WO2017113837A1 - Ic载板阻焊塞孔凹陷的改善方法及制造方法 - Google Patents

Ic载板阻焊塞孔凹陷的改善方法及制造方法 Download PDF

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Publication number
WO2017113837A1
WO2017113837A1 PCT/CN2016/096909 CN2016096909W WO2017113837A1 WO 2017113837 A1 WO2017113837 A1 WO 2017113837A1 CN 2016096909 W CN2016096909 W CN 2016096909W WO 2017113837 A1 WO2017113837 A1 WO 2017113837A1
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Prior art keywords
substrate
ink
via hole
hole
solder resist
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PCT/CN2016/096909
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English (en)
French (fr)
Inventor
刘成勇
李志东
谢添华
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
广州市兴森电子有限公司
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Priority to KR1020187022192A priority Critical patent/KR20180100376A/ko
Publication of WO2017113837A1 publication Critical patent/WO2017113837A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Definitions

  • the present invention relates to the field of IC carrier manufacturing technology, and in particular, to an improved method and a manufacturing method for a solder mask hole recess of an IC carrier.
  • Flash Memory Card is a long-life non-volatile memory that is commonly used as a storage medium in small digital products such as smartphones, digital cameras, and handheld computers.
  • the flash memory card is mainly composed of a memory chip and an IC carrier board that functions as an electrical connection.
  • the IC carrier board of the flash memory card is connected to the memory chip on one side, and the other side is exposed, and directly contacts the main body part of the electronic device during use. Since the memory chip is thin and the surface is flat, it is required that the surface roughness of the IC carrier plate in contact with it must be good.
  • it belongs to products that are in direct contact with consumers during use, so its appearance quality is especially important, especially for the exposed side, the appearance requirements will be higher.
  • solder mask plugging In the conventional solder mask hole process, the plug hole can be printed together with the surface ink (ie, the plug is printed), the process is simple and the yield is high, and it is widely used.
  • the common method of solder mask soldering plug hole is silk screen plug hole, that is, the product is supported by the screen printing pad, and the mesh plate is attached to the product, and the plug hole ink is inserted into the product hole through the screen under the scraping of the scraper to make the product hole. Filled with ink. Due to the characteristics of the solder resist ink, the quality of the solder resist is reduced and the density is increased, which causes the size of the solder resist ink to shrink accordingly, and the surface of the hole filled with the solder resist ink is inevitably depressed.
  • the present invention overcomes the defects of the prior art, and provides an improved method and a manufacturing method for the soldering plug hole recess of the IC carrier board, thereby effectively improving the problem of the soldering plug hole recess of the IC carrier.
  • An improved method for soldering a plug hole recess of an IC carrier board includes the following steps:
  • a solder resist ink is printed on the surface of the substrate, and the substrate is exposed and developed to cure the solder resist ink on the surface of the substrate.
  • fabricating the via holes on the substrate includes the following steps:
  • a second copper layer is plated on the surface of the substrate and the surface of the first copper layer.
  • the via hole is filled in the via hole by screen printing; the solder resist ink is printed on the surface of the substrate by screen printing.
  • the plug ink and the solder resist ink are ultraviolet curable inks.
  • the impurities on the inner wall of the via hole are removed in advance before filling the via hole; and impurities on the surface of the substrate are removed before the solder resist ink on the surface of the printed substrate.
  • the invention also provides a method for manufacturing an IC carrier board, comprising the following steps:
  • Soldering ink is printed on the surface of the substrate, and the substrate is exposed and developed to cure the solder resist ink on the surface of the substrate;
  • the shape of the substrate is processed to obtain a finished product.
  • the substrate is subjected to a baking process.
  • the substrate is subjected to high pressure water cleaning and degreasing treatment.
  • the residue on the substrate is removed by a plasma remover.
  • An automatic optical inspection system is used to detect whether the substrate has a function or appearance defect.
  • the via hole is filled with the plug hole ink, and the diffused plug hole ink is removed by development after the exposure, and the surface of the substrate is polished after the plug ink is cured, and the lead is removed.
  • the plug hole ink outside the through hole is finally printed on the surface of the substrate and cured, and then the post process can be performed.
  • the plug ink still has a certain depression after curing, and can re-cover these depressions when printing the solder resist ink, thereby improving the soldering plug hole depression, and is practical and effective.
  • the above IC carrier manufacturing method utilizes the above principle to mass-produce the IC carrier board product, and can basically solve the problem of the soldering plug hole depression, the product quality is stable, and has good promotion value.
  • FIG. 1 is a flow chart showing a method for improving a solder mask plug hole recess of an IC carrier according to an embodiment of the present invention
  • FIG. 2 is a flow chart of a method for manufacturing an IC carrier board according to an embodiment of the present invention.
  • the method for improving the soldering plug hole recess of the IC carrier includes the following steps:
  • the via hole is filled with the plug hole ink, and the diffused plug hole ink is removed by development after the exposure, and the surface of the substrate is polished after the plug ink is cured, and the lead is removed.
  • the plug hole ink outside the through hole is finally printed on the surface of the substrate and cured, and then the post process can be performed.
  • the plug ink still has a certain depression after curing, and can re-cover these depressions when printing the solder resist ink, thereby improving the soldering plug hole depression, and is practical and effective.
  • most of the plug ink is developed, and only a large number of brush wheels can be used for grinding, which can avoid such problems as gold wire drawing, grinding and crushing.
  • the via hole is filled in the via hole by screen printing; the solder resist ink is printed on the surface of the substrate by screen printing.
  • Screen printing has the advantages of convenient operation, strong ink layer coverage, low cost and energy saving.
  • the plug hole ink and the solder resist ink are all UV-curable inks, which have small environmental pollution, fast curing speed, energy saving, good curing product performance, and are suitable for high-speed automatic production.
  • the impurity on the inner wall of the via hole is removed in advance; before the solder resist ink on the surface of the printed substrate, impurities on the surface of the substrate are removed in advance to improve the adhesion of the ink.
  • This embodiment further provides a method for manufacturing an IC carrier board, including the following steps:
  • the baking plate treatment can eliminate the moisture and internal stress of the substrate, and the thinning copper treatment can make the copper surface thickness of the substrate uniform and facilitate subsequent production.
  • the through hole is drilled by using a numerical control drilling machine, and the machining precision is high and the speed is fast.
  • S50 plating a second copper layer on a surface of the substrate and a surface of the first copper layer;
  • S60 filling the via hole with a plug hole ink, exposing and developing the substrate, and curing the plug hole ink in the via hole;
  • an ultraviolet curable ink is used as the plug hole ink.
  • the baking sheet treatment further hardens the plug ink.
  • an ultraviolet curable ink is used as the solder resist ink.
  • the impurities on the substrate are removed to facilitate subsequent production.
  • S130 detecting, by using an automatic optical inspection (AOI) system, whether a substrate has a function or a defect in appearance;
  • AOI automatic optical inspection
  • the image acquired by the camera is compared with the qualified parameters in the database, and after image processing, the defects on the substrate are inspected, and the defects are displayed/marked by the display or the automatic sign for maintenance by the maintenance personnel.
  • S140 The shape of the substrate is processed to obtain a finished product.
  • the outer shape of the substrate is processed by milling.
  • the IC carrier board product mass-produced by the above IC carrier manufacturing method can basically solve the problem of the soldering plug hole depression, and the product quality is stable. In actual production, it has reached 0 soldering plug hole depression, which has good promotion value.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

提供一种IC载板阻焊塞孔凹陷的改善方法及制造方法，包括以下步骤：提供基板，在基板上制作导通孔；采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述导通孔内的塞孔油墨；研磨基板的表面；在基板上制作线路图形；在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨。上述IC载板阻焊塞孔凹陷的改善方法，塞孔油墨在固化后会产生一定的凹陷，在印刷阻焊油墨时能将这些凹陷重新覆盖，起到改善阻焊塞孔凹陷的作用。

Description

IC载板阻焊塞孔凹陷的改善方法及制造方法 技术领域
本发明涉及IC载板制造技术领域，特别涉及一种IC载板阻焊塞孔凹陷的改善方法及制造方法。
背景技术
闪存卡(Flash Memory Card)是一种长寿命的非易失性存储器，一般应用在智能手机，数码相机，掌上电脑等小型数码产品中作为存储介质。闪存卡主要由记忆芯片和起电器连接作用的IC载板构成。闪存卡的IC载板一面与记忆芯片相连，另外一面裸露出来，在使用过程中直接与电子设备的主体部件接触。由于记忆芯片薄且表面平整，因而要求与之接触的IC载板表面平整性必须要好。另外，它属于在使用时直接与消费者接触的产品，因而其外观品质尤其重要，特别是对裸露出来的一面，外观要求会更高。
IC载板生产主要采用阻焊塞孔方式。常规的阻焊塞孔工艺，塞孔可以与表面油墨一起印刷(即连塞带印)，流程简单且良率高，被广泛采用。阻焊阻焊塞孔常用的方法是丝印塞孔，即通过丝印垫板支撑产品，产品上贴合网板，塞孔油墨在刮刀的刮印下透过丝网进入产品孔内，使产品孔内充满油墨。由于阻焊油墨的特性，其固化后质量会减少，密度会增大，这就使得阻焊油墨体积会相应地收缩，采用阻焊油墨填塞的孔表面必然会产生凹陷。
发明内容
基于此，本发明在于克服现有技术的缺陷，提供一种IC载板阻焊塞孔凹陷的改善方法及制造方法，有效改善IC载板阻焊塞孔凹陷的问题。
其技术方案如下：
一种IC载板阻焊塞孔凹陷的改善方法，包括以下步骤：
提供基板，在基板上制作导通孔；
采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述 导通孔内的塞孔油墨；
研磨基板的表面；
在基板上制作线路图形；
在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨。
具体的，在基板上制作导通孔包括以下步骤:
在所述基板上钻出导通孔；
在所述导通孔的内壁沉积第一铜层；
在所述基板的表面及第一铜层的表面电镀第二铜层。
优选的，通过丝网印刷方式在所述导通孔中填充塞孔油墨；通过丝网印刷方式在所述基板的表面印刷阻焊油墨。
优选的，所述塞孔油墨及阻焊油墨均为紫外光固化油墨。
优选的，在填充所述导通孔前，预先去除导通孔内壁的杂质；在印刷基板表面的阻焊油墨前，预先去除基板表面的杂质。
本发明还提供一种IC载板制造方法，包括以下步骤：
提供基板，对基板进行烘板及减薄铜处理；
在所述基板上钻出导通孔；
在所述导通孔的内壁沉积第一铜层；
在所述基板的表面及第一铜层的表面电镀第二铜层；
采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述导通孔内的塞孔油墨；
研磨基板的表面；
在基板上制作线路图形；
在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨；
对基板进行图形电镀后，采用蚀刻液对基板进行蚀刻；
加工基板外形，得到成品。
进一步的，在研磨基板的表面之后，且在基板上制作线路图形之前，还 包括以下步骤：
对基板进行烘板处理。
进一步的，在所述基板上钻出导通孔之后，且在所述导通孔的内壁沉积第一铜层之前，还包括以下步骤：
对基板进行高压水清洗及除胶处理。
进一步的，在固化所述基板表面上的阻焊油墨之后，且在基板进行图形电镀之前，还包括以下步骤：
利用等离子除胶机清除基板上的残渣。
进一步的，在采用蚀刻液对基板进行蚀刻之后，且在加工基板外形之前，还包括以下步骤：
采用自动光学检查系统检测基板是否存在功能或外观上的缺陷。
下面对前述技术方案的优点或原理进行说明：
上述IC载板阻焊塞孔凹陷的改善方法，先采用塞孔油墨对导通孔进行填充，曝光后通过显影将扩散的塞孔油墨去除，塞孔油墨固化后再研磨基板的表面，去除导通孔外的塞孔油墨，最后在基板的表面印刷阻焊油墨并固化后即可进行后制程。塞孔油墨在固化后仍会产生一定的凹陷，在印刷阻焊油墨时能将这些凹陷重新覆盖，起到改善阻焊塞孔凹陷的作用，实用有效。而且塞孔油墨大部分被显影掉，仅需要使用目数较大的刷轮即可研磨干净，可避免诸如金面拉丝，研磨压伤等情况的发生。上述IC载板制造方法利用上述原理对IC载板产品进行量产，能够基本解决阻焊塞孔凹陷的问题，产品品质稳定，具备良好的推广价值。
附图说明
图1为本发明实施例所述的IC载板阻焊塞孔凹陷的改善方法的流程图；
图2为本发明实施例所述的IC载板制造方法的流程图。
具体实施方式
下面对本发明的实施例进行详细说明：
参照图1所示，本实施例所述的IC载板阻焊塞孔凹陷的改善方法，包括以下步骤：
S1：提供基板，在基板上制作导通孔；
S2：采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述导通孔内的塞孔油墨；
S3：研磨基板的表面；
S4：在基板上制作线路图形；
S5：在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨。
上述IC载板阻焊塞孔凹陷的改善方法，先采用塞孔油墨对导通孔进行填充，曝光后通过显影将扩散的塞孔油墨去除，塞孔油墨固化后再研磨基板的表面，去除导通孔外的塞孔油墨，最后在基板的表面印刷阻焊油墨并固化后即可进行后制程。塞孔油墨在固化后仍会产生一定的凹陷，在印刷阻焊油墨时能将这些凹陷重新覆盖，起到改善阻焊塞孔凹陷的作用，实用有效。而且塞孔油墨大部分被显影掉，仅需要使用目数较大的刷轮即可研磨干净，可避免诸如金面拉丝，研磨压伤等情况的发生。
优选的，通过丝网印刷方式在所述导通孔中填充塞孔油墨；通过丝网印刷方式在所述基板的表面印刷阻焊油墨。丝网印刷具有操作方便，墨层覆盖力强,成本低廉节约能源的优点。所述塞孔油墨及阻焊油墨均为紫外光固化油墨,对环境污染小，固化速度快，节省能源、固化产物性能好，适合于高速自动化生产。在填充所述导通孔前，预先去除导通孔内壁的杂质；在印刷基板表面的阻焊油墨前，预先去除基板表面的杂质，提高油墨的附着力。
本实施例还提供一种IC载板制造方法，包括以下步骤：
S10：提供基板，对基板进行烘板及减薄铜处理；
烘板处理能消除基板的水分及内应力，减薄铜处理能使基板铜面厚度均匀，便于后续生产。
S20：在所述基板上钻出导通孔；
本实施例使用数控钻机钻出导通孔，加工精度高，速度快。
S30：对基板进行高压水清洗及除胶处理；
去除钻污，方便后续生产。
S40：在所述导通孔的内壁沉积第一铜层；
S50：在所述基板的表面及第一铜层的表面电镀第二铜层；
S60：采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述导通孔内的塞孔油墨；
本实施例采用紫外光固化油墨作为塞孔油墨。
S70：研磨基板的表面；
去除导通孔外的塞孔油墨。
S80：对基板进行烘板处理；
烘板处理使得塞孔油墨进一步硬化。
S90：在基板上制作线路图形；
S100：在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨；
本实施例采用紫外光固化油墨作为阻焊油墨。
S110：利用等离子除胶机清除基板上的残渣；
去除基板上的杂质，方便后续生产。
S120：对基板进行图形电镀后，采用蚀刻液对基板进行蚀刻；
S130：采用自动光学检查(AOI)系统检测基板是否存在功能或外观上的缺陷；
通过摄像头采集图像与数据库中的合格的参数进行比较，经过图像处理，检查出基板上的缺陷，并通过显示器或自动标志把缺陷显示/标示出来，供维修人员修整。
S140：加工基板外形，得到成品。
本实施例采用铣削进行基板外形加工。
通过上述IC载板制造方法进行量产的IC载板产品，能够基本解决阻焊塞孔凹陷的问题，产品品质稳定。实际生产中，已经达到0阻焊塞孔凹陷，具备良好的推广价值。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种IC载板阻焊塞孔凹陷的改善方法，其特征在于，包括以下步骤：
    提供基板，在基板上制作导通孔；
    采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述导通孔内的塞孔油墨；
    研磨基板的表面；
    在基板上制作线路图形；
    在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨。
  2. 根据权利要求1所述的IC载板阻焊塞孔凹陷的改善方法，其特征在于，在基板上制作导通孔包括以下步骤:
    在所述基板上钻出导通孔；
    在所述导通孔的内壁沉积第一铜层；
    在所述基板的表面及第一铜层的表面电镀第二铜层。
  3. 根据权利要求1所述的IC载板阻焊塞孔凹陷的改善方法，其特征在于，通过丝网印刷方式在所述导通孔中填充塞孔油墨；通过丝网印刷方式在所述基板的表面印刷阻焊油墨。
  4. 根据权利要求3所述的IC载板阻焊塞孔凹陷的改善方法，其特征在于，所述塞孔油墨及阻焊油墨均为紫外光固化油墨。
  5. 根据权利要求1-4任一项所述的IC载板阻焊塞孔凹陷的改善方法，其特征在于，在填充所述导通孔前，预先去除导通孔内壁的杂质；在印刷基板表面的阻焊油墨前，预先去除基板表面的杂质。
  6. 一种IC载板制造方法，其特征在于，包括以下步骤：
    提供基板，对基板进行烘板及减薄铜处理；
    在所述基板上钻出导通孔；
    在所述导通孔的内壁沉积第一铜层；
    在所述基板的表面及第一铜层的表面电镀第二铜层；
    采用塞孔油墨填充所述导通孔，对所述基板进行曝光、显影，固化所述 导通孔内的塞孔油墨；
    研磨基板的表面；
    在基板上制作线路图形；
    在基板的表面印刷阻焊油墨，对所述基板进行曝光、显影，固化所述基板表面上的阻焊油墨；
    对基板进行图形电镀后，采用蚀刻液对基板进行蚀刻；
    加工基板外形，得到成品。
  7. 根据权利要求6所述的IC载板制造方法，其特征在于，在研磨基板的表面之后，且在基板上制作线路图形之前，还包括以下步骤：
    对基板进行烘板处理。
  8. 根据权利要求6所述的IC载板制造方法，其特征在于，在所述基板上钻出导通孔之后，且在所述导通孔的内壁沉积第一铜层之前，还包括以下步骤：
    对基板进行高压水清洗及除胶处理。
  9. 根据权利要求6所述的IC载板制造方法，其特征在于，在固化所述基板表面上的阻焊油墨之后，且在基板进行图形电镀之前，还包括以下步骤：
    利用等离子除胶机清除基板上的残渣。
  10. 根据权利要求6-9任一项所述的IC载板制造方法，其特征在于，在采用蚀刻液对基板进行蚀刻之后，且在加工基板外形之前，还包括以下步骤：
    采用自动光学检查系统检测基板是否存在功能或外观上的缺陷。
PCT/CN2016/096909 2015-12-31 2016-08-26 Ic载板阻焊塞孔凹陷的改善方法及制造方法 WO2017113837A1 (zh)

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