MX2011005315A - Sistema y método transportador de paso directo verticalmente separado en equipo de procesamiento con tecnología de montaje superficial. - Google Patents
Sistema y método transportador de paso directo verticalmente separado en equipo de procesamiento con tecnología de montaje superficial.Info
- Publication number
- MX2011005315A MX2011005315A MX2011005315A MX2011005315A MX2011005315A MX 2011005315 A MX2011005315 A MX 2011005315A MX 2011005315 A MX2011005315 A MX 2011005315A MX 2011005315 A MX2011005315 A MX 2011005315A MX 2011005315 A MX2011005315 A MX 2011005315A
- Authority
- MX
- Mexico
- Prior art keywords
- printer
- stencil
- rail
- substrate
- electronic substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 68
- 238000005516 engineering process Methods 0.000 title description 16
- 230000008569 process Effects 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 311
- 238000007689 inspection Methods 0.000 claims description 89
- 238000012545 processing Methods 0.000 claims description 79
- 238000005538 encapsulation Methods 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 40
- 239000011345 viscous material Substances 0.000 abstract description 8
- 238000000151 deposition Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 94
- 238000007639 printing Methods 0.000 description 78
- 238000004891 communication Methods 0.000 description 26
- 238000005266 casting Methods 0.000 description 24
- 230000007246 mechanism Effects 0.000 description 23
- 230000008439 repair process Effects 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000012360 testing method Methods 0.000 description 13
- 230000007547 defect Effects 0.000 description 12
- 238000009826 distribution Methods 0.000 description 11
- 229910001018 Cast iron Inorganic materials 0.000 description 10
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- 238000011144 upstream manufacturing Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 6
- 238000012937 correction Methods 0.000 description 6
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- 230000003287 optical effect Effects 0.000 description 6
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
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- 238000006073 displacement reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 238000012958 reprocessing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- YFSLABAYQDPWPF-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,3,5-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 YFSLABAYQDPWPF-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
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- 238000013461 design Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XBBRGUHRZBZMPP-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=C(Cl)C(Cl)=C1Cl XBBRGUHRZBZMPP-UHFFFAOYSA-N 0.000 description 1
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- YUZILKLGVPUFOT-YHPRVSEPSA-L disodium;5-[(6-anilino-4-oxo-1h-1,3,5-triazin-2-yl)amino]-2-[(e)-2-[4-[(6-anilino-4-oxo-1h-1,3,5-triazin-2-yl)amino]-2-sulfonatophenyl]ethenyl]benzenesulfonate Chemical compound [Na+].[Na+].C=1C=C(\C=C\C=2C(=CC(NC=3NC(NC=4C=CC=CC=4)=NC(=O)N=3)=CC=2)S([O-])(=O)=O)C(S(=O)(=O)[O-])=CC=1NC(N1)=NC(=O)N=C1NC1=CC=CC=C1 YUZILKLGVPUFOT-YHPRVSEPSA-L 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11595408P | 2008-11-19 | 2008-11-19 | |
| US14465109P | 2009-01-14 | 2009-01-14 | |
| US17679709P | 2009-05-08 | 2009-05-08 | |
| US17681309P | 2009-05-08 | 2009-05-08 | |
| US17680109P | 2009-05-08 | 2009-05-08 | |
| US17680409P | 2009-05-08 | 2009-05-08 | |
| US17681009P | 2009-05-08 | 2009-05-08 | |
| US17680309P | 2009-05-08 | 2009-05-08 | |
| US12/608,759 US8555784B2 (en) | 2008-11-19 | 2009-10-29 | Method of processing electronic substrates using vertically separated pass through conveyor system |
| PCT/US2009/064094 WO2010059486A1 (en) | 2008-11-19 | 2009-11-12 | Vertically separated pass through conveyor system and method in surface mount technology process equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2011005315A true MX2011005315A (es) | 2011-08-08 |
Family
ID=42170982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2011005315A MX2011005315A (es) | 2008-11-19 | 2009-11-12 | Sistema y método transportador de paso directo verticalmente separado en equipo de procesamiento con tecnología de montaje superficial. |
Country Status (8)
| Country | Link |
|---|---|
| US (8) | US8413577B2 (enExample) |
| EP (1) | EP2364225B1 (enExample) |
| JP (2) | JP2012509598A (enExample) |
| KR (1) | KR101652924B1 (enExample) |
| CN (2) | CN102281959B (enExample) |
| CA (1) | CA2744321C (enExample) |
| MX (1) | MX2011005315A (enExample) |
| WO (1) | WO2010059486A1 (enExample) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5415011B2 (ja) * | 2008-04-02 | 2014-02-12 | パナソニック株式会社 | スクリーン印刷装置 |
| US8413577B2 (en) * | 2008-11-19 | 2013-04-09 | Illinois Tool Works Inc. | Vertically separated pass through conveyor system and method in surface mount technology process equipment |
| IT1399285B1 (it) * | 2009-07-03 | 2013-04-11 | Applied Materials Inc | Sistema di lavorazione substrato |
| JP5590530B2 (ja) * | 2010-08-03 | 2014-09-17 | 富士機械製造株式会社 | 基板印刷システム |
| US9757963B2 (en) | 2010-11-01 | 2017-09-12 | Scodix Ltd. | System and method for transporting substrates |
| EP2635439B1 (en) * | 2010-11-01 | 2019-01-09 | Scodix Ltd. | System and method for transporting substrates |
| ITVR20110228A1 (it) * | 2011-12-20 | 2013-06-21 | Projecta Engineering S R L | Macchina per la decorazione di prodotti |
| US9060437B2 (en) * | 2012-02-01 | 2015-06-16 | Illinois Tool Works Inc. | System and method for operating a stencil printer |
| EP2876990B1 (en) * | 2012-07-17 | 2018-10-24 | FUJI Corporation | Work system and work machines for substrates |
| US8547548B1 (en) * | 2012-12-20 | 2013-10-01 | Kinsus Interconnect Technology Corp. | Final defect inspection system |
| US8837808B2 (en) * | 2012-12-20 | 2014-09-16 | Kinsus Interconnect Technology Corp. | Method of final defect inspection |
| DE102013101693B9 (de) | 2013-02-20 | 2015-11-12 | Notion Systems GmbH | Oberflächenbearbeitungsvorrichtung |
| US9126398B2 (en) * | 2013-07-26 | 2015-09-08 | Asm Assembly Systems Singapore Pte Ltd | Apparatus for paste material printing, and printing method |
| US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
| WO2015114765A1 (ja) * | 2014-01-30 | 2015-08-06 | 富士機械製造株式会社 | 基板搬送装置およびそれを含んで構成された対基板作業システム |
| US9744727B2 (en) * | 2014-04-02 | 2017-08-29 | Autodesk, Inc. | Electro-mechanical 3D printing design system |
| KR101970794B1 (ko) * | 2014-04-07 | 2019-04-22 | 한화정밀기계 주식회사 | 부품 실장기의 동작을 제어하는 방법 |
| TW201600947A (zh) | 2014-05-01 | 2016-01-01 | 西克帕安全油墨系統美國公司 | 動態可配置生產及／或分配線控制系統及其方法 |
| JP6472805B2 (ja) * | 2014-08-06 | 2019-02-20 | 株式会社Ｆｕｊｉ | 対基板作業装置 |
| JP6209285B2 (ja) * | 2014-09-04 | 2017-10-04 | ヤマハ発動機株式会社 | 部品実装装置および部品実装システム |
| JP6387752B2 (ja) * | 2014-09-04 | 2018-09-12 | 富士ゼロックス株式会社 | プリンタ制御装置、プリンタ制御プログラム |
| US10311381B2 (en) | 2014-12-12 | 2019-06-04 | Autodesk, Inc. | Tool and method for conductive trace generation in a 3D model for a hybrid electro-mechanical 3D printer |
| CN105744823B (zh) * | 2014-12-12 | 2018-12-18 | 致茂电子(苏州)有限公司 | 电子组件承载盘的快速定位移载方法 |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| CN104843486B (zh) * | 2015-04-14 | 2018-02-16 | 苏州艾斯达克智能科技有限公司 | 一种smt物料输送方法及输送系统 |
| MX368235B (es) * | 2015-07-01 | 2019-09-25 | Volkswagen De Mexico S A De C V | Proceso de impresión digital de la carrocería de un vehículo. |
| CN106626734B (zh) * | 2015-10-30 | 2019-03-29 | 深圳市登峰网印设备有限公司 | 一种采用丝网印刷机进行塞孔和双面防焊的丝网印刷方法 |
| EP3374189B1 (en) * | 2015-11-10 | 2023-08-02 | Kornit Digital Ltd. | Modular printing apparatus and method |
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| US11141919B2 (en) | 2015-12-09 | 2021-10-12 | Holo, Inc. | Multi-material stereolithographic three dimensional printing |
| CN105800311B (zh) * | 2016-05-04 | 2024-08-02 | 上海凯思尔电子有限公司 | 一种用于pcb生产设备的aoi自动收放板机 |
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- 2009-10-29 US US12/608,787 patent/US20100125357A1/en not_active Abandoned
- 2009-10-29 US US12/608,759 patent/US8555784B2/en not_active Expired - Fee Related
- 2009-11-12 WO PCT/US2009/064094 patent/WO2010059486A1/en not_active Ceased
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- 2009-11-12 CN CN200980154758.8A patent/CN102281959B/zh active Active
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- 2009-11-12 CA CA2744321A patent/CA2744321C/en not_active Expired - Fee Related
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2013
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| US20100122635A1 (en) | 2010-05-20 |
| KR20110086715A (ko) | 2011-07-29 |
| CN102281959B (zh) | 2014-10-01 |
| US8555783B2 (en) | 2013-10-15 |
| US9345147B2 (en) | 2016-05-17 |
| JP2015035615A (ja) | 2015-02-19 |
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| US20100122634A1 (en) | 2010-05-20 |
| EP2364225B1 (en) | 2019-03-06 |
| US20130180829A1 (en) | 2013-07-18 |
| EP2364225A1 (en) | 2011-09-14 |
| US8413578B2 (en) | 2013-04-09 |
| KR101652924B1 (ko) | 2016-09-09 |
| WO2010059486A1 (en) | 2010-05-27 |
| US8613134B2 (en) | 2013-12-24 |
| US20100122636A1 (en) | 2010-05-20 |
| CN104302161A (zh) | 2015-01-21 |
| US8555784B2 (en) | 2013-10-15 |
| CA2744321C (en) | 2015-12-22 |
| EP2364225A4 (en) | 2013-04-03 |
| JP2012509598A (ja) | 2012-04-19 |
| US20100125359A1 (en) | 2010-05-20 |
| CN104302161B (zh) | 2018-02-09 |
| US20130333206A1 (en) | 2013-12-19 |
| CA2744321A1 (en) | 2010-05-27 |
| CN102281959A (zh) | 2011-12-14 |
| US8413577B2 (en) | 2013-04-09 |
| US8939076B2 (en) | 2015-01-27 |
| US20100122633A1 (en) | 2010-05-20 |
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