CN106793534A - 电路板钢网印刷方法 - Google Patents

电路板钢网印刷方法 Download PDF

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CN106793534A
CN106793534A CN201510807431.3A CN201510807431A CN106793534A CN 106793534 A CN106793534 A CN 106793534A CN 201510807431 A CN201510807431 A CN 201510807431A CN 106793534 A CN106793534 A CN 106793534A
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steel mesh
circuit board
printed
scraper plate
printing process
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张学琴
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Shenzhen Yuzhan Precision Technology Co ltd
Hon Hai Precision Industry Co Ltd
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Shenzhen Yuzhan Precision Technology Co ltd
Hon Hai Precision Industry Co Ltd
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Priority to TW105100447A priority patent/TWI609612B/zh
Priority to US15/075,445 priority patent/US10426039B2/en
Publication of CN106793534A publication Critical patent/CN106793534A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

本发明提供一种电路板钢网印刷方法，用于制作印刷电路板，该方法包括开料及对开料后的电路板进行开孔的步骤，该方法还包括线路图印刷步骤，通过一第一钢网、一刮板及导电油墨将该第一钢网上的线路图印刷至开孔后的电路板上；阻焊层印刷步骤，通过一第二钢网及该刮板将阻焊材料印刷至该电路板上；文字及标记印刷步骤，通过一第三钢网、该刮板及油墨将该第三钢网上的文字及标记印刷至该电路板上；及锡膏印刷步骤，通过一第四钢网及该刮板将锡膏印刷至该电路板上。本发明的电路板钢网印刷方法相对于传统的制作印刷电路板的方法减少了工序，从而节省了时间，并且在制作电路板的过程中减少了对环境造成的污染。

Description

电路板钢网印刷方法
技术领域
本发明涉及 一种电路板钢网印刷方法。
背景技术
在印刷电路板的生产制造过程中，通常需要对电路板进行沉铜、线路图形转移、图形电镀、退膜、蚀刻、退锡、阻焊图形转移及沉锡的作业，该些作业流程耗时较长，而且在制板的过程中产生的物质容易对环境造成污染。
发明内容
有鉴于此，有必要提供一种电路板钢网印刷方法，以解决上述技术问题。
本发明提供一种电路板钢网印刷方法，用于制作印刷电路板，该方法包括开料及对开料后的电路板进行开孔的步骤，该方法还包括：
线路图印刷步骤，通过一第一钢网、一刮板及导电油墨将该第一钢网上的线路图印刷至开孔后的电路板上；
阻焊层印刷步骤，通过一第二钢网及该刮板将阻焊材料印刷至该电路板上；
文字及标记印刷步骤，通过一第三钢网、该刮板及油墨将该第三钢网上的文字及标记印刷至该电路板上；及
锡膏印刷步骤，通过一第四钢网及该刮板将锡膏印刷至该电路板上。
相较于现有技术，本发明提供的电路板钢网印刷方法采用钢网印刷作业对电路板进行印刷，相对于传统的作业流程减少了部分工序，从而节省了时间，并且在制作电路板的过程中减少了对环境造成的污染。
附图说明
图1为本发明电路板钢网印刷方法较佳实施方式的流程图。
图2为本发明电路板钢网印刷方法印刷多层电路板的流程图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参考图1，为本发明所提供的电路板钢网印刷方法的流程图。该电路板钢网印刷方法主要通过钢网、刮板及印刷材料进行电路板的印刷。钢网通常由不锈钢制成，其包括丝网、钢片、网框及粘接胶，丝网铺设于钢片上，采用激光切割等方法可以在钢片上开孔，网框用于固定丝网及钢片，粘接胶用于将丝网固定粘接在钢片及网框上。刮板通常由橡胶材料制成，用于刮挤丝网上的印刷材料。
当使用钢网印刷方法制作印刷电路板时，钢网具有一定的预设厚度，从而便于将印刷材料印刷在电路板指定的区域。在本实施方式中，钢网的预设厚度为0.1毫米-0.3毫米。丝网上的网孔可以透过印刷材料，所以印刷材料在刮板的刮挤下可在钢片开孔处通过丝网的网孔漏印在电路板上。
电路板钢网印刷方法的具体步骤如下。
开料及开孔步骤S1，选取符合要求的板料，对选取的板料进行开料及对开料后的电路板进行开孔。
线路图印刷步骤S2，通过一第一钢网、一刮板及导电油墨将该第一钢网上的线路图印刷至开孔后的电路板上。
在本实施方式中，首先计算出待印刷线路图在电路板上的坐标范围，从而可确定该第一钢网需开孔的区域，然后可采用激光切割的方法在该第一钢网上需开孔的区域打孔，从而在该第一钢网上形成该待印刷的线路图。
具体的，线路图印刷步骤S2包括将印有线路图的第一钢网固定于已开孔的电路板上，其中，该第一钢网的开孔对准该电路板待印刷线路图的区域。在该第一钢网的一端放入导电油墨，采用一刮板按压住该第一钢网上放有导电油墨的一端，并在该第一钢网放有导电油墨的一端及另一端之间来回按压着移动，导电油墨在移动中被该刮板从该第一钢网开孔位置对应的丝网网孔中挤压到电路板上，从而将该线路图印刷至电路板上，该刮板在该第一钢网的两端来回移动则可以使该电路板的线路图区域内的导电油墨分布均匀。在线路图印刷完成后，将该刮板上的导电油墨清洗掉。在本实施方式中，导电油墨为金、银、铜或碳等导电材料分散在连结料中制成的糊状油墨。
阻焊层印刷步骤S3，通过一第二钢网及该刮板将阻焊材料印刷至该电路板上。
在本实施方式中，首先确定该电路板阻焊层对应的区域，并计算阻焊层在该电路板上的坐标范围，从而可确定该第二钢网相应的需开孔的区域，采用激光切割的方法在该第二钢网上需开孔的区域打孔，从而使第二钢网上开孔的区域与该电路板上阻焊层的区域一致。
具体的，阻焊层印刷步骤S3包括将第二钢网固定于该电路板上，其中，该第二钢网上的开孔对准该电路板上待印刷阻焊层的区域。在该第二钢网的一端放入阻焊材料，采用该刮板按步骤S2的方式将阻焊材料印刷至该电路板上，从而在电路板上形成阻焊层。在阻焊层印刷完成后，将该刮板上的阻焊材料清洗掉。在本实施方式中，该阻焊材料为绿油、蓝油或红油。
文字及标记印刷步骤S4，通过一第三钢网、该刮板及油墨将该第三钢网上的文字及标记印刷至该电路板上。其中，确定该第三钢网需开孔的区域及打孔方法与步骤S3相同。
具体的，文字及标记印刷步骤S4包括将第三钢网固定于该电路板上，其中，该第三钢网上的文字及标记对应的开孔对准该电路板上待印刷文字及标记的区域。在该第三钢网的一端放入油墨，采用该刮板按步骤S2的方式将油墨印刷至电路板上，从而将文字及标记印刷至电路板上。在文字及标记印刷完成后，将该刮板上的油墨清洗掉。在本实施方式中，该油墨为热固性油墨。
锡膏印刷步骤S6，通过一第四钢网及该刮板将锡膏印刷至该电路板上。其中，确定该第四钢网需开孔的区域及打孔方法与步骤S3相同。
具体的，锡膏印刷步骤S6包括将第四钢网固定于电路板上，其中，第四钢网上的开孔对准该电路板上待印刷锡膏的区域。在该第四钢网的一端放入锡膏，采用该刮板按步骤S2的方式将锡膏印刷至电路板上。在锡膏印刷完成后，将该刮板上的阻焊材料清洗掉。
测试步骤S7，对制作完成的印刷电路板进行测试。在本实施方式中，对印刷电路板的测试包括电测试及目检。其中，电测试用于测试印刷电路板的线路是否出现断路或短路，目检用于检查印刷电路板的外观是否存在缺陷。
请参考图2，当制作的电路板为多层电路板时，该电路板钢网印刷方法还包括以下步骤。
内层线路图印刷步骤S201，通过一第五钢网、该刮板及导电油墨将该第五钢网上的线路图印刷至一多层电路板的内层电路板上。
导电浆贯孔印刷步骤S202，通过一第六钢网及该刮板将导电浆印刷至多层电路板需要印刷导体层的孔中。其中，确定该第六钢网需开孔的区域及打孔方法与步骤S3相同。
在本实施方式中，该多层电路板已完成开孔作业，部分孔的孔壁周围需要印刷导体层，导体层可在多层电路板的各层面之间制造电气触点而形成回路。具体的，该导电浆贯孔印刷步骤S202包括将该第六钢网固定于电路板上，其中，该第六钢网上的开孔对准该电路板需要印刷导体层的孔。在该第六钢网的一端放入导电浆，采用该刮板按步骤S2的方式将导电浆印刷至电路板上的孔径内，孔径内的导电浆经固化后形成导体层而使得电路板上的孔形成互连导通孔。在导电浆印刷完成后，将该刮板上的导电浆清洗掉。在本实施方式中，该导电浆可为银浆、铜浆或碳浆。
外层线路图印刷步骤S203，通过一第七钢网、该刮板及导电油墨将该第七钢网上的线路图印刷至该多层电路板的外层电路板上。
镀金手指步骤S5，在该多层电路板的插头手指上镀上一层金属层，其中，该金属层为镍金层。
如图2所示，在多层电路板的印刷过程中，内层线路图印刷步骤完成之后包括内层电路板测试步骤S701，以及外层线路图印刷步骤完成之后包括外层电路板测试步骤S702，在线路图印刷完成后对对应的电路板进行测试，可以尽早对测试不良的电路板进行修理或重工，避免增加后续处理不良电路板的难度。
本发明提供的电路板钢网印刷方法无需沉铜、线路图形转移、图形电镀、退膜、蚀刻、退锡、阻焊图形转移及沉锡等传统印刷流程中的工序，相对于传统流程节省了时间，并且在制作印刷电路板的过程减少了化学反应产生的物质对环境的污染。
最后应说明的是，以上实施例仅用以说明本发明的实施方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围。

Claims (8)

1.一种电路板钢网印刷方法，用于制作印刷电路板，该方法包括开料及对开料后的电路板进行开孔的步骤，其特征在于，该方法还包括：
线路图印刷步骤，通过一第一钢网、一刮板及导电油墨将该第一钢网上的线路图印刷至开孔后的电路板上；
阻焊层印刷步骤，通过一第二钢网及该刮板将阻焊材料印刷至该电路板上；
文字及标记印刷步骤，通过一第三钢网、该刮板及油墨将该第三钢网上的文字及标记印刷至该电路板上；及
锡膏印刷步骤，通过一第四钢网及该刮板将锡膏印刷至该电路板上。
2.如权利要求1所述的电路板钢网印刷方法，其特征在于，该方法还包括：
测试步骤，对制作完成的印刷电路板进行测试。
3.如权利要求1所述的电路板钢网印刷方法，其特征在于，当制作的电路板为多层电路板时，该方法还包括：
内层线路图印刷步骤，通过一第五钢网、该刮板及导电油墨将该第五钢网上的线路图印刷至多层电路板的内层电路板上；
导电浆贯孔印刷步骤，通过一第六钢网及该刮板将导电浆印刷至多层电路板需要印刷导体层的孔中；及
外层线路图印刷步骤，通过一第七钢网、该刮板及导电油墨将该第七钢网上的线路图印刷至多层电路板的外层电路板上。
4.如权利要求3所述的电路板钢网印刷方法，其特征在于，该方法还包括：
镀金手指步骤，在该多层电路板的插头手指上镀上一层金属层。
5.如权利要求1所述的电路板钢网印刷方法，其特征在于：通过计算待印刷线路图在电路板上的坐标范围确定该第一钢网、第五钢网及第七钢网需开孔的区域，采用激光切割法在该第一钢网、第五钢网及第七钢网相应的区域打孔，从而在钢网上形成该待印刷的线路图。
6.如权利要求1或3所述的电路板钢网印刷方法，其特征在于：通过计算阻焊层、文字及标记、锡膏及导电浆在电路板上的坐标范围分别确定该第二钢网、第三钢网、第四钢网及第六钢网需开孔的区域，采用激光切割法在该第二钢网、第三钢网、第四钢网及第六钢网相应的区域开孔。
7.如权利要求1所述的电路板钢网印刷方法，其特征在于：该阻焊材料可为绿油、蓝油或红油。
8.如权利要求3所述的电路板钢网印刷方法，其特征在于：该导电浆可为银浆、铜浆或碳浆。
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