KR101111985B1 - 발광 소자 패키지 - Google Patents
발광 소자 패키지 Download PDFInfo
- Publication number
- KR101111985B1 KR101111985B1 KR1020090013117A KR20090013117A KR101111985B1 KR 101111985 B1 KR101111985 B1 KR 101111985B1 KR 1020090013117 A KR1020090013117 A KR 1020090013117A KR 20090013117 A KR20090013117 A KR 20090013117A KR 101111985 B1 KR101111985 B1 KR 101111985B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- lead frame
- package
- lens
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
Description
Claims (7)
- 리드 프레임;상기 리드 프레임 상에 실장되며, 빛을 발생시킬 수 있는 발광 소자;상기 리드 프레임에 결합되고, 상기 발광 소자에서 발생된 빛이 방출될 방향으로의 개구부를 한정하는 반사부와, 상기 반사부 외측에 형성되며 상기 반사부 방향으로 턱이 존재하도록 형성되어 상기 반사부 방향의 저면이 외측 방향의 저면보다 높은 단차부를 갖는, 패키지 본체부;상기 반사부에 의해 한정된 상기 개구부와 상기 단차부를 덮도록 상기 패키지 본체부 상에 배치되는 렌즈 및상기 단차부와 상기 렌즈 사이에 개재된 접착부재를 구비하는, 발광 소자 패키지.
- 제1항에 있어서,상기 단차부는 상기 반사부 외측을 일주하도록 형성된, 발광 소자 패키지.
- 삭제
- 삭제
- 제1항에 있어서,상기 접착부재는 상기 단차부와 상기 렌즈 사이에만 개재되고 상기 반사부와 상기 렌즈 사이에는 개재되지 않은, 발광 소자 패키지.
- 삭제
- 제1항에 있어서,상기 반사부는,상부를 향하여 경사진 제1 반사부 및상기 제1 반사부의 하단부에 형성되며, 그 반경이 상기 제1 반사부의 반경보다 작은 제2 반사부를 구비하는, 발광 소자 패키지.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090013117A KR101111985B1 (ko) | 2009-02-17 | 2009-02-17 | 발광 소자 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090013117A KR101111985B1 (ko) | 2009-02-17 | 2009-02-17 | 발광 소자 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100093949A KR20100093949A (ko) | 2010-08-26 |
KR101111985B1 true KR101111985B1 (ko) | 2012-03-09 |
Family
ID=42758194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090013117A KR101111985B1 (ko) | 2009-02-17 | 2009-02-17 | 발광 소자 패키지 |
Country Status (1)
Country | Link |
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KR (1) | KR101111985B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101146096B1 (ko) * | 2010-09-17 | 2012-05-16 | 주식회사 루멘스 | Led 패키지, 이를 이용한 발광 유닛 및 측면 발광형 백 라이트 유닛 |
KR101894349B1 (ko) * | 2011-06-22 | 2018-09-04 | 엘지이노텍 주식회사 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
US8878215B2 (en) | 2011-06-22 | 2014-11-04 | Lg Innotek Co., Ltd. | Light emitting device module |
KR101516358B1 (ko) | 2012-03-06 | 2015-05-04 | 삼성전자주식회사 | 발광 장치 |
KR101375225B1 (ko) * | 2012-12-28 | 2014-03-17 | 주식회사 루멘스 | 발광소자 패키지 및 이를 구비한 백라이트 유닛 |
KR101992368B1 (ko) * | 2013-02-04 | 2019-06-24 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 포함한 백라이트 유닛 |
KR101470383B1 (ko) * | 2013-04-03 | 2014-12-09 | 한국광기술원 | 봉지재 넘침 방지 구조를 갖는 엘이디 패키지 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000022217A (ja) | 1998-06-30 | 2000-01-21 | Toshiba Corp | 光半導体モジュール |
JP2005175048A (ja) | 2003-12-09 | 2005-06-30 | Sanken Electric Co Ltd | 半導体発光装置 |
KR100648628B1 (ko) * | 2005-12-29 | 2006-11-24 | 서울반도체 주식회사 | 발광 다이오드 |
KR100855062B1 (ko) * | 2007-06-26 | 2008-08-29 | 럭스피아(주) | 발광 다이오드 패키지 및 그 제조 방법 |
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2009
- 2009-02-17 KR KR1020090013117A patent/KR101111985B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000022217A (ja) | 1998-06-30 | 2000-01-21 | Toshiba Corp | 光半導体モジュール |
JP2005175048A (ja) | 2003-12-09 | 2005-06-30 | Sanken Electric Co Ltd | 半導体発光装置 |
KR100648628B1 (ko) * | 2005-12-29 | 2006-11-24 | 서울반도체 주식회사 | 발광 다이오드 |
KR100855062B1 (ko) * | 2007-06-26 | 2008-08-29 | 럭스피아(주) | 발광 다이오드 패키지 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
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KR20100093949A (ko) | 2010-08-26 |
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