TW201722229A - 電路板鋼網印刷方法 - Google Patents

電路板鋼網印刷方法 Download PDF

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TW201722229A
TW201722229A TW105100447A TW105100447A TW201722229A TW 201722229 A TW201722229 A TW 201722229A TW 105100447 A TW105100447 A TW 105100447A TW 105100447 A TW105100447 A TW 105100447A TW 201722229 A TW201722229 A TW 201722229A
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circuit board
printing
steel mesh
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張學琴
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鴻海精密工業股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)

Abstract

本發明提供一種電路板鋼網印刷方法，用於製作印刷電路板，該方法包括開料及對開料後的電路板進行開孔的步驟，該方法還包括線路圖印刷步驟，藉由一第一鋼網、一刮板及導電油墨將該第一鋼網上的線路圖印刷至開孔後的電路板上；阻焊層印刷步驟，藉由一第二鋼網及該刮板將阻焊材料印刷至該電路板上；文字及標記印刷步驟，藉由一第三鋼網、該刮板及油墨將該第三鋼網上的文字及標記印刷至該電路板上；及錫膏印刷步驟，藉由一第四鋼網及該刮板將錫膏印刷至該電路板上。

Description

電路板鋼網印刷方法
本發明涉及一種電路板鋼網印刷方法。
在印刷電路板的生產製造過程中，通常需要對電路板進行沉銅、線路圖形轉移、圖形電鍍、退膜、蝕刻、退錫、阻焊圖形轉移及沉錫的作業，該些作業流程耗時較長，而且在制板的過程中產生的物質容易對環境造成污染。
有鑒於此，有必要提供一種電路板鋼網印刷方法，以解決上述技術問題。
本發明提供一種電路板鋼網印刷方法，用於製作印刷電路板，該方法包括開料及對開料後的電路板進行開孔的步驟，該方法還包括：
線路圖印刷步驟，藉由一第一鋼網、一刮板及導電油墨將該第一鋼網上的線路圖印刷至開孔後的電路板上；
阻焊層印刷步驟，藉由一第二鋼網及該刮板將阻焊材料印刷至該電路板上；
文字及標記印刷步驟，藉由一第三鋼網、該刮板及油墨將該第三鋼網上的文字及標記印刷至該電路板上；及
錫膏印刷步驟，藉由一第四鋼網及該刮板將錫膏印刷至該電路板上。
相較於習知技術，本發明提供的電路板鋼網印刷方法採用鋼網印刷作業對電路板進行印刷，相對於傳統的作業流程減少了部分工序，從而節省了時間，並且在製作電路板的過程中減少了對環境造成的污染。
圖1為本發明電路板鋼網印刷方法較佳實施方式的流程圖。
圖2為本發明電路板鋼網印刷方法印刷多層電路板的流程圖。
請參考圖1，為本發明所提供的電路板鋼網印刷方法的流程圖。在本實施方式中，該電路板鋼網印刷方法主要藉由鋼網、刮板及印刷材料進行電路板的印刷。鋼網通常由不銹鋼製成，其包括絲網、鋼片、網框及粘接膠。該絲網鋪設於該鋼片上，採用鐳射切割、化學蝕刻或電鑄成型等方法可以在該鋼片上開孔。該網框用於固定該絲網及該鋼片，粘接膠用於將該絲網固定粘接在鋼片及網框上。刮板通常由橡膠材料製成，用於刮擠絲網上的印刷材料。
當使用鋼網印刷方法製作印刷電路板時，鋼網具有一定的預設厚度，從而便於將印刷材料印刷在電路板指定的區域。在本實施方式中，鋼網的預設厚度為0.1毫米-0.3毫米。絲網上的網孔可以透過印刷材料，所以印刷材料在刮板的刮擠下可在鋼片開孔處藉由絲網的網孔漏印在電路板上。
電路板鋼網印刷方法的具體步驟如下。
開料及開孔步驟S1，選取符合要求的板料，對選取的板料進行開料及對開料後的電路板進行開孔。
線路圖印刷步驟S2，藉由一第一鋼網、一刮板及導電油墨將該第一鋼網上的線路圖印刷至開孔後的電路板上。
具體的，線路圖印刷步驟S2包括將印有線路圖的第一鋼網固定於已開孔的電路板上，其中，該第一鋼網的開孔對準該電路板待印刷線路圖的區域。在該第一鋼網的一端放入導電油墨，採用一刮板按壓該第一鋼網上放有導電油墨的一端，並在該第一鋼網上放有導電油墨的一端及另一端之間來回按壓著移動，導電油墨在移動中被該刮板從該第一鋼網開孔區域對應的絲網網孔中擠壓到電路板上，從而將該線路圖印刷至該電路板上。在線路圖印刷完成後，將該刮板上的導電油墨清洗掉。在本實施方式中，導電油墨為金、銀、銅或碳等導電材料分散在連結料中製成的糊狀油墨。
阻焊層印刷步驟S3，藉由一第二鋼網及該刮板將阻焊材料印刷至該電路板上。
具體的，阻焊層印刷步驟S3包括將第二鋼網固定於該電路板上，其中，該第二鋼網上的開孔對準該電路板上待印刷阻焊層的區域。在該第二鋼網的一端放入阻焊材料，採用該刮板按壓該第二鋼網上放有阻焊材料的一端，並在該第二鋼網上放有阻焊材料的一端及另一端之間來回按壓著移動，阻焊材料在移動中被該刮板從該第二鋼網開孔區域對應的絲網網孔中擠壓到電路板上，從而在電路板上形成阻焊層。在阻焊層印刷完成後，將該刮板上的阻焊材料清洗掉。在本實施方式中，該阻焊材料為綠油、藍油或紅油。
文字及標記印刷步驟S4，藉由一第三鋼網、該刮板及油墨將該第三鋼網上的文字及標記印刷至該電路板上。
具體的，文字及標記印刷步驟S4包括將第三鋼網固定於該電路板上，其中，該第三鋼網上的文字及標記對應的開孔對準該電路板上待印刷文字及標記的區域。在該第三鋼網的一端放入油墨，採用該刮板按壓該第三鋼網上放有油墨的一端，並在該第三鋼網上放有油墨的一端及另一端之間來回按壓著移動，油墨在移動中被該刮板從該第三鋼網開孔區域對應的絲網網孔中擠壓到電路板上，從而在電路板上形成對應的文字及標記。在文字及標記印刷完成後，將該刮板上的油墨清洗掉。在本實施方式中，該油墨為熱固性油墨。
錫膏印刷步驟S6，藉由一第四鋼網及該刮板將錫膏印刷至該電路板上。
具體的，錫膏印刷步驟S6包括將第四鋼網固定於電路板上，其中，第四鋼網上的開孔對準該電路板上待印刷錫膏的區域。在該第四鋼網的一端放入錫膏，採用該刮板按壓該第四鋼網上放有錫膏的一端，並在該第四鋼網上放有錫膏的一端及另一端之間來回按壓著移動，錫膏在移動中被該刮板從該第四鋼網開孔區域對應的絲網網孔中擠壓到電路板上，從而將錫膏印刷至電路板上。在錫膏印刷完成後，將該刮板上的阻焊材料清洗掉。
電路板測試步驟S7，對製作完成的印刷電路板進行測試。在本實施方式中，對印刷電路板的測試包括電測試及目檢。其中，電測試用於測試印刷電路板的線路是否出現斷路或短路，目檢用於檢查印刷電路板的外觀是否存在缺陷。
請參考圖2，當製作的電路板為多層電路板時，該電路板鋼網印刷方法還包括以下步驟。
開料步驟S101，選取符合要求的板料，對選取的板料進行開料。
內層線路圖印刷步驟S201，藉由一第六鋼網、該刮板及導電油墨將該第六鋼網上的線路圖印刷至一多層電路板的內層電路板上。
內層電路板測試步驟S202，對完成線路圖印刷的內層電路板進行測試。
壓板步驟S203，將內層電路板及外層電路板壓合為一整體的多層電路板。
開孔步驟S104，對該多層電路板進行開孔。其中，該多層電路板上的開孔包括定位孔及用於電連接各層電路板的過孔。
導電漿貫孔印刷步驟S204，藉由一第五鋼網及該刮板將導電漿印刷至多層電路板需要印刷導體層的孔中。
在本實施方式中，該多層電路板上的過孔的孔壁周圍需要印刷導體層，導體層可在多層電路板的各層面之間製造電氣觸點而形成回路。具體的，該導電漿貫孔印刷步驟S204包括將該第五鋼網固定於電路板上，其中，該第五鋼網上的開孔對準該電路板需要印刷導體層的過孔。在該第五鋼網的一端放入導電漿，採用該刮板按壓該第五鋼網上放有導電漿的一端，並在該第五鋼網上放有導電漿的一端及另一端之間來回按壓著移動，導電漿在移動中被該刮板從該第四鋼網開孔區域對應的絲網網孔中擠壓到電路板上，從而將導電漿印刷至電路板上的過孔孔徑內，孔徑內的導電漿經固化後即可形成導體層。在導電漿印刷完成後，將該刮板上的導電漿清洗掉。在本實施方式中，該導電漿可為銀漿、銅漿或碳漿。
外層線路圖印刷步驟S205，藉由一第七鋼網、該刮板及導電油墨將該第七鋼網上的線路圖印刷至該多層電路板的外層電路板上。
外層電路板測試步驟S206，對完成線路圖印刷的外層電路板進行測試。
鍍金手指步驟S5，在該多層電路板的插頭手指上鍍上一層金屬層，其中，該金屬層為鎳金層。
如圖2所示，在多層電路板的印刷過程中，內層電路板測試步驟S202及外層電路板測試步驟S206可在線路圖印刷完成後對對應的電路板進行測試，從而儘早對測試不良的電路板進行修理或重工，避免增加後續處理不良電路板的難度。
本發明提供的電路板鋼網印刷方法無需沉銅、線路圖形轉移、圖形電鍍、退膜、蝕刻、退錫、阻焊圖形轉移及沉錫等傳統印刷流程中的工序，相對於傳統流程節省了時間，並且在製作印刷電路板的過程減少了化學反應產生的物質對環境的污染。
最後應說明的是，以上實施例僅用以說明本發明的實施方案而非限制，儘管參照較佳實施例對本發明進行了詳細說明，本領域的普通技術人員應當理解，可以對本發明的技術方案進行修改或者等同替換，而不脫離本發明技術方案的精神和範圍。
S1‧‧‧開料及開孔步驟
S101‧‧‧開料步驟
S102‧‧‧開孔步驟
S2‧‧‧線路圖印刷步驟
S3‧‧‧阻焊層印刷步驟
S4‧‧‧文字及標記印刷步驟
S5‧‧‧鍍金手指步驟
S6‧‧‧錫膏印刷步驟
S7‧‧‧電路板測試步驟
S201‧‧‧內層線路圖印刷步驟
S202‧‧‧內層電路板測試步驟
S203‧‧‧壓板步驟
S204‧‧‧導電漿貫孔印刷步驟
S205‧‧‧外層線路圖印刷步驟
S206‧‧‧外層電路板測試步驟
無
S1‧‧‧開料及開孔步驟
S2‧‧‧線路圖印刷步驟
S3‧‧‧阻焊層印刷步驟
S4‧‧‧文字及標記印刷步驟
S6‧‧‧錫膏印刷步驟
S7‧‧‧電路板測試步驟

Claims (6)

  1. 一種電路板鋼網印刷方法，用於製作印刷電路板，該方法包括開料及對開料後的電路板進行開孔的步驟，其中，該方法還包括： 線路圖印刷步驟，藉由一第一鋼網、一刮板及導電油墨將該第一鋼網上的線路圖印刷至開孔後的電路板上； 阻焊層印刷步驟，藉由一第二鋼網及該刮板將阻焊材料印刷至該電路板上； 文字及標記印刷步驟，藉由一第三鋼網、該刮板及油墨將該第三鋼網上的文字及標記印刷至該電路板上；及 錫膏印刷步驟，藉由一第四鋼網及該刮板將錫膏印刷至該電路板上。
  2. 如申請專利範圍第1項所述之電路板鋼網印刷方法，其中，該方法還包括： 測試步驟，對製作完成的印刷電路板進行測試。
  3. 如申請專利範圍第1項所述之電路板鋼網印刷方法，其中，該阻焊材料為綠油、藍油或紅油。
  4. 如申請專利範圍第1項所述之電路板鋼網印刷方法，其中，當製作的電路板為多層電路板時，該方法還包括： 壓板步驟，將內層電路板及外層電路板壓合為一整體的多層電路板；及 導電漿貫孔印刷步驟，藉由一第五鋼網及該刮板將導電漿印刷至多層電路板需要印刷導體層的過孔中。
  5. 如申請專利範圍第4項所述之電路板鋼網印刷方法，其中，該方法還包括： 鍍金手指步驟，在該多層電路板的插頭手指上鍍上一層金屬層。
  6. 如申請專利範圍第4項所述之電路板鋼網印刷方法，其中，該導電漿為銀漿、銅漿或碳漿。
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