JP2012175024A5 - - Google Patents
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- Publication number
- JP2012175024A5 JP2012175024A5 JP2011037969A JP2011037969A JP2012175024A5 JP 2012175024 A5 JP2012175024 A5 JP 2012175024A5 JP 2011037969 A JP2011037969 A JP 2011037969A JP 2011037969 A JP2011037969 A JP 2011037969A JP 2012175024 A5 JP2012175024 A5 JP 2012175024A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- recess
- protruding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 13
- 238000005219 brazing Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 14
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000002161 passivation Methods 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011037969A JP5870493B2 (ja) | 2011-02-24 | 2011-02-24 | 半導体装置、センサーおよび電子デバイス |
| CN201210034217.5A CN102651357B (zh) | 2011-02-24 | 2012-02-15 | 半导体装置、传感器以及电子设备 |
| US13/403,338 US9000575B2 (en) | 2011-02-24 | 2012-02-23 | Semiconductor device having stacked substrates with protruding and recessed electrode connection |
| US14/504,957 US9209112B2 (en) | 2011-02-24 | 2014-10-02 | Semiconductor device having stacked substrates with protruding and recessed electrode connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011037969A JP5870493B2 (ja) | 2011-02-24 | 2011-02-24 | 半導体装置、センサーおよび電子デバイス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015124502A Division JP6290830B6 (ja) | 2015-06-22 | 2015-06-22 | 半導体装置、センサーおよび電子デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012175024A JP2012175024A (ja) | 2012-09-10 |
| JP2012175024A5 true JP2012175024A5 (enExample) | 2014-03-27 |
| JP5870493B2 JP5870493B2 (ja) | 2016-03-01 |
Family
ID=46693325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011037969A Active JP5870493B2 (ja) | 2011-02-24 | 2011-02-24 | 半導体装置、センサーおよび電子デバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9000575B2 (enExample) |
| JP (1) | JP5870493B2 (enExample) |
| CN (1) | CN102651357B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9281242B2 (en) | 2012-10-25 | 2016-03-08 | Nanya Technology Corp. | Through silicon via stacked structure and a method of manufacturing the same |
| US9844139B2 (en) * | 2013-03-16 | 2017-12-12 | Indiana Integrated Circuits, LLC | Method of interconnecting microchips |
| JP5936570B2 (ja) * | 2013-03-21 | 2016-06-22 | シャープ株式会社 | 構造体および無線通信装置 |
| JP2016018879A (ja) | 2014-07-08 | 2016-02-01 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| CN105990166B (zh) * | 2015-02-27 | 2018-12-21 | 中芯国际集成电路制造(上海)有限公司 | 晶圆键合方法 |
| US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
| US11495560B2 (en) | 2015-08-10 | 2022-11-08 | X Display Company Technology Limited | Chiplets with connection posts |
| US10121812B2 (en) * | 2015-12-29 | 2018-11-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stacked substrate structure with inter-tier interconnection |
| JP6779697B2 (ja) * | 2016-07-29 | 2020-11-04 | 株式会社ジャパンディスプレイ | 電子機器及びその製造方法 |
| US10050021B1 (en) * | 2017-02-16 | 2018-08-14 | Nanya Technology Corporation | Die device, semiconductor device and method for making the same |
| CN109671821B (zh) * | 2017-10-13 | 2022-01-25 | 英属开曼群岛商錼创科技股份有限公司 | 微型发光元件及显示装置 |
| KR20190083054A (ko) * | 2018-01-03 | 2019-07-11 | 삼성전자주식회사 | 반도체 패키지 |
| CN109979833A (zh) * | 2019-03-10 | 2019-07-05 | 复旦大学 | 一种基于嵌套结构和退火的快速常温微凸点键合方法 |
| TWI726685B (zh) | 2020-04-16 | 2021-05-01 | 錼創顯示科技股份有限公司 | 微型發光元件顯示裝置 |
| CN111463233B (zh) * | 2020-04-16 | 2022-09-13 | 錼创显示科技股份有限公司 | 微型发光元件显示装置 |
| KR20230017934A (ko) * | 2021-07-28 | 2023-02-07 | 삼성전자주식회사 | 반도체 패키지 |
| CN120184131A (zh) * | 2025-02-11 | 2025-06-20 | 芯爱科技(南京)有限公司 | 封装基板及其制法 |
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-
2011
- 2011-02-24 JP JP2011037969A patent/JP5870493B2/ja active Active
-
2012
- 2012-02-15 CN CN201210034217.5A patent/CN102651357B/zh active Active
- 2012-02-23 US US13/403,338 patent/US9000575B2/en active Active
-
2014
- 2014-10-02 US US14/504,957 patent/US9209112B2/en active Active
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