CN101510581B - 发光二极管及其相关背光模块 - Google Patents
发光二极管及其相关背光模块 Download PDFInfo
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- CN101510581B CN101510581B CN2009100381021A CN200910038102A CN101510581B CN 101510581 B CN101510581 B CN 101510581B CN 2009100381021 A CN2009100381021 A CN 2009100381021A CN 200910038102 A CN200910038102 A CN 200910038102A CN 101510581 B CN101510581 B CN 101510581B
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- light
- emitting diode
- substrate
- backlight unit
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100381021A CN101510581B (zh) | 2009-03-19 | 2009-03-19 | 发光二极管及其相关背光模块 |
US12/503,852 US20100237360A1 (en) | 2009-03-19 | 2009-07-16 | Light emitting diode and back light module thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100381021A CN101510581B (zh) | 2009-03-19 | 2009-03-19 | 发光二极管及其相关背光模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101510581A CN101510581A (zh) | 2009-08-19 |
CN101510581B true CN101510581B (zh) | 2011-06-29 |
Family
ID=41002900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100381021A Expired - Fee Related CN101510581B (zh) | 2009-03-19 | 2009-03-19 | 发光二极管及其相关背光模块 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100237360A1 (zh) |
CN (1) | CN101510581B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
TWI396310B (zh) * | 2009-10-02 | 2013-05-11 | Everlight Electronics Co Ltd | 發光二極體結構 |
KR101108070B1 (ko) * | 2009-11-03 | 2012-02-09 | (주)더리즈 | 패키지 렌즈를 구비한 발광다이오드 패키지 |
TWI422074B (zh) * | 2010-01-07 | 2014-01-01 | 首爾半導體股份有限公司 | 非球面led鏡片以及含有此鏡片的發光元件 |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
CN102347419A (zh) * | 2010-08-03 | 2012-02-08 | 许凯淳 | 发光二极管多层封装方法及其结构 |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
TW201251140A (en) * | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US8878215B2 (en) * | 2011-06-22 | 2014-11-04 | Lg Innotek Co., Ltd. | Light emitting device module |
CN102313179B (zh) * | 2011-09-30 | 2013-03-13 | 邓旭恒 | 一种超小型大功率led节能石英灯 |
CN103346237A (zh) * | 2013-06-20 | 2013-10-09 | 苏州金科信汇光电科技有限公司 | 一种高扩散宽角度的led灯 |
CN104251417A (zh) * | 2013-06-28 | 2014-12-31 | 展晶科技(深圳)有限公司 | 光源模组 |
CN104953005A (zh) * | 2014-03-27 | 2015-09-30 | 江苏稳润光电有限公司 | 一种大功率led封装 |
KR102322336B1 (ko) * | 2015-02-06 | 2021-11-05 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
KR20180020460A (ko) * | 2016-08-18 | 2018-02-28 | 서울반도체 주식회사 | 발광 모듈 및 렌즈 |
US20180323354A1 (en) * | 2017-05-07 | 2018-11-08 | Yang Wang | Light emitting device and method for manufacturing light emitting device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101197046B1 (ko) * | 2005-01-26 | 2012-11-06 | 삼성디스플레이 주식회사 | 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치 |
KR20060135207A (ko) * | 2005-06-24 | 2006-12-29 | 엘지.필립스 엘시디 주식회사 | 휘도를 개선한 발광다이오드 램프 및 이를 이용하는백라이트 어셈블리 |
US20070269915A1 (en) * | 2006-05-16 | 2007-11-22 | Ak Wing Leong | LED devices incorporating moisture-resistant seals and having ceramic substrates |
JP2009048791A (ja) * | 2007-08-13 | 2009-03-05 | Citizen Electronics Co Ltd | バックライト及び表示装置 |
US8136967B2 (en) * | 2008-03-02 | 2012-03-20 | Lumenetix, Inc. | LED optical lens |
-
2009
- 2009-03-19 CN CN2009100381021A patent/CN101510581B/zh not_active Expired - Fee Related
- 2009-07-16 US US12/503,852 patent/US20100237360A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN101510581A (zh) | 2009-08-19 |
US20100237360A1 (en) | 2010-09-23 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131108 Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. Effective date: 20131108 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510663 GUANGZHOU, GUANGDONG PROVINCE TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20131108 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20210319 |