JP2011138913A5 - - Google Patents

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Publication number
JP2011138913A5
JP2011138913A5 JP2009297736A JP2009297736A JP2011138913A5 JP 2011138913 A5 JP2011138913 A5 JP 2011138913A5 JP 2009297736 A JP2009297736 A JP 2009297736A JP 2009297736 A JP2009297736 A JP 2009297736A JP 2011138913 A5 JP2011138913 A5 JP 2011138913A5
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JP
Japan
Prior art keywords
layer
light emitting
gold
semiconductor
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009297736A
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English (en)
Japanese (ja)
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JP2011138913A (ja
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Publication date
Application filed filed Critical
Priority to JP2009297736A priority Critical patent/JP2011138913A/ja
Priority claimed from JP2009297736A external-priority patent/JP2011138913A/ja
Publication of JP2011138913A publication Critical patent/JP2011138913A/ja
Publication of JP2011138913A5 publication Critical patent/JP2011138913A5/ja
Pending legal-status Critical Current

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JP2009297736A 2009-12-28 2009-12-28 半導体発光素子とその製造方法 Pending JP2011138913A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009297736A JP2011138913A (ja) 2009-12-28 2009-12-28 半導体発光素子とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009297736A JP2011138913A (ja) 2009-12-28 2009-12-28 半導体発光素子とその製造方法

Publications (2)

Publication Number Publication Date
JP2011138913A JP2011138913A (ja) 2011-07-14
JP2011138913A5 true JP2011138913A5 (enExample) 2012-07-19

Family

ID=44350055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009297736A Pending JP2011138913A (ja) 2009-12-28 2009-12-28 半導体発光素子とその製造方法

Country Status (1)

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JP (1) JP2011138913A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932727B1 (ko) 2012-05-07 2018-12-27 삼성전자주식회사 범프 구조물, 이를 갖는 반도체 패키지 및 이의 제조 방법
CN105340089B (zh) * 2013-07-03 2021-03-12 亮锐控股有限公司 具有在金属化层之下的应力缓冲层的led
CN106298719A (zh) * 2016-09-13 2017-01-04 江苏纳沛斯半导体有限公司 金属凸块结构及其形成方法
CN108538998B (zh) * 2018-03-30 2021-02-23 扬州乾照光电有限公司 一种led芯片及其制作方法
WO2020138278A1 (ja) * 2018-12-26 2020-07-02 京セラ株式会社 電子部品の接合方法および接合構造体
CN111606301A (zh) * 2020-04-22 2020-09-01 诺思(天津)微系统有限责任公司 器件结构及封装方法、滤波器、电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159173A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Construction of bump electrode
JPS57188848A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Circuit element
JPH01166542A (ja) * 1987-12-22 1989-06-30 Fujitsu Ltd 半導体装置の製造方法
JP3141364B2 (ja) * 1992-05-06 2001-03-05 住友電気工業株式会社 半導体チップ
JP2002111113A (ja) * 2000-09-28 2002-04-12 Hitachi Ltd 光モジュール
JP2002190490A (ja) * 2000-12-20 2002-07-05 Denso Corp バンプを有する電子部品
JP2007173269A (ja) * 2005-12-19 2007-07-05 Showa Denko Kk フリップチップ型半導体発光素子、フリップチップ型半導体発光素子の製造方法、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ

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