〜120℃である。時間は、例えば1〜30分間、好ましくは5〜15分間である。これによって、混練物を調製することができる。
エポキシ樹脂:新日鐵化学社製のYSLV−80XY(ビスフェノールF型エポキシ樹脂)
フェノール樹脂:明和化成社製のMEH7851SS(フェノールビフェニレン)
エラストマー(熱可塑性樹脂):カネカ社製のSIBSTER 072T(ポリスチレン・ポリイソブチレン系樹脂、軟化点:150〜170℃)
球状溶融シリカ:電気化学工業社製のFB−9454FC(溶融球状シリカ、54μmカット、平均粒子径20μm)
シランカップリング剤:信越化学社製のKBM−403(3−グリシドキシプロピルトリメトキシシラン)
カーボンブラック:三菱化学社製の#20
難燃剤(有機系):伏見製薬所製のFP−100(ホスホニトリル酸フェニルエステル)
触媒:四国化成工業社製の2PHZ−PW(イミダゾール系触媒)
シリコン窒化膜:シリコン窒化膜が形成されたシリコンウェハ(トーニック社の加工品:膜厚3000Å(オングストローム)±10%、総厚み370μm±25μm)
銅板:大日本印刷社製のND−002(Cu)
FR−4:パナソニック電工社製のガラスエポキシマルチ(FR−4) R−1766(ガラス布基材エポキシ樹脂)
(実施例及び比較例)
表1に記載の配合比に従い、各成分を2軸混練り機により、60〜120℃で10分間混練し、混練物を調製した。次に、上記混練物を押出成形し、厚さ0.8mmの樹脂シートを得た。
(試験片の作成)
樹脂シートを直径3mmの円形に打ち抜いた。得られた円形の樹脂シートを用い、貯蔵粘弾性が1000Pas以下の温度領域(100℃)で、樹脂シートの厚みが0.7mm程度になるまで平板プレスで被着体に圧着し、150℃で1時間硬化させた。これにより、被着体に樹脂シートが接着硬化された試験片を得た。
(測定)
図1は、せん断接着力の測定の様子を示す図である。図1に示すように、加温可能なサンプルテーブル3上に試験片(被着体2に樹脂シート1が接着硬化したもの)をセットし、吸着させた。テストツール4を被着体2上面から0.1mm浮かせ、被着体2と樹脂シート1との接着面に平行な方向に移動速度0.2mm/sで樹脂シート1を押し、その時の荷重を測定した。
測定は、樹脂シート1が25℃及び260℃である状態で行った。
なお、260℃の測定では、試験片の樹脂シート1に熱が伝わるように、260℃のサンプルテーブル3上に試験片をセットし、30秒間待機してから測定を行った。
また、樹脂シート1の樹脂痕を測定し面積(mm2)を計算した。
(算出)
せん断接着力は下記式により算出した。
せん断荷重(N)/面積(mm2)=せん断接着力(MPa)
2 被着体
3 サンプルテーブル
4 テストツール
Claims (3)
- 樹脂成分全体に対する熱可塑性樹脂の含有量が4重量%以上30重量%以下であり、
シリコンウェハ上に形成されたシリコン窒化膜へ接着し、硬化した後のせん断接着力が、25℃において15MPa以上、かつ260℃において2MPa以上であり、
銅板へ接着し、硬化した後のせん断接着力が25℃において10MPa以上、かつ260℃において0.5MPa以上であり、
ガラス布基材エポキシ樹脂へ接着し、硬化した後のせん断接着力が25℃において10MPa以上、かつ260℃において1MPa以上であり、
混練押出により製造される電子部品封止用熱硬化性樹脂シート。 - 請求項1に記載の樹脂シートを用いて得られる樹脂封止型半導体装置。
- 請求項1に記載の樹脂シートを用いて封止する工程を含む樹脂封止型半導体装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012189025A JP5768023B2 (ja) | 2012-08-29 | 2012-08-29 | 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
KR1020130085955A KR20140029169A (ko) | 2012-08-29 | 2013-07-22 | 전자 부품 밀봉용 열경화성 수지 시트, 수지 밀봉형 반도체 장치, 및 수지 밀봉형 반도체 장치의 제조 방법 |
CN201310341826.XA CN103681530B (zh) | 2012-08-29 | 2013-08-07 | 电子部件密封用热固化性树脂片、树脂密封型半导体装置及该半导体装置的制造方法 |
TW102129883A TWI576407B (zh) | 2012-08-29 | 2013-08-20 | Thermosetting resin sheet for electronic component sealing, resin sealing type semiconductor device, and manufacturing method of resin sealed type semiconductor device |
US13/973,863 US9147625B2 (en) | 2012-08-29 | 2013-08-22 | Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device |
SG2013064712A SG2013064712A (en) | 2012-08-29 | 2013-08-26 | Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device |
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JP2012189025A JP5768023B2 (ja) | 2012-08-29 | 2012-08-29 | 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
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JP5768023B2 true JP5768023B2 (ja) | 2015-08-26 |
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US (1) | US9147625B2 (ja) |
JP (1) | JP5768023B2 (ja) |
KR (1) | KR20140029169A (ja) |
CN (1) | CN103681530B (ja) |
SG (1) | SG2013064712A (ja) |
TW (1) | TWI576407B (ja) |
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WO2018199309A1 (ja) * | 2017-04-28 | 2018-11-01 | 日立化成株式会社 | 封止用フィルム及び封止構造体、並びにこれらの製造方法 |
CN114174421A (zh) * | 2019-07-12 | 2022-03-11 | 日东电工株式会社 | 密封用树脂片 |
WO2021010204A1 (ja) * | 2019-07-12 | 2021-01-21 | 日東電工株式会社 | 封止用樹脂シート |
Family Cites Families (21)
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DE3485470D1 (de) * | 1983-10-05 | 1992-03-05 | Nippon Petrochemicals Co Ltd | Verfahren zur herstellung thermoplastischer kunststoffolien oder fuellstoffhaltiger kunststoffolien. |
JP2000212393A (ja) * | 1999-01-28 | 2000-08-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2002231755A (ja) * | 2000-12-01 | 2002-08-16 | Kanebo Ltd | 半導体パッケージおよびその製法 |
JP2003017623A (ja) * | 2001-06-29 | 2003-01-17 | Kanebo Ltd | 半導体装置及びその製造方法 |
JP5052738B2 (ja) * | 2001-10-23 | 2012-10-17 | ダウ・コーニング・コーポレイション | 熱可塑性ポリウレタン−シリコーンエラストマー |
US6936921B2 (en) * | 2002-11-11 | 2005-08-30 | Kyocera Corporation | High-frequency package |
US20070225438A1 (en) * | 2004-04-27 | 2007-09-27 | Yuji Hasegawa | Resin Paste for Die Bonding |
JP4730652B2 (ja) * | 2004-06-02 | 2011-07-20 | ナガセケムテックス株式会社 | 電子部品の製造方法 |
JP4628912B2 (ja) * | 2005-09-09 | 2011-02-09 | 信越化学工業株式会社 | 封止用エポキシ樹脂組成物 |
JP2007302771A (ja) * | 2006-05-10 | 2007-11-22 | Shin Etsu Chem Co Ltd | 封止用エポキシ樹脂組成物 |
JP2008060523A (ja) | 2006-08-01 | 2008-03-13 | Hitachi Chem Co Ltd | 封止フィルム及びそれを用いた半導体装置 |
TW200837137A (en) * | 2007-01-26 | 2008-09-16 | Hitachi Chemical Co Ltd | Sealing film and semiconductor device using the same |
JP5133598B2 (ja) * | 2007-05-17 | 2013-01-30 | 日東電工株式会社 | 封止用熱硬化型接着シート |
JP4626659B2 (ja) * | 2008-03-13 | 2011-02-09 | ソニー株式会社 | 表示装置 |
KR20110049921A (ko) | 2008-09-11 | 2011-05-12 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 장치 및 반도체 장치에 이용되는 수지 조성물 |
JP5737185B2 (ja) * | 2009-11-13 | 2015-06-17 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
JP5711472B2 (ja) * | 2010-06-09 | 2015-04-30 | 新光電気工業株式会社 | 配線基板及びその製造方法並びに半導体装置 |
JP2012046657A (ja) * | 2010-08-27 | 2012-03-08 | Idemitsu Kosan Co Ltd | 半導体封止用エポキシ樹脂成形材料及び蓄熱性成形体 |
JP5630652B2 (ja) * | 2011-01-06 | 2014-11-26 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料および電子部品装置 |
JP5354753B2 (ja) * | 2011-01-13 | 2013-11-27 | 信越化学工業株式会社 | アンダーフィル材及び半導体装置 |
JP2013161895A (ja) * | 2012-02-03 | 2013-08-19 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
-
2012
- 2012-08-29 JP JP2012189025A patent/JP5768023B2/ja not_active Expired - Fee Related
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2013
- 2013-07-22 KR KR1020130085955A patent/KR20140029169A/ko not_active Application Discontinuation
- 2013-08-07 CN CN201310341826.XA patent/CN103681530B/zh not_active Expired - Fee Related
- 2013-08-20 TW TW102129883A patent/TWI576407B/zh not_active IP Right Cessation
- 2013-08-22 US US13/973,863 patent/US9147625B2/en not_active Expired - Fee Related
- 2013-08-26 SG SG2013064712A patent/SG2013064712A/en unknown
Also Published As
Publication number | Publication date |
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SG2013064712A (en) | 2014-03-28 |
US9147625B2 (en) | 2015-09-29 |
KR20140029169A (ko) | 2014-03-10 |
US20140061955A1 (en) | 2014-03-06 |
CN103681530A (zh) | 2014-03-26 |
TWI576407B (zh) | 2017-04-01 |
JP2014049494A (ja) | 2014-03-17 |
CN103681530B (zh) | 2018-02-13 |
TW201414797A (zh) | 2014-04-16 |
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