JP2013065621A5 - - Google Patents
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- Publication number
- JP2013065621A5 JP2013065621A5 JP2011202126A JP2011202126A JP2013065621A5 JP 2013065621 A5 JP2013065621 A5 JP 2013065621A5 JP 2011202126 A JP2011202126 A JP 2011202126A JP 2011202126 A JP2011202126 A JP 2011202126A JP 2013065621 A5 JP2013065621 A5 JP 2013065621A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- wiring pattern
- layer
- roughened
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 33
- 229910000510 noble metal Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000009713 electroplating Methods 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 229910001252 Pd alloy Inorganic materials 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011202126A JP5844101B2 (ja) | 2011-09-15 | 2011-09-15 | 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011202126A JP5844101B2 (ja) | 2011-09-15 | 2011-09-15 | 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013065621A JP2013065621A (ja) | 2013-04-11 |
| JP2013065621A5 true JP2013065621A5 (enExample) | 2014-09-11 |
| JP5844101B2 JP5844101B2 (ja) | 2016-01-13 |
Family
ID=48188892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011202126A Active JP5844101B2 (ja) | 2011-09-15 | 2011-09-15 | 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5844101B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6266907B2 (ja) * | 2013-07-03 | 2018-01-24 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| KR102148845B1 (ko) * | 2013-12-12 | 2020-08-27 | 엘지이노텍 주식회사 | 인쇄회로기판 |
| KR20150074421A (ko) * | 2013-12-24 | 2015-07-02 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이를 포함하는 발광 장치 |
| JP6316731B2 (ja) | 2014-01-14 | 2018-04-25 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体パッケージ |
| US9799812B2 (en) | 2014-05-09 | 2017-10-24 | Kyocera Corporation | Light emitting element mounting substrate and light emitting device |
| JP2016051797A (ja) * | 2014-08-29 | 2016-04-11 | 大日本印刷株式会社 | 積層体、積層体を用いた配線基板の製造方法、配線基板、および配線基板を備える実装基板の製造方法 |
| JP6555907B2 (ja) | 2015-03-16 | 2019-08-07 | アルパッド株式会社 | 半導体発光装置 |
| EP3400762A4 (en) * | 2016-01-08 | 2019-08-14 | Lilotree, L.L.C. | PCB SURFACE COATING, METHOD OF USE AND ARRANGEMENTS OBTAINED THEREFROM |
| JP6924642B2 (ja) * | 2017-07-19 | 2021-08-25 | スタンレー電気株式会社 | 半導体発光素子アレイ、及び、半導体発光装置 |
| JP2021092629A (ja) * | 2019-12-09 | 2021-06-17 | フコクインダストリー株式会社 | 表示装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559795A (en) * | 1978-10-30 | 1980-05-06 | Nippon Electric Co | Printed circuit board and method of manufacturing same |
| SG102588A1 (en) * | 2000-08-03 | 2004-03-26 | Inst Materials Research & Eng | A process for modifying chip assembly substrates |
| JP2004055624A (ja) * | 2002-07-16 | 2004-02-19 | Murata Mfg Co Ltd | 基板の製造方法 |
| JP4674120B2 (ja) * | 2005-06-06 | 2011-04-20 | 京セラＳｌｃテクノロジー株式会社 | 配線基板およびその製造方法 |
| JP2010182865A (ja) * | 2009-02-05 | 2010-08-19 | Nitto Denko Corp | 配線回路基板の製造方法 |
| KR20120068831A (ko) * | 2009-07-17 | 2012-06-27 | 덴끼 가가꾸 고교 가부시키가이샤 | Ｌｅｄ 칩 접합체, ｌｅｄ 패키지, 및 ｌｅｄ 패키지의 제조 방법 |
-
2011
- 2011-09-15 JP JP2011202126A patent/JP5844101B2/ja active Active
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