CN1342392A - 用元件装配基板的方法 - Google Patents
用元件装配基板的方法 Download PDFInfo
- Publication number
- CN1342392A CN1342392A CN00804464A CN00804464A CN1342392A CN 1342392 A CN1342392 A CN 1342392A CN 00804464 A CN00804464 A CN 00804464A CN 00804464 A CN00804464 A CN 00804464A CN 1342392 A CN1342392 A CN 1342392A
- Authority
- CN
- China
- Prior art keywords
- substrate
- linkage editor
- time
- assembling
- rigging position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 9
- 230000006872 improvement Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19919916.7 | 1999-04-30 | ||
DE19919916A DE19919916C2 (de) | 1999-04-30 | 1999-04-30 | Verfahren zur zeitoptimierten Bestückung von Leiterplatten |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1342392A true CN1342392A (zh) | 2002-03-27 |
CN1173618C CN1173618C (zh) | 2004-10-27 |
Family
ID=7906554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008044643A Expired - Lifetime CN1173618C (zh) | 1999-04-30 | 2000-04-03 | 用元件装配基板的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6618935B1 (zh) |
EP (1) | EP1186219B1 (zh) |
JP (1) | JP2002543600A (zh) |
KR (1) | KR100418469B1 (zh) |
CN (1) | CN1173618C (zh) |
DE (2) | DE19919916C2 (zh) |
WO (1) | WO2000067542A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7252831B2 (en) | 2003-05-16 | 2007-08-07 | J&J Consumer Companies, Inc. | Topical treatment of ingrown hairs |
CN101742896A (zh) * | 2008-11-11 | 2010-06-16 | 西门子电子集成系统有限责任两合公司 | 具有可插入装配和拾取区域之间的隔离装置的自动装配机 |
CN101142870B (zh) * | 2005-03-22 | 2010-12-22 | 西门子电子装配系统两合公司 | 用于为基底装配电气零部件的自动装配机 |
CN101578931B (zh) * | 2006-12-12 | 2014-03-19 | 先进装配系统有限责任两合公司 | 用于为衬底装配元件的自动装配机 |
CN114302639A (zh) * | 2020-10-08 | 2022-04-08 | 先进装配系统有限责任两合公司 | 调整装配线上两台自动装配机的功能性的措施同步化 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7133731B2 (en) | 2003-05-27 | 2006-11-07 | Matsushita Electric Industrial Co., Ltd. | Component mounting sequence optimizing method, component mounting device, program for executing component mounting sequence optimizing method, and recording medium in which the program is recorded |
JP4498896B2 (ja) * | 2003-12-26 | 2010-07-07 | ヤマハ発動機株式会社 | 表面実装機 |
JP5480776B2 (ja) * | 2010-11-02 | 2014-04-23 | ヤマハ発動機株式会社 | 実装モード決定方法及び部品実装システム |
JP5906399B2 (ja) * | 2013-02-22 | 2016-04-20 | パナソニックIpマネジメント株式会社 | 電子部品実装システムおよび電子部品実装方法 |
EP3160218B1 (en) * | 2014-06-17 | 2019-04-17 | FUJI Corporation | Electronic component mounting method and electronic component mounting system |
NL2014745B1 (nl) | 2015-05-01 | 2017-01-25 | Korsmit Production Improvement | Werkwijze voor het analyseren van de prestaties van een productielijn en analyse-systeem. |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2173426A (en) | 1985-04-09 | 1986-10-15 | Dynapert Precima Ltd | Component placement machine |
WO1997003547A1 (fr) * | 1995-07-12 | 1997-01-30 | Matsushita Electric Industrial Co., Ltd. | Procede et appareil pour monter des composants electroniques |
JP3474682B2 (ja) * | 1995-08-07 | 2003-12-08 | 松下電器産業株式会社 | 実装部品振り分け方法及び実装設備 |
JP3552806B2 (ja) * | 1995-09-13 | 2004-08-11 | 松下電器産業株式会社 | 部品実装方法 |
JPH10190299A (ja) * | 1996-12-20 | 1998-07-21 | Matsushita Electric Ind Co Ltd | 電子部品実装ライン及び電子部品実装方法 |
US5909674A (en) * | 1996-12-23 | 1999-06-01 | Philips Electronics North America Corp. | Method for optimizing the layout and charge maps of a flowline of pick and place machines |
US6568069B1 (en) * | 1997-02-24 | 2003-05-27 | Siemens Aktiengesellschaft | Apparatus for manufacture of electrical assemblies |
-
1999
- 1999-04-30 DE DE19919916A patent/DE19919916C2/de not_active Expired - Fee Related
-
2000
- 2000-03-31 US US09/540,561 patent/US6618935B1/en not_active Expired - Lifetime
- 2000-04-03 KR KR10-2001-7013908A patent/KR100418469B1/ko active IP Right Grant
- 2000-04-03 EP EP00934862A patent/EP1186219B1/de not_active Expired - Lifetime
- 2000-04-03 DE DE50008967T patent/DE50008967D1/de not_active Expired - Lifetime
- 2000-04-03 WO PCT/DE2000/001027 patent/WO2000067542A1/de active IP Right Grant
- 2000-04-03 CN CNB008044643A patent/CN1173618C/zh not_active Expired - Lifetime
- 2000-04-03 JP JP2000614791A patent/JP2002543600A/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7252831B2 (en) | 2003-05-16 | 2007-08-07 | J&J Consumer Companies, Inc. | Topical treatment of ingrown hairs |
CN101142870B (zh) * | 2005-03-22 | 2010-12-22 | 西门子电子装配系统两合公司 | 用于为基底装配电气零部件的自动装配机 |
CN101578931B (zh) * | 2006-12-12 | 2014-03-19 | 先进装配系统有限责任两合公司 | 用于为衬底装配元件的自动装配机 |
CN101742896A (zh) * | 2008-11-11 | 2010-06-16 | 西门子电子集成系统有限责任两合公司 | 具有可插入装配和拾取区域之间的隔离装置的自动装配机 |
CN101742896B (zh) * | 2008-11-11 | 2015-06-17 | 先进装配系统有限责任两合公司 | 具有可插入装配和拾取区域之间的隔离装置的自动装配机 |
CN114302639A (zh) * | 2020-10-08 | 2022-04-08 | 先进装配系统有限责任两合公司 | 调整装配线上两台自动装配机的功能性的措施同步化 |
Also Published As
Publication number | Publication date |
---|---|
EP1186219B1 (de) | 2004-12-15 |
CN1173618C (zh) | 2004-10-27 |
WO2000067542A1 (de) | 2000-11-09 |
JP2002543600A (ja) | 2002-12-17 |
KR20020010625A (ko) | 2002-02-04 |
EP1186219A1 (de) | 2002-03-13 |
DE19919916C2 (de) | 2001-07-05 |
KR100418469B1 (ko) | 2004-02-14 |
DE50008967D1 (de) | 2005-01-20 |
US6618935B1 (en) | 2003-09-16 |
DE19919916A1 (de) | 2000-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS AG Free format text: FORMER OWNER: SIEMENS DIMEIDICK STOCK COMPANY Effective date: 20090918 Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090918 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: SIEMENS DIMEIDICK STOCK COMPANY Free format text: FORMER NAME: SIEMENS PRODUCTION AND LOGISTICS SYSTEMS AG |
|
CP01 | Change in the name or title of a patent holder |
Address after: Nuremberg Patentee after: SIEMENS DEMATIC AG Address before: Nuremberg Patentee before: SIEMENS PRODUCTION AND LOGISTICS SYSTEMS AG |
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TR01 | Transfer of patent right |
Effective date of registration: 20090918 Address after: Munich, Germany Patentee after: SIEMENS AG Address before: Nuremberg Patentee before: SIEMENS DEMATIC AG Effective date of registration: 20090918 Address after: Munich, Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CX01 | Expiry of patent term |
Granted publication date: 20041027 |
|
CX01 | Expiry of patent term |