JP2012509598A5 - - Google Patents

Download PDF

Info

Publication number
JP2012509598A5
JP2012509598A5 JP2011537504A JP2011537504A JP2012509598A5 JP 2012509598 A5 JP2012509598 A5 JP 2012509598A5 JP 2011537504 A JP2011537504 A JP 2011537504A JP 2011537504 A JP2011537504 A JP 2011537504A JP 2012509598 A5 JP2012509598 A5 JP 2012509598A5
Authority
JP
Japan
Prior art keywords
stencil printer
electronic
stencil
track
electronic board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011537504A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012509598A (ja
Filing date
Publication date
Priority claimed from US12/608,759 external-priority patent/US8555784B2/en
Application filed filed Critical
Publication of JP2012509598A publication Critical patent/JP2012509598A/ja
Publication of JP2012509598A5 publication Critical patent/JP2012509598A5/ja
Pending legal-status Critical Current

Links

JP2011537504A 2008-11-19 2009-11-12 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法 Pending JP2012509598A (ja)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US11595408P 2008-11-19 2008-11-19
US61/115,954 2008-11-19
US14465109P 2009-01-14 2009-01-14
US61/144,651 2009-01-14
US17680109P 2009-05-08 2009-05-08
US17680409P 2009-05-08 2009-05-08
US17681309P 2009-05-08 2009-05-08
US17681009P 2009-05-08 2009-05-08
US17680309P 2009-05-08 2009-05-08
US17679709P 2009-05-08 2009-05-08
US61/176,804 2009-05-08
US61/176,797 2009-05-08
US61/176,801 2009-05-08
US61/176,803 2009-05-08
US61/176,810 2009-05-08
US61/176,813 2009-05-08
US12/608,759 US8555784B2 (en) 2008-11-19 2009-10-29 Method of processing electronic substrates using vertically separated pass through conveyor system
US12/608,759 2009-10-29
PCT/US2009/064094 WO2010059486A1 (en) 2008-11-19 2009-11-12 Vertically separated pass through conveyor system and method in surface mount technology process equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014207460A Division JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Publications (2)

Publication Number Publication Date
JP2012509598A JP2012509598A (ja) 2012-04-19
JP2012509598A5 true JP2012509598A5 (enExample) 2012-12-27

Family

ID=42170982

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011537504A Pending JP2012509598A (ja) 2008-11-19 2009-11-12 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法
JP2014207460A Pending JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014207460A Pending JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Country Status (8)

Country Link
US (8) US8413577B2 (enExample)
EP (1) EP2364225B1 (enExample)
JP (2) JP2012509598A (enExample)
KR (1) KR101652924B1 (enExample)
CN (2) CN104302161B (enExample)
CA (1) CA2744321C (enExample)
MX (1) MX2011005315A (enExample)
WO (1) WO2010059486A1 (enExample)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5415011B2 (ja) * 2008-04-02 2014-02-12 パナソニック株式会社 スクリーン印刷装置
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
JP5590530B2 (ja) * 2010-08-03 2014-09-17 富士機械製造株式会社 基板印刷システム
US9757963B2 (en) 2010-11-01 2017-09-12 Scodix Ltd. System and method for transporting substrates
CN103338937B (zh) * 2010-11-01 2016-01-06 斯科迪克斯有限公司 运输承印材料的系统和方法
ITVR20110228A1 (it) * 2011-12-20 2013-06-21 Projecta Engineering S R L Macchina per la decorazione di prodotti
US9060437B2 (en) * 2012-02-01 2015-06-16 Illinois Tool Works Inc. System and method for operating a stencil printer
EP2876990B1 (en) * 2012-07-17 2018-10-24 FUJI Corporation Work system and work machines for substrates
US8837808B2 (en) * 2012-12-20 2014-09-16 Kinsus Interconnect Technology Corp. Method of final defect inspection
US8547548B1 (en) * 2012-12-20 2013-10-01 Kinsus Interconnect Technology Corp. Final defect inspection system
DE102013101693B9 (de) 2013-02-20 2015-11-12 Notion Systems GmbH Oberflächenbearbeitungsvorrichtung
US9126398B2 (en) * 2013-07-26 2015-09-08 Asm Assembly Systems Singapore Pte Ltd Apparatus for paste material printing, and printing method
US20150128856A1 (en) * 2013-11-14 2015-05-14 Illinois Tool Works Inc. Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus
CN106416451B (zh) * 2014-01-30 2019-03-01 株式会社富士 基板搬运装置及构成为包含该基板搬运装置的对基板作业系统
US9744727B2 (en) 2014-04-02 2017-08-29 Autodesk, Inc. Electro-mechanical 3D printing design system
KR101970794B1 (ko) * 2014-04-07 2019-04-22 한화정밀기계 주식회사 부품 실장기의 동작을 제어하는 방법
BR112016024777A8 (pt) 2014-05-01 2021-06-01 Sicpa Holding Sa sistema e método para o controle de uma linha de produção ou distribuição
JP6472805B2 (ja) * 2014-08-06 2019-02-20 株式会社Fuji 対基板作業装置
JP6387752B2 (ja) * 2014-09-04 2018-09-12 富士ゼロックス株式会社 プリンタ制御装置、プリンタ制御プログラム
JP6209285B2 (ja) * 2014-09-04 2017-10-04 ヤマハ発動機株式会社 部品実装装置および部品実装システム
CN105744823B (zh) * 2014-12-12 2018-12-18 致茂电子(苏州)有限公司 电子组件承载盘的快速定位移载方法
US10311381B2 (en) 2014-12-12 2019-06-04 Autodesk, Inc. Tool and method for conductive trace generation in a 3D model for a hybrid electro-mechanical 3D printer
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) * 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
CN104843486B (zh) * 2015-04-14 2018-02-16 苏州艾斯达克智能科技有限公司 一种smt物料输送方法及输送系统
MX368235B (es) * 2015-07-01 2019-09-25 Volkswagen De Mexico S A De C V Proceso de impresión digital de la carrocería de un vehículo.
CN106626734B (zh) * 2015-10-30 2019-03-29 深圳市登峰网印设备有限公司 一种采用丝网印刷机进行塞孔和双面防焊的丝网印刷方法
WO2017081682A1 (en) * 2015-11-10 2017-05-18 Kornit Digital Ltd. Modular printing apparatus and method
CN106793534A (zh) * 2015-11-20 2017-05-31 富泰华工业(深圳)有限公司 电路板钢网印刷方法
CN105363644B (zh) * 2015-11-20 2017-07-04 苏州光韵达光电科技有限公司 一种激光模板绷网涂覆面胶层工具
US11141919B2 (en) 2015-12-09 2021-10-12 Holo, Inc. Multi-material stereolithographic three dimensional printing
CN105800311B (zh) * 2016-05-04 2024-08-02 上海凯思尔电子有限公司 一种用于pcb生产设备的aoi自动收放板机
TWI614822B (zh) * 2016-06-29 2018-02-11 All Ring Tech Co Ltd 基板檢查方法及裝置
JP6833850B2 (ja) * 2016-07-22 2021-02-24 株式会社Fuji 基板作業システム
US10035598B2 (en) 2016-10-10 2018-07-31 Jervis B. Webb Company System and method for expanding a luggage inspection area
US10279911B2 (en) 2016-10-10 2019-05-07 Jervis B. Webb Company System and method for storing and sequencing luggage items
CN106659114B (zh) * 2016-11-26 2023-05-02 珠海市运泰利自动化设备有限公司 一种可扩展工位的装配测试台
CN108116888B (zh) * 2016-11-28 2020-01-03 鸿骐新技股份有限公司 具有双工艺设备的自动基板处理系统
TW201821912A (zh) * 2016-12-09 2018-06-16 百竟工業股份有限公司 光電印刷電路板自動化製程設備及自動化製程方法
WO2018141356A1 (de) * 2017-01-31 2018-08-09 Siemens Aktiengesellschaft Verfahren und steuerungseinrichtung zur durchsatzoptimierten produktion von leiterplatten auf einer bestückungslinie
JP6598820B2 (ja) * 2017-06-07 2019-10-30 株式会社Screenホールディングス 搬送装置、搬送方法および検査システム
EP3654746B1 (en) * 2017-07-10 2022-09-07 Fuji Corporation Base board production line
US11363748B2 (en) 2017-08-22 2022-06-14 Universal Instruments Corporation Printed circuit board transport
JP2021502240A (ja) 2017-11-10 2021-01-28 ノードソン コーポレーションNordson Corporation 基材をコーティングするためのシステム及び方法
CN108422675B (zh) * 2018-02-10 2019-09-13 泰州炬昕微电子有限公司 一种预先对位的半自动贴合机
CN108490822B (zh) * 2018-02-26 2021-08-27 珠海澳米嘉电子有限公司 一种基于后机要板信号的送板机自动控制方法及其装置
EP3771307B1 (en) * 2018-03-22 2023-08-09 Fuji Corporation Configuration device quality determination server, inspection system, inspection system terminal device, and inspection device
CN108961213B (zh) * 2018-05-29 2022-04-05 江苏本川智能电路科技股份有限公司 一种实现批量化检验钻孔品质的设备及其检测方法
CN108811365A (zh) * 2018-07-03 2018-11-13 上海安理创科技有限公司 一种smt生产智能防错追溯方法及工艺
CN109014208B (zh) * 2018-09-21 2023-06-30 北京梦之墨科技有限公司 一种液态金属打印机
DE102018133052A1 (de) * 2018-12-20 2020-06-25 Deutsche Post Ag Stetigförderer zum Fördern von Objekten und Objektförderhalle mit Stetigförderer
CN109894761B (zh) * 2019-02-27 2020-12-01 江苏爱仕达电子有限公司 蓝牙语音遥控器电路板的自动化焊接方法
CN110092139B (zh) * 2019-05-10 2024-11-08 维融科技股份有限公司 一种接钞斗循环输送线装置
CN114073176B (zh) * 2019-06-27 2023-07-18 株式会社富士 元件安装机以及对基板作业系统
CN110678058B (zh) * 2019-10-08 2021-02-02 伟创力电子技术(苏州)有限公司 一种远程通信的贴片机供料器
US20220009718A1 (en) * 2020-07-08 2022-01-13 Milara Incorporated Flexible modular assembly system
CN112053819B (zh) * 2020-09-02 2021-11-23 杭州瞳阳科技有限公司 一种基于贴片电子元器件的生产线
CN112140697B (zh) * 2020-09-15 2022-03-08 兰溪市黑狮运动用品有限公司 一种丝网印刷移动推车装置
US11707883B2 (en) 2020-11-20 2023-07-25 General Electric Company Foil interaction device for additive manufacturing
CN112706798A (zh) * 2021-01-12 2021-04-27 北京格灵深瞳信息技术股份有限公司 跨股道检修方法、装置、系统、控制中心和存储介质
US11865780B2 (en) 2021-02-26 2024-01-09 General Electric Company Accumalator assembly for additive manufacturing
CN117500656A (zh) * 2021-04-19 2024-02-02 霍洛公司 用于立体光刻三维打印的系统和方法
US11951679B2 (en) 2021-06-16 2024-04-09 General Electric Company Additive manufacturing system
US11731367B2 (en) 2021-06-23 2023-08-22 General Electric Company Drive system for additive manufacturing
US11958249B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11958250B2 (en) 2021-06-24 2024-04-16 General Electric Company Reclamation system for additive manufacturing
US11826950B2 (en) 2021-07-09 2023-11-28 General Electric Company Resin management system for additive manufacturing
US12370741B2 (en) 2021-08-13 2025-07-29 General Electric Company Material deposition assembly for additive manufacturing
US12296535B2 (en) 2021-08-24 2025-05-13 General Electric Company Attachment structure for additive manufacturing
US11813799B2 (en) 2021-09-01 2023-11-14 General Electric Company Control systems and methods for additive manufacturing
US12259715B2 (en) * 2021-10-27 2025-03-25 Illinois Tool Works Inc. Open application interface for industrial equipment
EP4479240A1 (en) * 2022-02-14 2024-12-25 Inovision Software Solutions, Inc. Efficient robotic defect correction system and method
EP4249216A1 (en) 2022-03-23 2023-09-27 General Electric Company Systems and methods for additive manufacturing
CN114670541B (zh) * 2022-04-20 2023-01-24 珠海格力电器股份有限公司 标识加工设备及其控制方法
US12403654B2 (en) 2022-09-30 2025-09-02 General Electric Company Systems and methods for additive manufacturing
CN115889115B (zh) * 2022-12-02 2023-06-20 许昌市森洋电子材料有限公司 一种连续式dbc覆铜基板自动加工系统及使用方法
CN118201347B (zh) * 2024-03-07 2024-10-18 珠海和普创电子科技有限公司 Smt加工方法和设备、电子设备、存储介质

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2381301A (en) 1943-03-23 1945-08-07 Freeland Spool And Bobbin Corp Releasing tube adapter for supporting tubes or the like
US3445076A (en) 1967-08-02 1969-05-20 Herbert F Dalglish Core chuck
US6739246B2 (en) 1970-05-02 2004-05-25 Chin-Wang Lan Extendable auto printing and drying machine
BE791607A (fr) 1972-07-10 1973-03-16 Pilot Pen Co Ltd Procede et appareil pour l'impression a l'ecran
CA1234924A (en) 1984-01-21 1988-04-05 Hideo Sakamoto Printed circuit board load-unload system with bypass route
US4742905A (en) * 1986-10-16 1988-05-10 Beers Gregory C Powered accumulation conveyor
US5436028A (en) * 1992-07-27 1995-07-25 Motorola, Inc. Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
JPH06166166A (ja) * 1992-12-02 1994-06-14 Matsushita Electric Ind Co Ltd スクリーン印刷機用の被印刷物搬送装置
JP2519013B2 (ja) 1993-06-22 1996-07-31 日本電気株式会社 リフロ―半田付装置
MX9709038A (es) * 1996-11-25 1998-08-30 Samsung Electronics Co Ltd Sistema y metodo de produccion de montajes de tableros de circuitos impresos.
US5779794A (en) * 1996-12-06 1998-07-14 Micron Technology, Inc. Universal fixture for holding printed circuit boards during processing
US5873939A (en) * 1997-02-21 1999-02-23 Doyle; Dennis G. Dual track stencil/screen printer
US6066206A (en) * 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
JPH1110832A (ja) 1997-06-23 1999-01-19 Ibiden Co Ltd 自動作業装置
AU1365699A (en) * 1997-10-27 1999-05-17 Imagen Incorporated Image search and retrieval system
US6206964B1 (en) 1997-11-10 2001-03-27 Speedline Technologies, Inc. Multiple head dispensing system and method
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US6232766B1 (en) * 1997-12-31 2001-05-15 Gte Communication Systems Corporation Test station for sequential testing
US6032788A (en) 1998-02-26 2000-03-07 Dek Printing Machines Limited Multi-rail board transport system
US6214117B1 (en) 1998-03-02 2001-04-10 Speedline Technologies, Inc. Dispensing system and method
US6032577A (en) * 1998-03-02 2000-03-07 Mpm Corporation Method and apparatus for transporting substrates
US6189488B1 (en) * 1998-03-24 2001-02-20 Engineering Services & Products Company Waterer for livestock
WO1999059389A2 (de) * 1998-05-11 1999-11-18 Siemens Aktiengesellschaft Anlage zum bestücken von bauelementeträgern mit elektrischen bauelementen
US6089149A (en) * 1998-05-13 2000-07-18 Zelko; Steve Screen printing machines
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
JP2001047600A (ja) * 1999-08-10 2001-02-20 Fuji Mach Mfg Co Ltd マスク印刷方法およびマスク印刷装置
US6684765B1 (en) 1999-11-22 2004-02-03 Seagate Technology Llc Universal shaft design for automatic wiping
JP4564121B2 (ja) * 1999-12-15 2010-10-20 富士機械製造株式会社 電気部品装着システム
US6572702B1 (en) * 1999-12-21 2003-06-03 Speedline Technologies, Inc. High speed electronic assembly system and method
US6643917B1 (en) 2000-01-19 2003-11-11 Delaware Capital Formation Redundant system for assembly of electronic components to substrates
JP3758463B2 (ja) * 2000-05-09 2006-03-22 松下電器産業株式会社 スクリーン印刷の検査方法
FI117809B (fi) * 2000-09-21 2007-02-28 Cencorp Oyj Testausjärjestelmä piirilevyvalmistuslinjassa piirilevyjen automaattiseksi testaamiseksi
KR100363902B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법
US6543347B2 (en) * 2001-01-10 2003-04-08 International Business Machines Corporation Apparatus for displacing an article during screening
AUPR735201A0 (en) * 2001-08-31 2001-09-20 Reefdale Pty Ltd Silk screen
US6688458B2 (en) * 2001-10-09 2004-02-10 Speedline Technologies, Inc. System and method for controlling a conveyor system configuration to accommodate different size substrates
US20030086089A1 (en) 2001-11-02 2003-05-08 Mike Carlomagno System and method for rapid alignment and accurate placement of electronic components on a printed circuit board
DE10200609A1 (de) 2002-01-10 2003-07-24 Ina Schaeffler Kg Elektrisch unterstützte Hilfskraftlenkung für Kraftfahrzeuge
DE10225430A1 (de) 2002-06-07 2003-12-24 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
JP4063044B2 (ja) * 2002-10-25 2008-03-19 松下電器産業株式会社 スクリーン印刷システムおよびスクリーン印刷方法
US7017489B2 (en) * 2004-02-20 2006-03-28 Speedline Technologies, Inc. Methods and apparatus for changing web material in a stencil printer
JP2006339238A (ja) * 2005-05-31 2006-12-14 Marubeni Corp 基板搬送装置、外観検査装置、電子機器の製造方法及び電子機器の外観検査方法
JP2007150051A (ja) 2005-11-29 2007-06-14 Tokuyama Corp 基板上への半田パターン形成方法
FR2899840B1 (fr) * 2006-04-12 2008-07-04 Mach Dubuit Soc Par Actions Si Machine d'impression par serigraphie
JP4926567B2 (ja) * 2006-06-29 2012-05-09 ヤマハ発動機株式会社 印刷装置および印刷方法
JP2008147204A (ja) * 2006-12-05 2008-06-26 Fuji Name Plate Kk 導電回路形成方法、導電回路形成部品、抵抗体の製造方法、及び基板の製造方法
US7710611B2 (en) 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
JP5258232B2 (ja) * 2007-08-30 2013-08-07 株式会社ミマキエンジニアリング 印刷装置
US8413577B2 (en) 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
JP5590530B2 (ja) * 2010-08-03 2014-09-17 富士機械製造株式会社 基板印刷システム

Similar Documents

Publication Publication Date Title
JP2012509598A5 (enExample)
JP5023904B2 (ja) スクリーン印刷装置
JP2011143640A (ja) スクリーン印刷装置
ATE458612T1 (de) Druckvorrichtung
CN107591346A (zh) 基板处理装置及对准方法
JP2009081364A (ja) 部品実装システム及び部品実装方法
WO2012176229A1 (ja) スクリーン印刷装置
JP2006210393A5 (enExample)
JP5471860B2 (ja) スクリーン印刷機
JPWO2019012681A1 (ja) スクリーン印刷機
WO2015155817A1 (ja) プリント基板用搬送装置
JP3185633U (ja) 物品輸送装置及びその方法
JP2010267786A (ja) はんだ付け装置
JP2010041059A5 (enExample)
JP2010120747A (ja) 薄板の浮上搬送状態検出方法及びその装置
CN203319321U (zh) 物件输送装置
JP5536438B2 (ja) スクリーン印刷装置
KR101503176B1 (ko) 기판 검사 장치 및 방법
JP2011119351A (ja) 電子部品実装装置
JP2004186681A5 (enExample)
JP5096420B2 (ja) プリント基板の支持装置
JP5391882B2 (ja) 搬送装置及び搬送装置制御方法
JP6084241B2 (ja) 電子部品実装機器の基板搬送システム
CN106391580A (zh) 用于smt上板机的吹风装置
KR101007805B1 (ko) 인쇄회로기판 취출장치