JP2011199312A - 電気モジュール - Google Patents
電気モジュール Download PDFInfo
- Publication number
- JP2011199312A JP2011199312A JP2011130193A JP2011130193A JP2011199312A JP 2011199312 A JP2011199312 A JP 2011199312A JP 2011130193 A JP2011130193 A JP 2011130193A JP 2011130193 A JP2011130193 A JP 2011130193A JP 2011199312 A JP2011199312 A JP 2011199312A
- Authority
- JP
- Japan
- Prior art keywords
- module according
- composite material
- electrical module
- material layer
- functional layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/486—Fine ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/046—Iron oxides or ferrites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
- C04B2235/3463—Alumino-silicates other than clay, e.g. mullite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
- C04B2235/365—Borosilicate glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6565—Cooling rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/06—Oxidic interlayers
- C04B2237/068—Oxidic interlayers based on refractory oxides, e.g. zirconia
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/10—Glass interlayers, e.g. frit or flux
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/341—Silica or silicates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
Abstract
【解決手段】セラミックベースボディ(1)は複数のセラミック層(1a,1b)を有しており、ここで、機能層(1a)は複合材料層(1b)に接しており、該複合材料層はジルコニウム酸化物とガラス充填物質との混合物を含む。
【選択図】図2
Description
(a)焼結過程での高温によって液化したガラスが種々の材料のあいだの空隙を充填する。これにより複合材料層と機能層とのあいだにガラス中間層が形成される。こうして中空室の形成は抑圧ないし阻止され、ベースボディの電気特性が損なわれることがなくなる。ガラスは高温のもとでは可塑性を有するので、成形により各層のあいだの応力を低下させることもできる。
(b)中程度の温度であっても、種々の層のあいだに平滑面を形成するガラスの可塑性は充分に得られる。これにより、焼結過程において各層のあいだの応力を低下させるための機械的手段が形成される。
(c)焼結過程後のベースボディの冷却過程における低温のもとでは、ガラスは安定であり、複合材料層に亀裂は生じない。
Claims (32)
- セラミックベースボディ(1)を備えた電気モジュールにおいて、
電気モジュールは複数のセラミック層(1a,1b)を有しており、ここで、機能層(1a)は複合材料層(1b)に接しており、該複合材料層はジルコニウム酸化物とガラス充填物質との混合物を含む
ことを特徴とする電気モジュール。 - 前記複合材料層(1b)の誘電定数は前記機能層(1a)の誘電定数より小さい、請求項1記載の電気モジュール。
- 前記複合材料層(1b)はパシベーション機能または電気的分離機能を有する、請求項1または2記載の電気モジュール。
- 前記複合材料層(1b)のガラス充填物質はホウケイ酸亜鉛またはケイ酸アルミニウムを含む、請求項1から3までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)のガラス充填物質の分量は5重量%〜70重量%である、請求項1から4までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)および前記複合材料層(1b)は上下方向に交互に積層されている、請求項1から5までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)は複数の内部電極(2)を有しており、該内部電極はそれぞれ電気モジュールの表面に配置された少なくとも1つの外部コンタクト(4)に接続されている、請求項1から6までのいずれか1項記載の電気モジュール。
- 異なる電位の2つの内部電極(2)のあいだに所定の容量が形成されている、請求項7記載の電気モジュール。
- 前記内部電極(2)はそれぞれ信号線路の機能を有する、請求項7または8記載の電気モジュール。
- 少なくとも1つの内部電極(2)はアース電極である、請求項7から9までのいずれか1項記載の電気モジュール。
- 前記アース電極(2)は前記機能層(1a)の別の内部電極(2)に容量結合されている、請求項10記載の電気モジュール。
- 前記機能層(1a)の前記別の内部電極(2)は隣接する内部電極へ向かう脚部を有し、これにより所定の領域における2つの内部電極間の距離ひいては内部電極間の容量は最小化される、請求項7から11までのいずれか1項記載の電気モジュール。
- 任意の内部電極が電気モジュールの表面に配置された同じ電位の外部コンタクト(4)に接続されている、請求項7から12までのいずれか1項記載の電気モジュール。
- 前記機能層の内部電極(2)は部分的に電気モジュールの内部へ延在しており、その端部のみが外部コンタクト(4)に接続されている、請求項7から13までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)は少なくとも1つの内部電極(2)を有する、請求項1から14までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)の内部電極により形成される散乱容量は低減される、請求項15記載の電気モジュール。
- 前記複合材料層(1b)の少なくとも1つの内部電極(2)は信号線路の機能を有する、請求項15または16記載の電気モジュール。
- 前記複合材料層(1b)の少なくとも1つの内部電極(2)はアース電極である、請求項15から17までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)の少なくとも1つの内部電極(2)は前記機能層の2つの内部電極のあいだの結合容量を低減する、請求項15から18までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)の少なくとも1つの内部電極(2)は前記アース電極と前記機能層の前記別の内部電極とのあいだの結合容量を低減する、請求項19記載の電気モジュール。
- 前記複合材料層(1b)の内部電極(2)は前記複合材料層を完全に横断しており、各端部で前記外部コンタクト(4)に接続されている、請求項15から20までのいずれか1項記載の電気モジュール。
- 少なくとも1つの内部電極は、正方形、長方形、T字形、L字形、湾曲形、メアンダ形のいずれかの形状を有する、請求項7から21までのいずれか1項記載の電気モジュール。
- 複数の内部電極(2)は等しく成形されており、1つの平面において対称軸線に対して鏡面対称に配置されている、請求項7から22までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)はドープされている、請求項1から23までのいずれか1項記載の電気モジュール。
- 前記複合材料層(1b)はドープされている、請求項1から24までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)はバリスタセラミックを含む、請求項1から25までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)はバリスタを含む、請求項26記載の電気モジュール。
- 前記機能層(1a)はコンデンサセラミックを含む、請求項1から25までのいずれか1項記載の電気モジュール。
- 前記機能層(1a)はセラミックの多層コンデンサを含む、請求項28記載の電気モジュール。
- 少なくとも1つの内部電極(2)は前記機能層(1a)に接続されており、コンタクト手段(3)により電気モジュール(1)の表面の外部コンタクト(4)に接続されている、請求項1から29までのいずれか1項記載の電気モジュール。
- 前記コンタクト手段(3)は金属を含む材料によって充填されるスルーコンタクトである、請求項30記載の電気モジュール。
- 複数の内部電極(2)は上下方向に配置されており、前記コンタクト手段(3)により相互にコンタクトされている、請求項30または31記載の電気モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005050638.0A DE102005050638B4 (de) | 2005-10-20 | 2005-10-20 | Elektrisches Bauelement |
DE102005050638.0 | 2005-10-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008535977A Division JP5119156B2 (ja) | 2005-10-20 | 2006-10-20 | 電気モジュール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011199312A true JP2011199312A (ja) | 2011-10-06 |
JP2011199312A5 JP2011199312A5 (ja) | 2012-08-02 |
JP5254403B2 JP5254403B2 (ja) | 2013-08-07 |
Family
ID=37607431
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008535977A Active JP5119156B2 (ja) | 2005-10-20 | 2006-10-20 | 電気モジュール |
JP2011130193A Active JP5254403B2 (ja) | 2005-10-20 | 2011-06-10 | 電気モジュール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008535977A Active JP5119156B2 (ja) | 2005-10-20 | 2006-10-20 | 電気モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US8730648B2 (ja) |
EP (3) | EP2107574B1 (ja) |
JP (2) | JP5119156B2 (ja) |
DE (2) | DE102005050638B4 (ja) |
WO (1) | WO2007045497A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004058410B4 (de) * | 2004-12-03 | 2021-02-18 | Tdk Electronics Ag | Vielschichtbauelement mit ESD-Schutzelementen |
DE102007020783A1 (de) | 2007-05-03 | 2008-11-06 | Epcos Ag | Elektrisches Vielschichtbauelement |
DE102007031510A1 (de) | 2007-07-06 | 2009-01-08 | Epcos Ag | Elektrisches Vielschichtbauelement |
DE102009007316A1 (de) * | 2009-02-03 | 2010-08-05 | Epcos Ag | Elektrisches Vielschichtbauelement |
DE102010036270B4 (de) * | 2010-09-03 | 2018-10-11 | Epcos Ag | Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements |
CN103180915A (zh) * | 2010-11-03 | 2013-06-26 | 埃普科斯股份有限公司 | 多层陶瓷元件及用于制造多层陶瓷元件的方法 |
JPWO2012147299A1 (ja) * | 2011-04-26 | 2014-07-28 | パナソニック株式会社 | 静電気対策部品およびその製造方法 |
US9165716B2 (en) | 2011-06-24 | 2015-10-20 | Knowles Capital Formation, Inc. | High capacitance single layer capacitor |
US9324499B2 (en) | 2011-06-24 | 2016-04-26 | Knowles Capital Formation, Inc. | High capacitance single layer capacitor |
JP5696623B2 (ja) * | 2011-08-29 | 2015-04-08 | Tdk株式会社 | チップバリスタ |
CN105493211B (zh) * | 2013-09-02 | 2019-01-18 | 株式会社村田制作所 | 可变电容元件及其制造方法 |
WO2015060045A1 (ja) * | 2013-10-24 | 2015-04-30 | 株式会社村田製作所 | 配線基板およびその製造方法 |
WO2016136771A1 (ja) * | 2015-02-27 | 2016-09-01 | 株式会社村田製作所 | 可変容量素子 |
WO2016136772A1 (ja) * | 2015-02-27 | 2016-09-01 | 株式会社村田製作所 | 可変容量素子 |
DE102017200503B4 (de) | 2017-01-13 | 2023-02-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines dielektrischen Elements |
SG11202007528VA (en) | 2018-03-05 | 2020-09-29 | Avx Corp | Cascade varistor having improved energy handling capabilities |
US11031183B2 (en) | 2018-03-06 | 2021-06-08 | Avx Corporation | Multilayer ceramic capacitor having ultra-broadband performance |
WO2020018651A1 (en) | 2018-07-18 | 2020-01-23 | Avx Corporation | Varistor passivation layer and method of making the same |
DE102019100316A1 (de) | 2019-01-08 | 2020-07-09 | Tdk Electronics Ag | Thermistor und Verfahren zur Herstellung des Thermistors |
KR20230089157A (ko) * | 2021-12-13 | 2023-06-20 | 삼성전기주식회사 | 적층형 커패시터 |
DE102022114552A1 (de) | 2022-06-09 | 2023-12-14 | Tdk Electronics Ag | Verfahren zur Herstellung eines Vielschicht-Varistors |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172137U (ja) * | 1986-04-21 | 1987-10-31 | ||
JPH10335115A (ja) * | 1997-05-30 | 1998-12-18 | Tdk Corp | セラミックス複合積層部品 |
JPH11265807A (ja) * | 1998-03-16 | 1999-09-28 | Tdk Corp | セラミックス複合積層部品 |
JP2000082605A (ja) * | 1998-09-04 | 2000-03-21 | Mitsubishi Materials Corp | 温度補償回路 |
JP2001351827A (ja) * | 2000-06-08 | 2001-12-21 | Murata Mfg Co Ltd | 複合積層電子部品 |
JP2003124006A (ja) * | 2002-08-23 | 2003-04-25 | Mitsubishi Materials Corp | サーミスタ |
JP2004253757A (ja) * | 2002-12-24 | 2004-09-09 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2005252039A (ja) * | 2004-03-04 | 2005-09-15 | Tdk Corp | 積層電子部品製造装置、及び、積層電子部品の製造方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059647B2 (ja) | 1977-08-01 | 1985-12-26 | クラリオン株式会社 | 磁気テ−プ装置 |
US4209764A (en) | 1978-11-20 | 1980-06-24 | Trw, Inc. | Resistor material, resistor made therefrom and method of making the same |
US4354925A (en) | 1981-07-30 | 1982-10-19 | Exxon Research And Engineering Co. | Catalytic reforming process |
DE3134584A1 (de) * | 1981-09-01 | 1983-03-10 | TRW Inc., Los Angeles, Calif. | Widerstandsmaterial, elektrischer widerstand und verfahren zu dessen herstellung |
JPS62172137A (ja) | 1986-01-27 | 1987-07-29 | Natl House Ind Co Ltd | 防火ダンパ−付天井換気口 |
US4778332A (en) * | 1987-02-09 | 1988-10-18 | The Perkin-Elmer Corporation | Wafer flip apparatus |
JPH0648666B2 (ja) | 1987-09-29 | 1994-06-22 | 三菱マテリアル株式会社 | 積層セラミックコンデンサ及びその製法 |
JPH01179741A (ja) * | 1988-01-12 | 1989-07-17 | Asahi Glass Co Ltd | ガラスセラミックス組成物 |
DE4005011C1 (ja) | 1990-02-19 | 1991-04-25 | Schott Glaswerke, 6500 Mainz, De | |
DE4410753C2 (de) | 1993-03-29 | 2003-02-20 | Murata Manufacturing Co | Kondensator-Array |
US5583738A (en) * | 1993-03-29 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Capacitor array |
JP2603533Y2 (ja) * | 1993-05-11 | 2000-03-15 | 株式会社村田製作所 | Lc複合部品 |
JPH0935909A (ja) | 1995-07-24 | 1997-02-07 | Toshiba Corp | 非直線抵抗体の製造方法 |
JPH10289822A (ja) | 1997-04-16 | 1998-10-27 | Tdk Corp | 電子部品及びウエハ |
US6329715B1 (en) | 1996-09-20 | 2001-12-11 | Tdk Corporation | Passive electronic parts, IC parts, and wafer |
JP2000082603A (ja) * | 1998-07-08 | 2000-03-21 | Murata Mfg Co Ltd | チップ型サ―ミスタおよびその製造方法 |
DE19855603C1 (de) | 1998-12-02 | 2000-10-26 | Siemens Ag | Kapazitiver Oberflächensensor und Verfahren zu dessen Herstellung |
JP3642462B2 (ja) * | 1999-03-03 | 2005-04-27 | Tdk株式会社 | 積層部品の製造方法 |
JP2000323346A (ja) | 1999-05-12 | 2000-11-24 | Tdk Corp | 高周波電子部品の製造方法 |
JP4001438B2 (ja) * | 1999-05-31 | 2007-10-31 | 三井金属鉱業株式会社 | 複合銅微粉末の製造方法 |
DE19931056B4 (de) | 1999-07-06 | 2005-05-19 | Epcos Ag | Vielschichtvaristor niedriger Kapazität |
JP2001167974A (ja) | 1999-12-07 | 2001-06-22 | Murata Mfg Co Ltd | 回路基板およびそれを用いた回路モジュールおよびそれを用いた電子装置 |
DE10130893A1 (de) | 2001-06-27 | 2003-01-16 | Siemens Ag | Glaskeramik, keramischer Grünkörper und monolithischer keramischer Mehrschichtkörper mit der Glaskeramik |
JP3812377B2 (ja) * | 2001-07-10 | 2006-08-23 | 株式会社村田製作所 | 貫通型三端子電子部品 |
JP2003045201A (ja) | 2001-07-26 | 2003-02-14 | Tokyo Compass Mfg Co Ltd | 照明ライト付き歩数計 |
DE10136545B4 (de) | 2001-07-26 | 2005-03-03 | Epcos Ag | Elektrokeramisches Bauelement, Vielschichtkondensator und Verfahren zur Herstellung des Vielschichtkondensators |
KR100506731B1 (ko) | 2002-12-24 | 2005-08-08 | 삼성전기주식회사 | 저온 소성 유전체 조성물, 적층 세라믹 커패시터 및세라믹 전자부품 |
DE10313891A1 (de) * | 2003-03-27 | 2004-10-14 | Epcos Ag | Elektrisches Vielschichtbauelement |
JP2004356293A (ja) * | 2003-05-28 | 2004-12-16 | Murata Mfg Co Ltd | 積層セラミック電子部品及びその製造方法 |
JP2005050973A (ja) | 2003-07-31 | 2005-02-24 | Mitsubishi Materials Corp | Lc複合部品 |
DE102004005664B4 (de) * | 2004-02-05 | 2018-12-06 | Epcos Ag | Elektrisches Bauelement und Verfahren zu dessen Herstellung |
-
2005
- 2005-10-20 DE DE102005050638.0A patent/DE102005050638B4/de active Active
-
2006
- 2006-10-20 EP EP09163271A patent/EP2107574B1/de active Active
- 2006-10-20 JP JP2008535977A patent/JP5119156B2/ja active Active
- 2006-10-20 EP EP06792440A patent/EP1938344B1/de active Active
- 2006-10-20 DE DE502006004466T patent/DE502006004466D1/de active Active
- 2006-10-20 WO PCT/EP2006/010148 patent/WO2007045497A1/de active Application Filing
- 2006-10-20 EP EP10183932.2A patent/EP2306470B1/de active Active
- 2006-10-20 US US12/090,335 patent/US8730648B2/en active Active
-
2011
- 2011-06-10 JP JP2011130193A patent/JP5254403B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172137U (ja) * | 1986-04-21 | 1987-10-31 | ||
JPH10335115A (ja) * | 1997-05-30 | 1998-12-18 | Tdk Corp | セラミックス複合積層部品 |
JPH11265807A (ja) * | 1998-03-16 | 1999-09-28 | Tdk Corp | セラミックス複合積層部品 |
JP2000082605A (ja) * | 1998-09-04 | 2000-03-21 | Mitsubishi Materials Corp | 温度補償回路 |
JP2001351827A (ja) * | 2000-06-08 | 2001-12-21 | Murata Mfg Co Ltd | 複合積層電子部品 |
JP2003124006A (ja) * | 2002-08-23 | 2003-04-25 | Mitsubishi Materials Corp | サーミスタ |
JP2004253757A (ja) * | 2002-12-24 | 2004-09-09 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2005252039A (ja) * | 2004-03-04 | 2005-09-15 | Tdk Corp | 積層電子部品製造装置、及び、積層電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2306470A2 (de) | 2011-04-06 |
DE102005050638B4 (de) | 2020-07-16 |
EP1938344A1 (de) | 2008-07-02 |
DE102005050638A1 (de) | 2007-06-06 |
JP5119156B2 (ja) | 2013-01-16 |
JP2009513006A (ja) | 2009-03-26 |
EP2107574A3 (de) | 2009-12-23 |
EP2306470B1 (de) | 2013-08-21 |
DE502006004466D1 (de) | 2009-09-17 |
EP2107574B1 (de) | 2012-12-12 |
EP2107574A2 (de) | 2009-10-07 |
JP5254403B2 (ja) | 2013-08-07 |
WO2007045497A1 (de) | 2007-04-26 |
US20100014213A1 (en) | 2010-01-21 |
EP1938344B1 (de) | 2009-08-05 |
EP2306470A3 (de) | 2012-08-01 |
US8730648B2 (en) | 2014-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5254403B2 (ja) | 電気モジュール | |
JP5455841B2 (ja) | 負の温度係数を有する電気デバイス | |
US7710233B2 (en) | Electric multilayer component | |
JP6751131B2 (ja) | 多層デバイスおよび多層デバイスを製造するための方法 | |
KR20100076972A (ko) | 전기 다층 구성요소 | |
KR102552423B1 (ko) | 유전체 파우더 및 이를 이용한 적층형 세라믹 전자부품 | |
JP5167124B2 (ja) | 低減された寄生容量を備えた電気的多層構成素子 | |
US5324986A (en) | Chip type varistor | |
TWI450642B (zh) | 電路保護裝置 | |
SE432097B (sv) | Sintrad kropp av halvledande keramikmaterial, forfarande for tillverkning av kroppen samt en anvendning av kroppen | |
CN109416963A (zh) | 多层式器件和用于制造多层式器件的方法 | |
US6328176B1 (en) | Multifunctional protective component | |
JPH056806A (ja) | チツプバリスタ | |
JPH11265808A (ja) | サージ吸収素子及びその製造方法 | |
KR20190037997A (ko) | 적층형 소자 및 이를 구비하는 전자기기 | |
Cho et al. | Dielectric ceramics | |
CN220984353U (zh) | 一种电容器、电容装置和车辆 | |
Amin et al. | Thermistors | |
KR20100096633A (ko) | 적층형 칩 소자 | |
JP2897651B2 (ja) | チップ型バリスタとその製造方法 | |
JP2005183593A (ja) | 接合型電圧依存性抵抗器およびその製造方法 | |
US20200105444A1 (en) | Varistor | |
KR100822932B1 (ko) | 저정전용량 칩 소자 및 이의 제조방법 | |
CN114521274A (zh) | 多层压敏电阻和用于制造多层压敏电阻的方法 | |
JP2000353583A (ja) | サージ吸収素子及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120608 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121019 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130319 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130417 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5254403 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160426 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |