JP2007520080A5 - - Google Patents

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Publication number
JP2007520080A5
JP2007520080A5 JP2006551095A JP2006551095A JP2007520080A5 JP 2007520080 A5 JP2007520080 A5 JP 2007520080A5 JP 2006551095 A JP2006551095 A JP 2006551095A JP 2006551095 A JP2006551095 A JP 2006551095A JP 2007520080 A5 JP2007520080 A5 JP 2007520080A5
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JP
Japan
Prior art keywords
processing chamber
substrate
species
top surface
hydrogen
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Application number
JP2006551095A
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English (en)
Japanese (ja)
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JP2007520080A (ja
JP5153143B2 (ja
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Priority claimed from US10/769,408 external-priority patent/US7232766B2/en
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Publication of JP2007520080A publication Critical patent/JP2007520080A/ja
Publication of JP2007520080A5 publication Critical patent/JP2007520080A5/ja
Application granted granted Critical
Publication of JP5153143B2 publication Critical patent/JP5153143B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006551095A 2004-01-30 2004-12-30 銅表面に対する表面還元、不動態化、腐食防止、および活性化のための方法 Expired - Fee Related JP5153143B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/769,408 US7232766B2 (en) 2003-03-14 2004-01-30 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
US10/769,408 2004-01-30
PCT/US2004/043910 WO2005076348A1 (en) 2004-01-30 2004-12-30 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface

Publications (3)

Publication Number Publication Date
JP2007520080A JP2007520080A (ja) 2007-07-19
JP2007520080A5 true JP2007520080A5 (enExample) 2008-03-06
JP5153143B2 JP5153143B2 (ja) 2013-02-27

Family

ID=34837810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006551095A Expired - Fee Related JP5153143B2 (ja) 2004-01-30 2004-12-30 銅表面に対する表面還元、不動態化、腐食防止、および活性化のための方法

Country Status (7)

Country Link
US (1) US7232766B2 (enExample)
EP (1) EP1709679A1 (enExample)
JP (1) JP5153143B2 (enExample)
KR (1) KR101127778B1 (enExample)
CN (1) CN1906753A (enExample)
IL (1) IL176591A (enExample)
WO (1) WO2005076348A1 (enExample)

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CN103187360B (zh) * 2011-12-30 2016-01-06 中芯国际集成电路制造(上海)有限公司 形成互连结构的方法
KR101804656B1 (ko) * 2016-02-04 2017-12-04 고려대학교 산학협력단 수소 플라즈마 처리된 나노 다이아몬드 분말을 포함하는 내마모 저마찰 고분자 복합재 및 그 제조 방법
CN116034460A (zh) * 2020-08-27 2023-04-28 朗姆研究公司 减材式铜蚀刻
CN112458398A (zh) * 2020-11-25 2021-03-09 浙江申久金属制品有限公司 一种喷砂辅助的渗铝不锈钢板的制备方法及不锈钢板
CN115241322A (zh) * 2022-06-22 2022-10-25 通威太阳能(安徽)有限公司 电极的去氧化方法、电池的制备方法、电池和电子产品

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