KR101652924B1 - 표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 - Google Patents

표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 Download PDF

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Publication number
KR101652924B1
KR101652924B1 KR1020117012180A KR20117012180A KR101652924B1 KR 101652924 B1 KR101652924 B1 KR 101652924B1 KR 1020117012180 A KR1020117012180 A KR 1020117012180A KR 20117012180 A KR20117012180 A KR 20117012180A KR 101652924 B1 KR101652924 B1 KR 101652924B1
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KR
South Korea
Prior art keywords
stencil printer
track
substrate
printer
electronic substrate
Prior art date
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Expired - Fee Related
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KR1020117012180A
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English (en)
Korean (ko)
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KR20110086715A (ko
Inventor
데니스 지. 도일
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
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Publication of KR20110086715A publication Critical patent/KR20110086715A/ko
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Publication of KR101652924B1 publication Critical patent/KR101652924B1/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53187Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)
KR1020117012180A 2008-11-19 2009-11-12 표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법 Expired - Fee Related KR101652924B1 (ko)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
US11595408P 2008-11-19 2008-11-19
US61/115,954 2008-11-19
US14465109P 2009-01-14 2009-01-14
US61/144,651 2009-01-14
US17680109P 2009-05-08 2009-05-08
US17681009P 2009-05-08 2009-05-08
US17679709P 2009-05-08 2009-05-08
US17680309P 2009-05-08 2009-05-08
US17680409P 2009-05-08 2009-05-08
US17681309P 2009-05-08 2009-05-08
US61/176,803 2009-05-08
US61/176,813 2009-05-08
US61/176,797 2009-05-08
US61/176,810 2009-05-08
US61/176,804 2009-05-08
US61/176,801 2009-05-08
US12/608,759 2009-10-29
US12/608,759 US8555784B2 (en) 2008-11-19 2009-10-29 Method of processing electronic substrates using vertically separated pass through conveyor system

Publications (2)

Publication Number Publication Date
KR20110086715A KR20110086715A (ko) 2011-07-29
KR101652924B1 true KR101652924B1 (ko) 2016-09-09

Family

ID=42170982

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117012180A Expired - Fee Related KR101652924B1 (ko) 2008-11-19 2009-11-12 표면실장기술 공정 장비의 수직 분리된 관통 컨베이어 시스템 및 방법

Country Status (8)

Country Link
US (8) US8613134B2 (enExample)
EP (1) EP2364225B1 (enExample)
JP (2) JP2012509598A (enExample)
KR (1) KR101652924B1 (enExample)
CN (2) CN102281959B (enExample)
CA (1) CA2744321C (enExample)
MX (1) MX2011005315A (enExample)
WO (1) WO2010059486A1 (enExample)

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