JP2008529274A5 - - Google Patents

Download PDF

Info

Publication number
JP2008529274A5
JP2008529274A5 JP2007552131A JP2007552131A JP2008529274A5 JP 2008529274 A5 JP2008529274 A5 JP 2008529274A5 JP 2007552131 A JP2007552131 A JP 2007552131A JP 2007552131 A JP2007552131 A JP 2007552131A JP 2008529274 A5 JP2008529274 A5 JP 2008529274A5
Authority
JP
Japan
Prior art keywords
forming
region
barrier layer
metal oxide
resistant barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007552131A
Other languages
English (en)
Japanese (ja)
Other versions
JP4685882B2 (ja
JP2008529274A (ja
Filing date
Publication date
Priority claimed from US11/043,337 external-priority patent/US7109079B2/en
Application filed filed Critical
Publication of JP2008529274A publication Critical patent/JP2008529274A/ja
Publication of JP2008529274A5 publication Critical patent/JP2008529274A5/ja
Application granted granted Critical
Publication of JP4685882B2 publication Critical patent/JP4685882B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007552131A 2005-01-26 2005-12-16 半導体装置及びその製造方法 Expired - Fee Related JP4685882B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/043,337 US7109079B2 (en) 2005-01-26 2005-01-26 Metal gate transistor CMOS process and method for making
PCT/US2005/045727 WO2006081003A2 (en) 2005-01-26 2005-12-16 Metal gate transistor for cmos process and method for making

Publications (3)

Publication Number Publication Date
JP2008529274A JP2008529274A (ja) 2008-07-31
JP2008529274A5 true JP2008529274A5 (enExample) 2009-01-15
JP4685882B2 JP4685882B2 (ja) 2011-05-18

Family

ID=36697371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007552131A Expired - Fee Related JP4685882B2 (ja) 2005-01-26 2005-12-16 半導体装置及びその製造方法

Country Status (6)

Country Link
US (1) US7109079B2 (enExample)
JP (1) JP4685882B2 (enExample)
KR (1) KR101185685B1 (enExample)
CN (1) CN100483687C (enExample)
TW (1) TWI385733B (enExample)
WO (1) WO2006081003A2 (enExample)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4429036B2 (ja) * 2004-02-27 2010-03-10 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
US7588988B2 (en) 2004-08-31 2009-09-15 Micron Technology, Inc. Method of forming apparatus having oxide films formed using atomic layer deposition
US20060172480A1 (en) * 2005-02-03 2006-08-03 Taiwan Semiconductor Manufacturing Company, Ltd. Single metal gate CMOS device design
US7687409B2 (en) 2005-03-29 2010-03-30 Micron Technology, Inc. Atomic layer deposited titanium silicon oxide films
US7572695B2 (en) * 2005-05-27 2009-08-11 Micron Technology, Inc. Hafnium titanium oxide films
JP2007019396A (ja) * 2005-07-11 2007-01-25 Renesas Technology Corp Mos構造を有する半導体装置およびその製造方法
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
US7972974B2 (en) 2006-01-10 2011-07-05 Micron Technology, Inc. Gallium lanthanide oxide films
US7579282B2 (en) * 2006-01-13 2009-08-25 Freescale Semiconductor, Inc. Method for removing metal foot during high-k dielectric/metal gate etching
US7510956B2 (en) * 2006-01-30 2009-03-31 Fressscale Semiconductor, Inc. MOS device with multi-layer gate stack
US20070228480A1 (en) * 2006-04-03 2007-10-04 Taiwan Semiconductor Manufacturing Co., Ltd. CMOS device having PMOS and NMOS transistors with different gate structures
KR100729366B1 (ko) * 2006-05-19 2007-06-15 삼성전자주식회사 반도체 장치 및 그 형성 방법
US7655550B2 (en) * 2006-06-30 2010-02-02 Freescale Semiconductor, Inc. Method of making metal gate transistors
JP2008016538A (ja) * 2006-07-04 2008-01-24 Renesas Technology Corp Mos構造を有する半導体装置及びその製造方法
US9070759B2 (en) * 2006-09-25 2015-06-30 Infineon Technologies Ag Semiconductor device and method of making same
US7378713B2 (en) * 2006-10-25 2008-05-27 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor devices with dual-metal gate structures and fabrication methods thereof
US7812414B2 (en) * 2007-01-23 2010-10-12 Taiwan Semiconductor Manufacturing Company, Ltd. Hybrid process for forming metal gates
JP2008210874A (ja) * 2007-02-23 2008-09-11 Toshiba Corp 半導体装置の製造方法
JP2008288364A (ja) * 2007-05-17 2008-11-27 Sony Corp 半導体装置および半導体装置の製造方法
US8173532B2 (en) 2007-07-30 2012-05-08 International Business Machines Corporation Semiconductor transistors having reduced distances between gate electrode regions
US20090045458A1 (en) * 2007-08-15 2009-02-19 Advanced Micro Devices, Inc. Mos transistors for thin soi integration and methods for fabricating the same
US8030709B2 (en) * 2007-12-12 2011-10-04 International Business Machines Corporation Metal gate stack and semiconductor gate stack for CMOS devices
US20090206416A1 (en) * 2008-02-19 2009-08-20 International Business Machines Corporation Dual metal gate structures and methods
US8536660B2 (en) * 2008-03-12 2013-09-17 Taiwan Semiconductor Manufacturing Company, Ltd. Hybrid process for forming metal gates of MOS devices
US7955926B2 (en) * 2008-03-26 2011-06-07 International Business Machines Corporation Structure and method to control oxidation in high-k gate structures
US7994036B2 (en) * 2008-07-01 2011-08-09 Panasonic Corporation Semiconductor device and fabrication method for the same
US20100038715A1 (en) * 2008-08-18 2010-02-18 International Business Machines Corporation Thin body silicon-on-insulator transistor with borderless self-aligned contacts
US20100044804A1 (en) * 2008-08-25 2010-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Novel high-k metal gate structure and method of making
US7947588B2 (en) * 2008-08-26 2011-05-24 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for a CMOS device with doped conducting metal oxide as the gate electrode
US7816243B2 (en) * 2009-02-18 2010-10-19 United Microelectronics Corp. Semiconductor device and method of fabricating the same
US8026539B2 (en) * 2009-02-18 2011-09-27 Globalfoundries Inc. Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same
US8350586B2 (en) 2009-07-02 2013-01-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus of deembedding
US8232154B2 (en) * 2009-09-21 2012-07-31 United Microelectronics Corp. Method for fabricating semiconductor device
US8617946B2 (en) * 2009-11-11 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuits including metal gates and fabrication methods thereof
DE102009055395B4 (de) * 2009-12-30 2011-12-29 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Vordotiertes Halbleitermaterial für eine Metallgateelektrodenstruktur mit großem ε von p-und n-Kanaltransistoren
US8088685B2 (en) * 2010-02-09 2012-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Integration of bottom-up metal film deposition
US8436422B2 (en) * 2010-03-08 2013-05-07 Sematech, Inc. Tunneling field-effect transistor with direct tunneling for enhanced tunneling current
CN102237269B (zh) * 2010-04-21 2013-08-28 中国科学院微电子研究所 以氮化铝为势垒层的Mo基金属栅叠层结构的刻蚀方法
US8163620B2 (en) 2010-04-21 2012-04-24 Institute of Microelectronics, Chinese Academy of Sciences Method for etching Mo-based metal gate stack with aluminium nitride barrier
KR101675319B1 (ko) 2010-10-04 2016-11-14 삼성전자주식회사 반도체 소자의 제조 방법
DE102010063907B4 (de) * 2010-12-22 2018-03-29 Globalfoundries Dresden Module One Llc & Co. Kg Verfahren mit Deckschichtentfernung von Gateelektrodenstrukturen nach selektivem Bilden eines verformungsinduzierenden Halbleitermaterials
US9166020B2 (en) 2011-03-01 2015-10-20 United Microelectronics Corp. Metal gate structure and manufacturing method thereof
US8519487B2 (en) 2011-03-21 2013-08-27 United Microelectronics Corp. Semiconductor device
KR20120107762A (ko) * 2011-03-22 2012-10-04 삼성전자주식회사 반도체 소자의 제조 방법
US9384962B2 (en) 2011-04-07 2016-07-05 United Microelectronics Corp. Oxygen treatment of replacement work-function metals in CMOS transistor gates
US8530980B2 (en) 2011-04-27 2013-09-10 United Microelectronics Corp. Gate stack structure with etch stop layer and manufacturing process thereof
US9269634B2 (en) 2011-05-16 2016-02-23 Globalfoundries Inc. Self-aligned metal gate CMOS with metal base layer and dummy gate structure
US8841733B2 (en) 2011-05-17 2014-09-23 United Microelectronics Corp. Semiconductor device and method of fabricating the same
CN102420187B (zh) * 2011-06-07 2014-02-05 上海华力微电子有限公司 一种改善先栅极工艺中高k栅电介质pmos负偏置温度不稳定性效应的方法
US8673758B2 (en) 2011-06-16 2014-03-18 United Microelectronics Corp. Structure of metal gate and fabrication method thereof
US9490342B2 (en) 2011-06-16 2016-11-08 United Microelectronics Corp. Method for fabricating semiconductor device
TWI509667B (zh) * 2011-06-20 2015-11-21 United Microelectronics Corp 金屬閘極之結構及其製作方法
US8536038B2 (en) 2011-06-21 2013-09-17 United Microelectronics Corp. Manufacturing method for metal gate using ion implantation
US9269580B2 (en) 2011-06-27 2016-02-23 Cree, Inc. Semiconductor device with increased channel mobility and dry chemistry processes for fabrication thereof
US8486790B2 (en) 2011-07-18 2013-07-16 United Microelectronics Corp. Manufacturing method for metal gate
US8551876B2 (en) 2011-08-18 2013-10-08 United Microelectronics Corp. Manufacturing method for semiconductor device having metal gate
US8872286B2 (en) 2011-08-22 2014-10-28 United Microelectronics Corp. Metal gate structure and fabrication method thereof
US8691681B2 (en) 2012-01-04 2014-04-08 United Microelectronics Corp. Semiconductor device having a metal gate and fabricating method thereof
US8860181B2 (en) 2012-03-07 2014-10-14 United Microelectronics Corp. Thin film resistor structure
US9093559B2 (en) * 2012-03-09 2015-07-28 Taiwan Semiconductor Manufacturing Company, Ltd. Method of hybrid high-k/metal-gate stack fabrication
US9105623B2 (en) 2012-05-25 2015-08-11 United Microelectronics Corp. Semiconductor device having metal gate and manufacturing method thereof
US8883583B2 (en) * 2012-06-26 2014-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices, transistors, and methods of manufacture thereof
US8975666B2 (en) 2012-08-22 2015-03-10 United Microelectronics Corp. MOS transistor and process thereof
US9054172B2 (en) 2012-12-05 2015-06-09 United Microelectrnics Corp. Semiconductor structure having contact plug and method of making the same
US8735269B1 (en) 2013-01-15 2014-05-27 United Microelectronics Corp. Method for forming semiconductor structure having TiN layer
US9653300B2 (en) 2013-04-16 2017-05-16 United Microelectronics Corp. Structure of metal gate structure and manufacturing method of the same
US9159798B2 (en) 2013-05-03 2015-10-13 United Microelectronics Corp. Replacement gate process and device manufactured using the same
US9196542B2 (en) 2013-05-22 2015-11-24 United Microelectronics Corp. Method for manufacturing semiconductor devices
US8921947B1 (en) 2013-06-10 2014-12-30 United Microelectronics Corp. Multi-metal gate semiconductor device having triple diameter metal opening
US20150069534A1 (en) 2013-09-11 2015-03-12 United Microelectronics Corp. Semiconductor device and method for fabricating the same
US9105720B2 (en) 2013-09-11 2015-08-11 United Microelectronics Corp. Semiconductor device having metal gate and manufacturing method thereof
US9196546B2 (en) 2013-09-13 2015-11-24 United Microelectronics Corp. Metal gate transistor
US9231071B2 (en) 2014-02-24 2016-01-05 United Microelectronics Corp. Semiconductor structure and manufacturing method of the same
US10050147B2 (en) * 2015-07-24 2018-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
CN106601605B (zh) 2015-10-19 2020-02-28 中芯国际集成电路制造(北京)有限公司 栅极堆叠结构、nmos器件、半导体装置及其制造方法
US10096596B2 (en) * 2015-12-15 2018-10-09 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure having a plurality of gate structures
US11855005B2 (en) * 2021-06-21 2023-12-26 Globalfoundries U.S. Inc. Crackstop with embedded passive radio frequency noise suppressor and method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3804972B2 (ja) * 1994-10-04 2006-08-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体デバイス及びその製造方法
JPH10173169A (ja) * 1996-12-16 1998-06-26 Toshiba Corp 半導体装置及びその製造方法
JPH11214533A (ja) * 1998-01-29 1999-08-06 Nec Corp 半導体装置の製造方法
US6160282A (en) * 1998-04-21 2000-12-12 Foveon, Inc. CMOS image sensor employing silicide exclusion mask to reduce leakage and improve performance
EP1020922A3 (en) * 1998-12-28 2001-08-08 Infineon Technologies North America Corp. Insulated gate field effect transistor and method of manufacture thereof
JP2000208720A (ja) * 1999-01-13 2000-07-28 Lucent Technol Inc 電子デバイス、momキャパシタ、mosトランジスタ、拡散バリア層
US6255698B1 (en) * 1999-04-28 2001-07-03 Advanced Micro Devices, Inc. Separately optimized gate structures for n-channel and p-channel transistors in an integrated circuit
JP2001044428A (ja) * 1999-08-03 2001-02-16 New Japan Radio Co Ltd 半導体装置及びその製造方法
JP4074734B2 (ja) * 1999-10-29 2008-04-09 株式会社東芝 強誘電体キャパシタ及びその製造方法並びに強誘電体メモリ
US6444512B1 (en) 2000-06-12 2002-09-03 Motorola, Inc. Dual metal gate transistors for CMOS process
US6423632B1 (en) 2000-07-21 2002-07-23 Motorola, Inc. Semiconductor device and a process for forming the same
US6429061B1 (en) * 2000-07-26 2002-08-06 International Business Machines Corporation Method to fabricate a strained Si CMOS structure using selective epitaxial deposition of Si after device isolation formation
KR20020056260A (ko) * 2000-12-29 2002-07-10 박종섭 반도체 소자의 금속 게이트 형성방법
JP3771801B2 (ja) * 2001-01-16 2006-04-26 株式会社ルネサステクノロジ 半導体装置
TW587302B (en) * 2001-03-07 2004-05-11 United Microelectronics Corp Manufacturing method for MOS capacitor
JP3779556B2 (ja) * 2001-03-27 2006-05-31 株式会社東芝 電界効果トランジスタ
US6518106B2 (en) 2001-05-26 2003-02-11 Motorola, Inc. Semiconductor device and a method therefor
US6894353B2 (en) 2002-07-31 2005-05-17 Freescale Semiconductor, Inc. Capped dual metal gate transistors for CMOS process and method for making the same
US6806126B1 (en) * 2002-09-06 2004-10-19 Advanced Micro Devices, Inc. Method of manufacturing a semiconductor component
US6790719B1 (en) * 2003-04-09 2004-09-14 Freescale Semiconductor, Inc. Process for forming dual metal gate structures
US6933227B2 (en) * 2003-10-23 2005-08-23 Freescale Semiconductor, Inc. Semiconductor device and method of forming the same
KR20070045268A (ko) * 2004-08-24 2007-05-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 반도체 디바이스 및 그 제조 방법

Similar Documents

Publication Publication Date Title
JP2008529274A5 (enExample)
TWI694499B (zh) 負電容結構的製造方法、負電容場效電晶體及其製造方法
CN109427589B (zh) 半导体结构及其形成方法
KR102043360B1 (ko) 반도체 디바이스 및 그 제조 방법
US7029966B2 (en) Process options of forming silicided metal gates for advanced CMOS devices
TWI686351B (zh) 奈米線電晶體及其製作方法
US10062782B2 (en) Method of manufacturing a semiconductor device with multilayered channel structure
JP4144884B2 (ja) Cmosトランジスタの製造方法
US11145554B2 (en) Method for source/drain contact formation in semiconductor devices
TWI482265B (zh) 包括雙閘極結構之半導體裝置及形成此等半導體裝置之方法
CN101661957A (zh) 具有掺杂导电金属氧化物作为栅电极的cmos器件结构和方法
JP2008522444A5 (enExample)
TW202133244A (zh) 半導體裝置及其製造方法
CN109326562A (zh) 金属栅极结构、半导体器件及其制造方法
KR102528807B1 (ko) 전계 효과 트랜지스터의 소오스-드레인 컨택을 제조하는 방법
JP2009135419A5 (enExample)
JP2007535171A5 (enExample)
JP2008522443A5 (enExample)
US10886367B2 (en) Forming FinFET with reduced variability
CN103794483B (zh) 具有金属栅极的半导体器件的制作方法
US20220271148A1 (en) Semiconductor device structure and method for forming the same
JP2008529301A5 (enExample)
US20240355822A1 (en) Semiconductor device and method for forming the same
TWI502633B (zh) 形成金屬閘極之方法
JP2006196610A5 (enExample)