JP2009276316A5 - - Google Patents
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- Publication number
- JP2009276316A5 JP2009276316A5 JP2008130389A JP2008130389A JP2009276316A5 JP 2009276316 A5 JP2009276316 A5 JP 2009276316A5 JP 2008130389 A JP2008130389 A JP 2008130389A JP 2008130389 A JP2008130389 A JP 2008130389A JP 2009276316 A5 JP2009276316 A5 JP 2009276316A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- substrate
- opening
- resist film
- probe needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 15
- 230000000149 penetrating effect Effects 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 5
- 238000009713 electroplating Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 230000035515 penetration Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008130389A JP5276895B2 (ja) | 2008-05-19 | 2008-05-19 | プローブカード及びその製造方法 |
| US12/464,916 US7888953B2 (en) | 2008-05-19 | 2009-05-13 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008130389A JP5276895B2 (ja) | 2008-05-19 | 2008-05-19 | プローブカード及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009276316A JP2009276316A (ja) | 2009-11-26 |
| JP2009276316A5 true JP2009276316A5 (enExample) | 2011-03-31 |
| JP5276895B2 JP5276895B2 (ja) | 2013-08-28 |
Family
ID=41315590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008130389A Expired - Fee Related JP5276895B2 (ja) | 2008-05-19 | 2008-05-19 | プローブカード及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7888953B2 (enExample) |
| JP (1) | JP5276895B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7987591B2 (en) * | 2009-08-13 | 2011-08-02 | International Business Machines Corporation | Method of forming silicon chicklet pedestal |
| JP2011141126A (ja) * | 2010-01-05 | 2011-07-21 | Toshiba Corp | プローブカード |
| TWI408386B (zh) * | 2011-01-28 | 2013-09-11 | Chroma Ate Inc | A carrier plate having an airtight via hole for a semiconductor test apparatus, and a method of manufacturing the same |
| CN103869109B (zh) * | 2012-12-12 | 2017-10-10 | 华邦电子股份有限公司 | 探针卡及其焊接方法 |
| JP6235785B2 (ja) * | 2013-03-18 | 2017-11-22 | 日本電子材料株式会社 | プローブカード用ガイド板およびプローブカード用ガイド板の製造方法 |
| JP6341634B2 (ja) | 2013-05-28 | 2018-06-13 | 新光電気工業株式会社 | プローブガイド板及びその製造方法、半導体検査装置 |
| JP6220596B2 (ja) * | 2013-08-01 | 2017-10-25 | 東京エレクトロン株式会社 | プローバ |
| KR101724636B1 (ko) * | 2015-03-17 | 2017-04-10 | (주)엠투엔 | 플레이트부의 제조 방법 및 프로브 카드 |
| KR102751716B1 (ko) * | 2022-02-11 | 2025-01-09 | (주)티에스이 | 프리로드형 프로브 헤드 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0150334B1 (ko) * | 1995-08-17 | 1998-12-01 | 남재우 | 수직형니들을 가지는 프로브카드 및 그 제조방법 |
| JPH11142438A (ja) * | 1997-11-10 | 1999-05-28 | Japan Electronic Materials Corp | プローブ及びこのプローブを用いたプローブカード |
| JP2001091544A (ja) * | 1999-09-27 | 2001-04-06 | Hitachi Ltd | 半導体検査装置の製造方法 |
| US7143500B2 (en) * | 2001-06-25 | 2006-12-05 | Micron Technology, Inc. | Method to prevent damage to probe card |
| JP4249524B2 (ja) * | 2003-03-28 | 2009-04-02 | 富士通株式会社 | プローブカード |
| US7053496B2 (en) * | 2003-06-27 | 2006-05-30 | Intel Corporation | Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
| WO2006017078A2 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| JP2005156365A (ja) * | 2003-11-26 | 2005-06-16 | Shinko Electric Ind Co Ltd | 電気特性測定用プローブ及びその製造方法 |
| US20050253602A1 (en) * | 2004-04-28 | 2005-11-17 | Cram Daniel P | Resilient contact probe apparatus, methods of using and making, and resilient contact probes |
| JP2006049498A (ja) | 2004-08-03 | 2006-02-16 | Shinko Electric Ind Co Ltd | 接続端子の製造方法 |
| JP4613713B2 (ja) * | 2005-06-27 | 2011-01-19 | パナソニック電工株式会社 | 接続装置 |
| US7432728B2 (en) * | 2006-02-27 | 2008-10-07 | Sv Probe Pte Ltd. | Blade probe and blade probe card |
| JP4703456B2 (ja) * | 2006-03-28 | 2011-06-15 | 大日本印刷株式会社 | 電気信号測定用治具 |
| JP4522975B2 (ja) * | 2006-06-19 | 2010-08-11 | 東京エレクトロン株式会社 | プローブカード |
| US7595651B2 (en) * | 2007-02-13 | 2009-09-29 | Mpi Corporation | Cantilever-type probe card for high frequency application |
| US7750651B2 (en) * | 2008-03-07 | 2010-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer level test probe card |
-
2008
- 2008-05-19 JP JP2008130389A patent/JP5276895B2/ja not_active Expired - Fee Related
-
2009
- 2009-05-13 US US12/464,916 patent/US7888953B2/en active Active