JP2012509598A - 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法 - Google Patents

表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法 Download PDF

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Publication number
JP2012509598A
JP2012509598A JP2011537504A JP2011537504A JP2012509598A JP 2012509598 A JP2012509598 A JP 2012509598A JP 2011537504 A JP2011537504 A JP 2011537504A JP 2011537504 A JP2011537504 A JP 2011537504A JP 2012509598 A JP2012509598 A JP 2012509598A
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Japan
Prior art keywords
substrate
track
electronic
stencil printer
transport
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Pending
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JP2011537504A
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English (en)
Japanese (ja)
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JP2012509598A5 (enExample
Inventor
ジー． ドイル，デニス
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
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Publication of JP2012509598A publication Critical patent/JP2012509598A/ja
Publication of JP2012509598A5 publication Critical patent/JP2012509598A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)
JP2011537504A 2008-11-19 2009-11-12 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法 Pending JP2012509598A (ja)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US11595408P 2008-11-19 2008-11-19
US61/115,954 2008-11-19
US14465109P 2009-01-14 2009-01-14
US61/144,651 2009-01-14
US17680109P 2009-05-08 2009-05-08
US17681009P 2009-05-08 2009-05-08
US17679709P 2009-05-08 2009-05-08
US17680309P 2009-05-08 2009-05-08
US17680409P 2009-05-08 2009-05-08
US17681309P 2009-05-08 2009-05-08
US61/176,810 2009-05-08
US61/176,797 2009-05-08
US61/176,813 2009-05-08
US61/176,801 2009-05-08
US61/176,804 2009-05-08
US61/176,803 2009-05-08
US12/608,759 2009-10-29
US12/608,759 US8555784B2 (en) 2008-11-19 2009-10-29 Method of processing electronic substrates using vertically separated pass through conveyor system
PCT/US2009/064094 WO2010059486A1 (en) 2008-11-19 2009-11-12 Vertically separated pass through conveyor system and method in surface mount technology process equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014207460A Division JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Publications (2)

Publication Number Publication Date
JP2012509598A true JP2012509598A (ja) 2012-04-19
JP2012509598A5 JP2012509598A5 (enExample) 2012-12-27

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JP2011537504A Pending JP2012509598A (ja) 2008-11-19 2009-11-12 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法
JP2014207460A Pending JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Family Applications After (1)

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JP2014207460A Pending JP2015035615A (ja) 2008-11-19 2014-10-08 表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法

Country Status (8)

Country Link
US (8) US8613134B2 (enExample)
EP (1) EP2364225B1 (enExample)
JP (2) JP2012509598A (enExample)
KR (1) KR101652924B1 (enExample)
CN (2) CN102281959B (enExample)
CA (1) CA2744321C (enExample)
MX (1) MX2011005315A (enExample)
WO (1) WO2010059486A1 (enExample)

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JP2016520435A (ja) * 2013-02-20 2016-07-14 ノーション システムズ ゲーエムベーハー 表面加工装置
WO2018016078A1 (ja) * 2016-07-22 2018-01-25 富士機械製造株式会社 基板作業システム

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