KR101652924B1 - 표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 - Google Patents
표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 Download PDFInfo
- Publication number
- KR101652924B1 KR101652924B1 KR1020117012180A KR20117012180A KR101652924B1 KR 101652924 B1 KR101652924 B1 KR 101652924B1 KR 1020117012180 A KR1020117012180 A KR 1020117012180A KR 20117012180 A KR20117012180 A KR 20117012180A KR 101652924 B1 KR101652924 B1 KR 101652924B1
- Authority
- KR
- South Korea
- Prior art keywords
- stencil printer
- track
- substrate
- printer
- electronic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (18)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11595408P | 2008-11-19 | 2008-11-19 | |
| US61/115,954 | 2008-11-19 | ||
| US14465109P | 2009-01-14 | 2009-01-14 | |
| US61/144,651 | 2009-01-14 | ||
| US17680109P | 2009-05-08 | 2009-05-08 | |
| US17681009P | 2009-05-08 | 2009-05-08 | |
| US17679709P | 2009-05-08 | 2009-05-08 | |
| US17680309P | 2009-05-08 | 2009-05-08 | |
| US17680409P | 2009-05-08 | 2009-05-08 | |
| US17681309P | 2009-05-08 | 2009-05-08 | |
| US61/176,803 | 2009-05-08 | ||
| US61/176,813 | 2009-05-08 | ||
| US61/176,797 | 2009-05-08 | ||
| US61/176,810 | 2009-05-08 | ||
| US61/176,804 | 2009-05-08 | ||
| US61/176,801 | 2009-05-08 | ||
| US12/608,759 | 2009-10-29 | ||
| US12/608,759 US8555784B2 (en) | 2008-11-19 | 2009-10-29 | Method of processing electronic substrates using vertically separated pass through conveyor system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110086715A KR20110086715A (ko) | 2011-07-29 |
| KR101652924B1 true KR101652924B1 (ko) | 2016-09-09 |
Family
ID=42170982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117012180A Expired - Fee Related KR101652924B1 (ko) | 2008-11-19 | 2009-11-12 | 표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (8) | US8613134B2 (enExample) |
| EP (1) | EP2364225B1 (enExample) |
| JP (2) | JP2012509598A (enExample) |
| KR (1) | KR101652924B1 (enExample) |
| CN (2) | CN102281959B (enExample) |
| CA (1) | CA2744321C (enExample) |
| MX (1) | MX2011005315A (enExample) |
| WO (1) | WO2010059486A1 (enExample) |
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| JP5415011B2 (ja) * | 2008-04-02 | 2014-02-12 | パナソニック株式会社 | スクリーン印刷装置 |
| US8613134B2 (en) | 2008-11-19 | 2013-12-24 | Illinois Tool Works Inc. | Method of conveying printed circuit boards |
| IT1399285B1 (it) * | 2009-07-03 | 2013-04-11 | Applied Materials Inc | Sistema di lavorazione substrato |
| JP5590530B2 (ja) * | 2010-08-03 | 2014-09-17 | 富士機械製造株式会社 | 基板印刷システム |
| US9757963B2 (en) | 2010-11-01 | 2017-09-12 | Scodix Ltd. | System and method for transporting substrates |
| CN103338937B (zh) * | 2010-11-01 | 2016-01-06 | 斯科迪克斯有限公司 | 运输承印材料的系统和方法 |
| ITVR20110228A1 (it) * | 2011-12-20 | 2013-06-21 | Projecta Engineering S R L | Macchina per la decorazione di prodotti |
| US9060437B2 (en) * | 2012-02-01 | 2015-06-16 | Illinois Tool Works Inc. | System and method for operating a stencil printer |
| CN104472029B (zh) * | 2012-07-17 | 2017-06-09 | 富士机械制造株式会社 | 对基板作业系统及作业机 |
| US8547548B1 (en) * | 2012-12-20 | 2013-10-01 | Kinsus Interconnect Technology Corp. | Final defect inspection system |
| US8837808B2 (en) * | 2012-12-20 | 2014-09-16 | Kinsus Interconnect Technology Corp. | Method of final defect inspection |
| DE102013101693B9 (de) * | 2013-02-20 | 2015-11-12 | Notion Systems GmbH | Oberflächenbearbeitungsvorrichtung |
| US9126398B2 (en) * | 2013-07-26 | 2015-09-08 | Asm Assembly Systems Singapore Pte Ltd | Apparatus for paste material printing, and printing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20100122636A1 (en) | 2010-05-20 |
| CN104302161A (zh) | 2015-01-21 |
| US20130333206A1 (en) | 2013-12-19 |
| US20100122635A1 (en) | 2010-05-20 |
| US20100122633A1 (en) | 2010-05-20 |
| US8413578B2 (en) | 2013-04-09 |
| US8555783B2 (en) | 2013-10-15 |
| US20100125357A1 (en) | 2010-05-20 |
| US8413577B2 (en) | 2013-04-09 |
| CN102281959A (zh) | 2011-12-14 |
| CA2744321A1 (en) | 2010-05-27 |
| EP2364225A1 (en) | 2011-09-14 |
| WO2010059486A1 (en) | 2010-05-27 |
| EP2364225B1 (en) | 2019-03-06 |
| US8555784B2 (en) | 2013-10-15 |
| KR20110086715A (ko) | 2011-07-29 |
| US20100122634A1 (en) | 2010-05-20 |
| MX2011005315A (es) | 2011-08-08 |
| CA2744321C (en) | 2015-12-22 |
| US20130180829A1 (en) | 2013-07-18 |
| EP2364225A4 (en) | 2013-04-03 |
| US20100125359A1 (en) | 2010-05-20 |
| JP2012509598A (ja) | 2012-04-19 |
| US8613134B2 (en) | 2013-12-24 |
| CN104302161B (zh) | 2018-02-09 |
| US9345147B2 (en) | 2016-05-17 |
| JP2015035615A (ja) | 2015-02-19 |
| US8939076B2 (en) | 2015-01-27 |
| CN102281959B (zh) | 2014-10-01 |
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