JP2011138913A - 半導体発光素子とその製造方法 - Google Patents

半導体発光素子とその製造方法 Download PDF

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Publication number
JP2011138913A
JP2011138913A JP2009297736A JP2009297736A JP2011138913A JP 2011138913 A JP2011138913 A JP 2011138913A JP 2009297736 A JP2009297736 A JP 2009297736A JP 2009297736 A JP2009297736 A JP 2009297736A JP 2011138913 A JP2011138913 A JP 2011138913A
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Japan
Prior art keywords
layer
bump
gold
semiconductor
electrode
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Pending
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JP2009297736A
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English (en)
Japanese (ja)
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JP2011138913A5 (enExample
Inventor
Takahiko Sato
隆彦 佐藤
Toru Sekiguchi
亨 関口
Kazuaki Tanmachi
和昭 反町
Yoshimasa Kinoshita
嘉将 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP2009297736A priority Critical patent/JP2011138913A/ja
Publication of JP2011138913A publication Critical patent/JP2011138913A/ja
Publication of JP2011138913A5 publication Critical patent/JP2011138913A5/ja
Pending legal-status Critical Current

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JP2009297736A 2009-12-28 2009-12-28 半導体発光素子とその製造方法 Pending JP2011138913A (ja)

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JP2009297736A JP2011138913A (ja) 2009-12-28 2009-12-28 半導体発光素子とその製造方法

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JP2009297736A JP2011138913A (ja) 2009-12-28 2009-12-28 半導体発光素子とその製造方法

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JP2011138913A true JP2011138913A (ja) 2011-07-14
JP2011138913A5 JP2011138913A5 (enExample) 2012-07-19

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8922008B2 (en) 2012-05-07 2014-12-30 Samsung Electronics Co., Ltd. Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure
JP2016526797A (ja) * 2013-07-03 2016-09-05 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． メタライゼーション層の下に応力緩和層を有するｌｅｄ
CN106298719A (zh) * 2016-09-13 2017-01-04 江苏纳沛斯半导体有限公司 金属凸块结构及其形成方法
CN108538998A (zh) * 2018-03-30 2018-09-14 扬州乾照光电有限公司 一种led芯片及其制作方法
WO2020138278A1 (ja) * 2018-12-26 2020-07-02 京セラ株式会社 電子部品の接合方法および接合構造体
CN111606301A (zh) * 2020-04-22 2020-09-01 诺思(天津)微系统有限责任公司 器件结构及封装方法、滤波器、电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159173A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Construction of bump electrode
JPS57188848A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Circuit element
JPH01166542A (ja) * 1987-12-22 1989-06-30 Fujitsu Ltd 半導体装置の製造方法
JPH05315338A (ja) * 1992-05-06 1993-11-26 Sumitomo Electric Ind Ltd 半導体チップ
JP2002111113A (ja) * 2000-09-28 2002-04-12 Hitachi Ltd 光モジュール
JP2002190490A (ja) * 2000-12-20 2002-07-05 Denso Corp バンプを有する電子部品
JP2007173269A (ja) * 2005-12-19 2007-07-05 Showa Denko Kk フリップチップ型半導体発光素子、フリップチップ型半導体発光素子の製造方法、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159173A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Construction of bump electrode
JPS57188848A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Circuit element
JPH01166542A (ja) * 1987-12-22 1989-06-30 Fujitsu Ltd 半導体装置の製造方法
JPH05315338A (ja) * 1992-05-06 1993-11-26 Sumitomo Electric Ind Ltd 半導体チップ
JP2002111113A (ja) * 2000-09-28 2002-04-12 Hitachi Ltd 光モジュール
JP2002190490A (ja) * 2000-12-20 2002-07-05 Denso Corp バンプを有する電子部品
JP2007173269A (ja) * 2005-12-19 2007-07-05 Showa Denko Kk フリップチップ型半導体発光素子、フリップチップ型半導体発光素子の製造方法、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8922008B2 (en) 2012-05-07 2014-12-30 Samsung Electronics Co., Ltd. Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure
JP2016526797A (ja) * 2013-07-03 2016-09-05 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． メタライゼーション層の下に応力緩和層を有するｌｅｄ
CN106298719A (zh) * 2016-09-13 2017-01-04 江苏纳沛斯半导体有限公司 金属凸块结构及其形成方法
CN108538998A (zh) * 2018-03-30 2018-09-14 扬州乾照光电有限公司 一种led芯片及其制作方法
WO2020138278A1 (ja) * 2018-12-26 2020-07-02 京セラ株式会社 電子部品の接合方法および接合構造体
CN111606301A (zh) * 2020-04-22 2020-09-01 诺思(天津)微系统有限责任公司 器件结构及封装方法、滤波器、电子设备

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