JP2013008941A - 発光素子モジュール - Google Patents

発光素子モジュール Download PDF

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Publication number
JP2013008941A
JP2013008941A JP2012051938A JP2012051938A JP2013008941A JP 2013008941 A JP2013008941 A JP 2013008941A JP 2012051938 A JP2012051938 A JP 2012051938A JP 2012051938 A JP2012051938 A JP 2012051938A JP 2013008941 A JP2013008941 A JP 2013008941A
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JP
Japan
Prior art keywords
light emitting
emitting element
dam
module according
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012051938A
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English (en)
Japanese (ja)
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JP2013008941A5 (enExample
Inventor
Jung-Sok Park
パク・ジュンソク
Ho-Jin Lee
イ・ホジン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110060540A external-priority patent/KR101894349B1/ko
Priority claimed from KR1020110064717A external-priority patent/KR101813166B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2013008941A publication Critical patent/JP2013008941A/ja
Publication of JP2013008941A5 publication Critical patent/JP2013008941A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2012051938A 2011-06-22 2012-03-08 発光素子モジュール Pending JP2013008941A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0060540 2011-06-22
KR1020110060540A KR101894349B1 (ko) 2011-06-22 2011-06-22 발광소자 패키지 및 이를 포함하는 조명시스템
KR1020110064717A KR101813166B1 (ko) 2011-06-30 2011-06-30 발광소자 모듈 및 이를 포함하는 조명시스템
KR10-2011-0064717 2011-06-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016224526A Division JP6339161B2 (ja) 2011-06-22 2016-11-17 発光素子パッケージ

Publications (2)

Publication Number Publication Date
JP2013008941A true JP2013008941A (ja) 2013-01-10
JP2013008941A5 JP2013008941A5 (enExample) 2015-04-23

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012051938A Pending JP2013008941A (ja) 2011-06-22 2012-03-08 発光素子モジュール
JP2016224526A Active JP6339161B2 (ja) 2011-06-22 2016-11-17 発光素子パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016224526A Active JP6339161B2 (ja) 2011-06-22 2016-11-17 発光素子パッケージ

Country Status (4)

Country Link
US (2) US8878215B2 (enExample)
EP (1) EP2538462B1 (enExample)
JP (2) JP2013008941A (enExample)
TW (1) TWI546984B (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012287A (ja) * 2013-06-27 2015-01-19 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2017112211A (ja) * 2015-12-16 2017-06-22 豊田合成株式会社 発光装置の製造方法
JP2018037197A (ja) * 2016-08-30 2018-03-08 東芝ライテック株式会社 車両用照明装置、および車両用灯具
JP2019080028A (ja) * 2017-10-20 2019-05-23 日亜化学工業株式会社 発光装置
KR102022463B1 (ko) * 2018-03-22 2019-09-19 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
JP2019192778A (ja) * 2018-04-25 2019-10-31 日亜化学工業株式会社 発光装置の製造方法及び発光装置
US10971657B2 (en) 2018-08-03 2021-04-06 Nichia Corporation Light emitting module and method of manufacturing the same
JP2022552470A (ja) * 2019-10-15 2022-12-16 インターナショナル・ビジネス・マシーンズ・コーポレーション 制御された毛細管作用適用範囲を有する構造体
JP2023051717A (ja) * 2021-09-30 2023-04-11 日亜化学工業株式会社 発光装置
JP2023073273A (ja) * 2020-04-02 2023-05-25 日亜化学工業株式会社 面状光源及びその製造方法
US11824148B2 (en) 2018-02-26 2023-11-21 Elphoton Inc. Semiconductor light emitting devices and method of manufacturing the same

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US8878215B2 (en) * 2011-06-22 2014-11-04 Lg Innotek Co., Ltd. Light emitting device module
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JP6476567B2 (ja) * 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
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JP6195760B2 (ja) * 2013-08-16 2017-09-13 シチズン電子株式会社 Ｌｅｄ発光装置
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CN108269899B (zh) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 发光二极管封装结构及其制造方法
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CN110611020A (zh) * 2018-06-15 2019-12-24 中华映管股份有限公司 发光元件
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JP7113390B2 (ja) * 2018-12-21 2022-08-05 豊田合成株式会社 発光装置の製造方法
CN213075617U (zh) * 2019-11-15 2021-04-30 光宝光电(常州)有限公司 光感测模块及其应用的电子装置
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JP7588547B2 (ja) * 2021-04-16 2024-11-22 スタンレー電気株式会社 半導体発光装置
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US20120326193A1 (en) 2012-12-27

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