JP2011029581A5 - - Google Patents

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Publication number
JP2011029581A5
JP2011029581A5 JP2009266485A JP2009266485A JP2011029581A5 JP 2011029581 A5 JP2011029581 A5 JP 2011029581A5 JP 2009266485 A JP2009266485 A JP 2009266485A JP 2009266485 A JP2009266485 A JP 2009266485A JP 2011029581 A5 JP2011029581 A5 JP 2011029581A5
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JP
Japan
Prior art keywords
chip
resin
bonding wire
semiconductor
semiconductor chip
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JP2009266485A
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English (en)
Japanese (ja)
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JP2011029581A (ja
JP5700927B2 (ja
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Priority to JP2009266485A priority Critical patent/JP5700927B2/ja
Priority claimed from JP2009266485A external-priority patent/JP5700927B2/ja
Priority to US12/626,069 priority patent/US8394678B2/en
Publication of JP2011029581A publication Critical patent/JP2011029581A/ja
Publication of JP2011029581A5 publication Critical patent/JP2011029581A5/ja
Application granted granted Critical
Publication of JP5700927B2 publication Critical patent/JP5700927B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009266485A 2008-11-28 2009-11-24 半導体装置及び半導体装置の製造方法 Expired - Fee Related JP5700927B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009266485A JP5700927B2 (ja) 2008-11-28 2009-11-24 半導体装置及び半導体装置の製造方法
US12/626,069 US8394678B2 (en) 2008-11-28 2009-11-25 Semiconductor chip stacked body and method of manufacturing the same

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008305187 2008-11-28
JP2008305187 2008-11-28
JP2009010828 2009-01-21
JP2009010828 2009-01-21
JP2009149116 2009-06-23
JP2009149116 2009-06-23
JP2009266485A JP5700927B2 (ja) 2008-11-28 2009-11-24 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2011029581A JP2011029581A (ja) 2011-02-10
JP2011029581A5 true JP2011029581A5 (enExample) 2012-12-06
JP5700927B2 JP5700927B2 (ja) 2015-04-15

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ID=42222015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009266485A Expired - Fee Related JP5700927B2 (ja) 2008-11-28 2009-11-24 半導体装置及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US8394678B2 (enExample)
JP (1) JP5700927B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4776675B2 (ja) * 2008-10-31 2011-09-21 株式会社東芝 半導体メモリカード
MY152355A (en) 2011-04-11 2014-09-15 Carsem M Sdn Bhd Short and low loop wire bonding
CN108269792A (zh) * 2011-05-18 2018-07-10 晟碟半导体（上海）有限公司 瀑布引线键合
KR20120135626A (ko) * 2011-06-07 2012-12-17 삼성전자주식회사 반도체 칩 패키지의 제조 방법
MY181180A (en) 2011-09-09 2020-12-21 Carsem M Sdn Bhd Low loop wire bonding
US9595487B2 (en) * 2013-06-25 2017-03-14 Infineon Technologies Ag Circuit arrangement and method for manufacturing the same
CN106686932B (zh) * 2015-11-05 2019-12-13 精能医学股份有限公司 植入式电子装置的防水结构
FR3048123B1 (fr) * 2016-02-19 2018-11-16 3D Plus Procede d'interconnexion chip on chip miniaturisee d'un module electronique 3d
US10923456B2 (en) * 2018-12-20 2021-02-16 Cerebras Systems Inc. Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die
JP7494067B2 (ja) 2020-09-14 2024-06-03 キオクシア株式会社 半導体装置の製造方法、及び半導体製造装置
CN113851397B (zh) * 2021-09-07 2025-06-10 长江存储科技有限责任公司 一种堆叠封装芯片的开封方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5675180A (en) 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
JP3847432B2 (ja) * 1997-12-25 2006-11-22 沖電気工業株式会社 樹脂封止半導体装置及びその製造方法
US6207474B1 (en) * 1998-03-09 2001-03-27 Micron Technology, Inc. Method of forming a stack of packaged memory die and resulting apparatus
US6291894B1 (en) * 1998-08-31 2001-09-18 Micron Technology, Inc. Method and apparatus for a semiconductor package for vertical surface mounting
JP3476383B2 (ja) * 1999-05-27 2003-12-10 シャープ株式会社 半導体積層パッケージ
JP2001156250A (ja) * 1999-11-24 2001-06-08 Seiko Epson Corp 半導体チップ、マルチチップパッケージ，および半導体装置と、並びに、それを用いた電子機器
JP4361670B2 (ja) * 2000-08-02 2009-11-11 富士通マイクロエレクトロニクス株式会社 半導体素子積層体、半導体素子積層体の製造方法、及び半導体装置
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
JP4398305B2 (ja) * 2004-06-02 2010-01-13 カシオ計算機株式会社 半導体装置およびその製造方法
US20070158807A1 (en) * 2005-12-29 2007-07-12 Daoqiang Lu Edge interconnects for die stacking
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
US7892894B2 (en) * 2007-09-20 2011-02-22 Stats Chippac Ltd. Method of manufacturing integrated circuit package system with warp-free chip
US7843046B2 (en) * 2008-02-19 2010-11-30 Vertical Circuits, Inc. Flat leadless packages and stacked leadless package assemblies

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