CN104302161B - 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 - Google Patents
在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 Download PDFInfo
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- CN104302161B CN104302161B CN201410421039.0A CN201410421039A CN104302161B CN 104302161 B CN104302161 B CN 104302161B CN 201410421039 A CN201410421039 A CN 201410421039A CN 104302161 B CN104302161 B CN 104302161B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (19)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11595408P | 2008-11-19 | 2008-11-19 | |
| US61/115,954 | 2008-11-19 | ||
| US14465109P | 2009-01-14 | 2009-01-14 | |
| US61/144,651 | 2009-01-14 | ||
| US17680109P | 2009-05-08 | 2009-05-08 | |
| US17681009P | 2009-05-08 | 2009-05-08 | |
| US17679709P | 2009-05-08 | 2009-05-08 | |
| US17680309P | 2009-05-08 | 2009-05-08 | |
| US17680409P | 2009-05-08 | 2009-05-08 | |
| US17681309P | 2009-05-08 | 2009-05-08 | |
| US61/176,810 | 2009-05-08 | ||
| US61/176,797 | 2009-05-08 | ||
| US61/176,813 | 2009-05-08 | ||
| US61/176,803 | 2009-05-08 | ||
| US61/176,804 | 2009-05-08 | ||
| US61/176,801 | 2009-05-08 | ||
| US12/608,759 | 2009-10-29 | ||
| US12/608,759 US8555784B2 (en) | 2008-11-19 | 2009-10-29 | Method of processing electronic substrates using vertically separated pass through conveyor system |
| CN200980154758.8A CN102281959B (zh) | 2008-11-19 | 2009-11-12 | 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980154758.8A Division CN102281959B (zh) | 2008-11-19 | 2009-11-12 | 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104302161A CN104302161A (zh) | 2015-01-21 |
| CN104302161B true CN104302161B (zh) | 2018-02-09 |
Family
ID=42170982
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980154758.8A Active CN102281959B (zh) | 2008-11-19 | 2009-11-12 | 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 |
| CN201410421039.0A Active CN104302161B (zh) | 2008-11-19 | 2009-11-12 | 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980154758.8A Active CN102281959B (zh) | 2008-11-19 | 2009-11-12 | 在表面安装技术处理设备中的垂直分开的穿过传送系统和方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (8) | US8613134B2 (enExample) |
| EP (1) | EP2364225B1 (enExample) |
| JP (2) | JP2012509598A (enExample) |
| KR (1) | KR101652924B1 (enExample) |
| CN (2) | CN102281959B (enExample) |
| CA (1) | CA2744321C (enExample) |
| MX (1) | MX2011005315A (enExample) |
| WO (1) | WO2010059486A1 (enExample) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5415011B2 (ja) * | 2008-04-02 | 2014-02-12 | パナソニック株式会社 | スクリーン印刷装置 |
| US8613134B2 (en) | 2008-11-19 | 2013-12-24 | Illinois Tool Works Inc. | Method of conveying printed circuit boards |
| IT1399285B1 (it) * | 2009-07-03 | 2013-04-11 | Applied Materials Inc | Sistema di lavorazione substrato |
| JP5590530B2 (ja) * | 2010-08-03 | 2014-09-17 | 富士機械製造株式会社 | 基板印刷システム |
| US9757963B2 (en) | 2010-11-01 | 2017-09-12 | Scodix Ltd. | System and method for transporting substrates |
| CN103338937B (zh) * | 2010-11-01 | 2016-01-06 | 斯科迪克斯有限公司 | 运输承印材料的系统和方法 |
| ITVR20110228A1 (it) * | 2011-12-20 | 2013-06-21 | Projecta Engineering S R L | Macchina per la decorazione di prodotti |
| US9060437B2 (en) * | 2012-02-01 | 2015-06-16 | Illinois Tool Works Inc. | System and method for operating a stencil printer |
| CN104472029B (zh) * | 2012-07-17 | 2017-06-09 | 富士机械制造株式会社 | 对基板作业系统及作业机 |
| US8547548B1 (en) * | 2012-12-20 | 2013-10-01 | Kinsus Interconnect Technology Corp. | Final defect inspection system |
| US8837808B2 (en) * | 2012-12-20 | 2014-09-16 | Kinsus Interconnect Technology Corp. | Method of final defect inspection |
| DE102013101693B9 (de) * | 2013-02-20 | 2015-11-12 | Notion Systems GmbH | Oberflächenbearbeitungsvorrichtung |
| US9126398B2 (en) * | 2013-07-26 | 2015-09-08 | Asm Assembly Systems Singapore Pte Ltd | Apparatus for paste material printing, and printing method |
| US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
| WO2015114765A1 (ja) * | 2014-01-30 | 2015-08-06 | 富士機械製造株式会社 | 基板搬送装置およびそれを含んで構成された対基板作業システム |
| US9744727B2 (en) | 2014-04-02 | 2017-08-29 | Autodesk, Inc. | Electro-mechanical 3D printing design system |
| KR101970794B1 (ko) * | 2014-04-07 | 2019-04-22 | 한화정밀기계 주식회사 | 부품 실장기의 동작을 제어하는 방법 |
| WO2015168543A1 (en) | 2014-05-01 | 2015-11-05 | Sicpa Security Inks & Systems Usa, Inc. | Dynamically configurable production and/or distribution line control system and method therefor |
| EP3179840B1 (en) * | 2014-08-06 | 2020-11-04 | FUJI Corporation | Substrate work device |
| JP6387752B2 (ja) * | 2014-09-04 | 2018-09-12 | 富士ゼロックス株式会社 | プリンタ制御装置、プリンタ制御プログラム |
| JP6209285B2 (ja) * | 2014-09-04 | 2017-10-04 | ヤマハ発動機株式会社 | 部品実装装置および部品実装システム |
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| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
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| CN104843486B (zh) * | 2015-04-14 | 2018-02-16 | 苏州艾斯达克智能科技有限公司 | 一种smt物料输送方法及输送系统 |
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| CN106626734B (zh) * | 2015-10-30 | 2019-03-29 | 深圳市登峰网印设备有限公司 | 一种采用丝网印刷机进行塞孔和双面防焊的丝网印刷方法 |
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| CN105800311B (zh) * | 2016-05-04 | 2024-08-02 | 上海凯思尔电子有限公司 | 一种用于pcb生产设备的aoi自动收放板机 |
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| US20100122636A1 (en) | 2010-05-20 |
| CN104302161A (zh) | 2015-01-21 |
| US20130333206A1 (en) | 2013-12-19 |
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| US8555784B2 (en) | 2013-10-15 |
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| US20100122634A1 (en) | 2010-05-20 |
| MX2011005315A (es) | 2011-08-08 |
| CA2744321C (en) | 2015-12-22 |
| US20130180829A1 (en) | 2013-07-18 |
| EP2364225A4 (en) | 2013-04-03 |
| US20100125359A1 (en) | 2010-05-20 |
| JP2012509598A (ja) | 2012-04-19 |
| US8613134B2 (en) | 2013-12-24 |
| US9345147B2 (en) | 2016-05-17 |
| KR101652924B1 (ko) | 2016-09-09 |
| JP2015035615A (ja) | 2015-02-19 |
| US8939076B2 (en) | 2015-01-27 |
| CN102281959B (zh) | 2014-10-01 |
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