JP5276895B2 - プローブカード及びその製造方法 - Google Patents

プローブカード及びその製造方法 Download PDF

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Publication number
JP5276895B2
JP5276895B2 JP2008130389A JP2008130389A JP5276895B2 JP 5276895 B2 JP5276895 B2 JP 5276895B2 JP 2008130389 A JP2008130389 A JP 2008130389A JP 2008130389 A JP2008130389 A JP 2008130389A JP 5276895 B2 JP5276895 B2 JP 5276895B2
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JP
Japan
Prior art keywords
forming
probe card
probe
substrate
opening
Prior art date
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Expired - Fee Related
Application number
JP2008130389A
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English (en)
Japanese (ja)
Other versions
JP2009276316A5 (enExample
JP2009276316A (ja
Inventor
裕一 田口
晶紀 白石
昌宏 春原
啓 村山
秀明 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008130389A priority Critical patent/JP5276895B2/ja
Priority to US12/464,916 priority patent/US7888953B2/en
Publication of JP2009276316A publication Critical patent/JP2009276316A/ja
Publication of JP2009276316A5 publication Critical patent/JP2009276316A5/ja
Application granted granted Critical
Publication of JP5276895B2 publication Critical patent/JP5276895B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2008130389A 2008-05-19 2008-05-19 プローブカード及びその製造方法 Expired - Fee Related JP5276895B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008130389A JP5276895B2 (ja) 2008-05-19 2008-05-19 プローブカード及びその製造方法
US12/464,916 US7888953B2 (en) 2008-05-19 2009-05-13 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008130389A JP5276895B2 (ja) 2008-05-19 2008-05-19 プローブカード及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009276316A JP2009276316A (ja) 2009-11-26
JP2009276316A5 JP2009276316A5 (enExample) 2011-03-31
JP5276895B2 true JP5276895B2 (ja) 2013-08-28

Family

ID=41315590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008130389A Expired - Fee Related JP5276895B2 (ja) 2008-05-19 2008-05-19 プローブカード及びその製造方法

Country Status (2)

Country Link
US (1) US7888953B2 (enExample)
JP (1) JP5276895B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160111791A (ko) * 2015-03-17 2016-09-27 (주)엠투엔 플레이트부의 제조 방법 및 프로브 카드

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7987591B2 (en) * 2009-08-13 2011-08-02 International Business Machines Corporation Method of forming silicon chicklet pedestal
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
TWI408386B (zh) * 2011-01-28 2013-09-11 Chroma Ate Inc A carrier plate having an airtight via hole for a semiconductor test apparatus, and a method of manufacturing the same
CN103869109B (zh) * 2012-12-12 2017-10-10 华邦电子股份有限公司 探针卡及其焊接方法
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
JP6341634B2 (ja) 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
KR102751716B1 (ko) * 2022-02-11 2025-01-09 (주)티에스이 프리로드형 프로브 헤드

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0150334B1 (ko) * 1995-08-17 1998-12-01 남재우 수직형니들을 가지는 프로브카드 및 그 제조방법
JPH11142438A (ja) * 1997-11-10 1999-05-28 Japan Electronic Materials Corp プローブ及びこのプローブを用いたプローブカード
JP2001091544A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置の製造方法
US7143500B2 (en) * 2001-06-25 2006-12-05 Micron Technology, Inc. Method to prevent damage to probe card
JP4249524B2 (ja) * 2003-03-28 2009-04-02 富士通株式会社 プローブカード
US7053496B2 (en) * 2003-06-27 2006-05-30 Intel Corporation Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
WO2006017078A2 (en) * 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
JP2005156365A (ja) * 2003-11-26 2005-06-16 Shinko Electric Ind Co Ltd 電気特性測定用プローブ及びその製造方法
US20050253602A1 (en) * 2004-04-28 2005-11-17 Cram Daniel P Resilient contact probe apparatus, methods of using and making, and resilient contact probes
JP2006049498A (ja) 2004-08-03 2006-02-16 Shinko Electric Ind Co Ltd 接続端子の製造方法
JP4613713B2 (ja) * 2005-06-27 2011-01-19 パナソニック電工株式会社 接続装置
US7432728B2 (en) * 2006-02-27 2008-10-07 Sv Probe Pte Ltd. Blade probe and blade probe card
JP4703456B2 (ja) * 2006-03-28 2011-06-15 大日本印刷株式会社 電気信号測定用治具
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
US7750651B2 (en) * 2008-03-07 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer level test probe card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160111791A (ko) * 2015-03-17 2016-09-27 (주)엠투엔 플레이트부의 제조 방법 및 프로브 카드
KR101724636B1 (ko) * 2015-03-17 2017-04-10 (주)엠투엔 플레이트부의 제조 방법 및 프로브 카드

Also Published As

Publication number Publication date
US7888953B2 (en) 2011-02-15
US20090284276A1 (en) 2009-11-19
JP2009276316A (ja) 2009-11-26

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