JP2005064302A5 - - Google Patents

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Publication number
JP2005064302A5
JP2005064302A5 JP2003293904A JP2003293904A JP2005064302A5 JP 2005064302 A5 JP2005064302 A5 JP 2005064302A5 JP 2003293904 A JP2003293904 A JP 2003293904A JP 2003293904 A JP2003293904 A JP 2003293904A JP 2005064302 A5 JP2005064302 A5 JP 2005064302A5
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JP
Japan
Prior art keywords
film
added carbon
opening
carbon film
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003293904A
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English (en)
Japanese (ja)
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JP2005064302A (ja
JP4413556B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2003293904A external-priority patent/JP4413556B2/ja
Priority to JP2003293904A priority Critical patent/JP4413556B2/ja
Priority to US10/567,733 priority patent/US7875549B2/en
Priority to EP10187082A priority patent/EP2284875A3/en
Priority to CNB2004800233557A priority patent/CN100514574C/zh
Priority to EP04747870A priority patent/EP1655771B1/en
Priority to KR1020067003057A priority patent/KR100782673B1/ko
Priority to PCT/JP2004/010484 priority patent/WO2005017990A1/ja
Priority to TW093124395A priority patent/TW200518221A/zh
Publication of JP2005064302A publication Critical patent/JP2005064302A/ja
Publication of JP2005064302A5 publication Critical patent/JP2005064302A5/ja
Publication of JP4413556B2 publication Critical patent/JP4413556B2/ja
Application granted granted Critical
Priority to US12/858,162 priority patent/US8119518B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003293904A 2003-08-15 2003-08-15 成膜方法、半導体装置の製造方法 Expired - Fee Related JP4413556B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2003293904A JP4413556B2 (ja) 2003-08-15 2003-08-15 成膜方法、半導体装置の製造方法
KR1020067003057A KR100782673B1 (ko) 2003-08-15 2004-07-23 성막 방법 및 반도체 장치의 제조 방법
PCT/JP2004/010484 WO2005017990A1 (ja) 2003-08-15 2004-07-23 成膜方法、半導体装置の製造方法、半導体装置、基板処理システム
EP10187082A EP2284875A3 (en) 2003-08-15 2004-07-23 Film forming method, fabrication method of semiconductor device, semiconductor device, and substrate processing system
CNB2004800233557A CN100514574C (zh) 2003-08-15 2004-07-23 成膜方法、半导体装置的制造方法、半导体装置、基板处理系统
EP04747870A EP1655771B1 (en) 2003-08-15 2004-07-23 Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system
US10/567,733 US7875549B2 (en) 2003-08-15 2004-07-23 Fluorine doped carbon films produced by modification by radicals
TW093124395A TW200518221A (en) 2003-08-15 2004-08-13 Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system
US12/858,162 US8119518B2 (en) 2003-08-15 2010-08-17 Noble metal barrier for fluorine-doped carbon films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003293904A JP4413556B2 (ja) 2003-08-15 2003-08-15 成膜方法、半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009176043A Division JP2009295992A (ja) 2009-07-29 2009-07-29 半導体装置の製造方法、半導体装置

Publications (3)

Publication Number Publication Date
JP2005064302A JP2005064302A (ja) 2005-03-10
JP2005064302A5 true JP2005064302A5 (enExample) 2006-09-21
JP4413556B2 JP4413556B2 (ja) 2010-02-10

Family

ID=34191011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003293904A Expired - Fee Related JP4413556B2 (ja) 2003-08-15 2003-08-15 成膜方法、半導体装置の製造方法

Country Status (7)

Country Link
US (2) US7875549B2 (enExample)
EP (2) EP2284875A3 (enExample)
JP (1) JP4413556B2 (enExample)
KR (1) KR100782673B1 (enExample)
CN (1) CN100514574C (enExample)
TW (1) TW200518221A (enExample)
WO (1) WO2005017990A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887449B1 (ko) * 2003-09-17 2009-03-10 도쿄엘렉트론가부시키가이샤 저유전율 절연막의 형성 방법, 플라즈마 처리 장치, 및기록 매체
JP4555143B2 (ja) * 2004-05-11 2010-09-29 東京エレクトロン株式会社 基板の処理方法
JP2006135303A (ja) * 2004-10-05 2006-05-25 Tokyo Electron Ltd プラズマ成膜方法及びプラズマ成膜装置、並びにプラズマ成膜装置に用いられる記憶媒体
JP5194393B2 (ja) * 2006-06-23 2013-05-08 東京エレクトロン株式会社 半導体装置の製造方法
US7964496B2 (en) * 2006-11-21 2011-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Schemes for forming barrier layers for copper in interconnect structures
JP5261964B2 (ja) * 2007-04-10 2013-08-14 東京エレクトロン株式会社 半導体装置の製造方法
US8197913B2 (en) * 2007-07-25 2012-06-12 Tokyo Electron Limited Film forming method for a semiconductor
JP2009111251A (ja) * 2007-10-31 2009-05-21 Tohoku Univ 半導体装置およびその製造方法
US20110081500A1 (en) * 2009-10-06 2011-04-07 Tokyo Electron Limited Method of providing stable and adhesive interface between fluorine-based low-k material and metal barrier layer
JP5700513B2 (ja) * 2010-10-08 2015-04-15 国立大学法人東北大学 半導体装置の製造方法および半導体装置
JP2012216633A (ja) * 2011-03-31 2012-11-08 Tokyo Electron Ltd プラズマ窒化処理方法、プラズマ窒化処理装置および半導体装置の製造方法
JP5364765B2 (ja) * 2011-09-07 2013-12-11 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
WO2013125647A1 (ja) * 2012-02-22 2013-08-29 東京エレクトロン株式会社 半導体装置の製造方法及び半導体装置
JP6045975B2 (ja) 2012-07-09 2016-12-14 東京エレクトロン株式会社 カーボン膜の成膜方法および成膜装置
JP2014036148A (ja) * 2012-08-09 2014-02-24 Tokyo Electron Ltd 多層膜をエッチングする方法、及びプラズマ処理装置
US20150118416A1 (en) * 2013-10-31 2015-04-30 Semes Co., Ltd. Substrate treating apparatus and method
JP6457101B2 (ja) 2015-09-17 2019-01-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
CN108751123B (zh) * 2018-05-21 2022-05-20 赛莱克斯微系统科技（北京）有限公司 一种接触窗的形成方法
CN111686766B (zh) * 2019-03-11 2021-09-21 中国科学院福建物质结构研究所 一种金属-氟掺杂碳复合材料及其制备方法和在电催化固氮中的应用
JP6960953B2 (ja) * 2019-03-20 2021-11-05 株式会社Kokusai Electric 半導体装置の製造方法、基板処理方法、基板処理装置、およびプログラム

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748864B2 (ja) 1994-09-12 1998-05-13 日本電気株式会社 半導体装置及びその製造方法及び非晶質炭素膜の製造方法及びプラズマｃｖｄ装置
JP3666106B2 (ja) 1996-02-29 2005-06-29 ソニー株式会社 半導体装置の製造方法
US5989998A (en) * 1996-08-29 1999-11-23 Matsushita Electric Industrial Co., Ltd. Method of forming interlayer insulating film
JP3400918B2 (ja) * 1996-11-14 2003-04-28 東京エレクトロン株式会社 半導体装置の製造方法
JP3402972B2 (ja) 1996-11-14 2003-05-06 東京エレクトロン株式会社 半導体装置の製造方法
JP3429171B2 (ja) * 1997-11-20 2003-07-22 東京エレクトロン株式会社 プラズマ処理方法及び半導体デバイスの製造方法
US6107192A (en) * 1997-12-30 2000-08-22 Applied Materials, Inc. Reactive preclean prior to metallization for sub-quarter micron application
EP0933814A1 (en) * 1998-01-28 1999-08-04 Interuniversitair Micro-Elektronica Centrum Vzw A metallization structure on a fluorine-containing dielectric and a method for fabrication thereof
JP4355039B2 (ja) * 1998-05-07 2009-10-28 東京エレクトロン株式会社 半導体装置及び半導体装置の製造方法
SE512274C2 (sv) 1998-05-13 2000-02-21 Volvo Wheel Loaders Ab Bromsanordning och ett bromsmanöverorgan
KR100407542B1 (ko) * 1999-03-09 2003-11-28 동경 엘렉트론 주식회사 반도체 장치 및 그 제조 방법
US6740580B1 (en) * 1999-09-03 2004-05-25 Chartered Semiconductor Manufacturing Ltd. Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier
US20010042513A1 (en) * 1999-10-13 2001-11-22 Chien-Teh Kao Apparatus for improved remote microwave plasma source for use with substrate processing systems
JP2001135631A (ja) * 1999-11-10 2001-05-18 Matsushita Electronics Industry Corp 半導体装置及びその製造方法
US6284657B1 (en) * 2000-02-25 2001-09-04 Chartered Semiconductor Manufacturing Ltd. Non-metallic barrier formation for copper damascene type interconnects
US6818990B2 (en) * 2000-04-03 2004-11-16 Rensselaer Polytechnic Institute Fluorine diffusion barriers for fluorinated dielectrics in integrated circuits
JP4366856B2 (ja) * 2000-10-23 2009-11-18 東京エレクトロン株式会社 プラズマ処理装置
US6518193B1 (en) * 2001-03-09 2003-02-11 Lsi Logic Corporation Substrate processing system
US6972223B2 (en) * 2001-03-15 2005-12-06 Micron Technology, Inc. Use of atomic oxygen process for improved barrier layer
JP4727057B2 (ja) * 2001-03-28 2011-07-20 忠弘 大見 プラズマ処理装置
JP2002329682A (ja) * 2001-04-27 2002-11-15 Anelva Corp Ｃｕ薄膜作製方法
JP3648480B2 (ja) * 2001-12-26 2005-05-18 株式会社東芝 半導体装置およびその製造方法
US20040161946A1 (en) * 2002-06-24 2004-08-19 Hsin-Yi Tsai Method for fluorocarbon film depositing

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