JP2007288127A5 - - Google Patents
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- JP2007288127A5 JP2007288127A5 JP2006282447A JP2006282447A JP2007288127A5 JP 2007288127 A5 JP2007288127 A5 JP 2007288127A5 JP 2006282447 A JP2006282447 A JP 2006282447A JP 2006282447 A JP2006282447 A JP 2006282447A JP 2007288127 A5 JP2007288127 A5 JP 2007288127A5
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- JP
- Japan
- Prior art keywords
- semiconductor film
- film
- orientation
- crystal grains
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006282447A JP5159081B2 (ja) | 2005-10-18 | 2006-10-17 | 半導体装置およびその作製方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005303761 | 2005-10-18 | ||
| JP2005303761 | 2005-10-18 | ||
| JP2006076454 | 2006-03-20 | ||
| JP2006076454 | 2006-03-20 | ||
| JP2006282447A JP5159081B2 (ja) | 2005-10-18 | 2006-10-17 | 半導体装置およびその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007288127A JP2007288127A (ja) | 2007-11-01 |
| JP2007288127A5 true JP2007288127A5 (enExample) | 2009-11-12 |
| JP5159081B2 JP5159081B2 (ja) | 2013-03-06 |
Family
ID=37948631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006282447A Expired - Fee Related JP5159081B2 (ja) | 2005-10-18 | 2006-10-17 | 半導体装置およびその作製方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7709309B2 (enExample) |
| JP (1) | JP5159081B2 (enExample) |
| KR (1) | KR101299604B1 (enExample) |
| WO (1) | WO2007046290A1 (enExample) |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007046290A1 (en) * | 2005-10-18 | 2007-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8278739B2 (en) * | 2006-03-20 | 2012-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor film, semiconductor device, and method for manufacturing thereof |
| TWI438823B (zh) * | 2006-08-31 | 2014-05-21 | Semiconductor Energy Lab | 晶體半導體膜的製造方法和半導體裝置 |
| US7662703B2 (en) * | 2006-08-31 | 2010-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing crystalline semiconductor film and semiconductor device |
| US8338278B2 (en) * | 2006-12-04 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device with crystallized semiconductor film |
| KR100890250B1 (ko) * | 2007-01-08 | 2009-03-24 | 포항공과대학교 산학협력단 | 플렉서블 소자의 제조 방법 및 플렉서블 표시 장치의 제조방법 |
| KR101397567B1 (ko) * | 2007-01-24 | 2014-05-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체막의 결정화 방법 및 반도체장치의 제작방법 |
| JP5433154B2 (ja) * | 2007-02-23 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7972943B2 (en) * | 2007-03-02 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US7755113B2 (en) * | 2007-03-16 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor display device, and manufacturing method of semiconductor device |
| US9177811B2 (en) * | 2007-03-23 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2008123116A1 (en) * | 2007-03-26 | 2008-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Soi substrate and method for manufacturing soi substrate |
| WO2008123117A1 (en) * | 2007-03-26 | 2008-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Soi substrate and method for manufacturing soi substrate |
| CN101281912B (zh) | 2007-04-03 | 2013-01-23 | 株式会社半导体能源研究所 | Soi衬底及其制造方法以及半导体装置 |
| US7875881B2 (en) * | 2007-04-03 | 2011-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| CN101657882B (zh) | 2007-04-13 | 2012-05-30 | 株式会社半导体能源研究所 | 显示器件、用于制造显示器件的方法、以及soi衬底 |
| US7635617B2 (en) * | 2007-04-27 | 2009-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device |
| US9059247B2 (en) * | 2007-05-18 | 2015-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
| EP1993126B1 (en) * | 2007-05-18 | 2011-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing methods of semiconductor substrate |
| TWI476927B (zh) * | 2007-05-18 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
| US8354674B2 (en) * | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| JP5486781B2 (ja) * | 2007-07-19 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20090046757A1 (en) * | 2007-08-16 | 2009-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device |
| JP2009076890A (ja) * | 2007-08-31 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法、半導体装置、及び電子機器 |
| JP5527956B2 (ja) * | 2007-10-10 | 2014-06-25 | 株式会社半導体エネルギー研究所 | 半導体基板の製造方法 |
| US8236668B2 (en) * | 2007-10-10 | 2012-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| JP5511173B2 (ja) * | 2007-10-10 | 2014-06-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5490393B2 (ja) * | 2007-10-10 | 2014-05-14 | 株式会社半導体エネルギー研究所 | 半導体基板の製造方法 |
| US8455331B2 (en) * | 2007-10-10 | 2013-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| CN101842910B (zh) * | 2007-11-01 | 2013-03-27 | 株式会社半导体能源研究所 | 用于制造光电转换器件的方法 |
| US8227808B2 (en) * | 2007-12-06 | 2012-07-24 | Chimei Innolux Corporation | Method for manufacturing thin film transistor (TFT) and OLED display having TFTS manufactured by the same |
| US7906405B2 (en) * | 2007-12-24 | 2011-03-15 | Texas Instruments Incorporated | Polysilicon structures resistant to laser anneal lightpipe waveguide effects |
| JP5459900B2 (ja) | 2007-12-25 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5503876B2 (ja) * | 2008-01-24 | 2014-05-28 | 株式会社半導体エネルギー研究所 | 半導体基板の製造方法 |
| US8710375B2 (en) * | 2008-03-04 | 2014-04-29 | Sharp Kabushiki Kaisha | Display device substrate, method for manufacturing the same, display device, method for forming multi-layer wiring, and multi-layer wiring substrate |
| KR101015844B1 (ko) * | 2008-06-19 | 2011-02-23 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법 및 그를 구비하는유기전계발광표시장치의 제조방법 |
| JP5700617B2 (ja) | 2008-07-08 | 2015-04-15 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
| US8741740B2 (en) * | 2008-10-02 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| WO2010065587A2 (en) * | 2008-12-02 | 2010-06-10 | Drexel University | Ferroelectric nanoshell devices |
| TW201037769A (en) * | 2009-04-09 | 2010-10-16 | Chunghwa Picture Tubes Ltd | Thin film transistor and manufacturing method thereof |
| US8772627B2 (en) * | 2009-08-07 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| DE102009059193B4 (de) * | 2009-12-17 | 2024-02-15 | Innolas Solutions Gmbh | Verfahren zur Dotierung von Halbleitermaterialien |
| JP2012038843A (ja) * | 2010-08-05 | 2012-02-23 | Tohoku Univ | 半導体薄膜の製造方法、半導体デバイスおよび半導体薄膜製造装置 |
| JP5472462B2 (ja) * | 2010-11-10 | 2014-04-16 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
| JP2012156495A (ja) | 2011-01-07 | 2012-08-16 | Semiconductor Energy Lab Co Ltd | Soi基板の作製方法 |
| JP5891504B2 (ja) * | 2011-03-08 | 2016-03-23 | 株式会社Joled | 薄膜トランジスタアレイ装置の製造方法 |
| JP5742344B2 (ja) | 2011-03-20 | 2015-07-01 | 富士通株式会社 | 受光素子、光受信器及び光受信モジュール |
| US8729545B2 (en) * | 2011-04-28 | 2014-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| US8802534B2 (en) | 2011-06-14 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming SOI substrate and apparatus for forming the same |
| CN103189990A (zh) * | 2011-10-28 | 2013-07-03 | 松下电器产业株式会社 | 薄膜半导体器件及其制造方法 |
| US10002968B2 (en) | 2011-12-14 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| TWI515936B (zh) * | 2011-12-15 | 2016-01-01 | 友達光電股份有限公司 | 發光裝置及其製作方法 |
| JP5943341B2 (ja) * | 2012-02-29 | 2016-07-05 | 国立大学法人大阪大学 | 単結晶状GeSn含有材料の製造方法 |
| WO2014077063A1 (ja) * | 2012-11-16 | 2014-05-22 | コニカミノルタ株式会社 | 透光性電極、及び、電子デバイス |
| KR101989560B1 (ko) * | 2012-12-31 | 2019-06-14 | 엔라이트 인크. | Ltps 크리스탈화를 위한 짧은 펄스 섬유 레이저 |
| KR102097031B1 (ko) | 2013-07-22 | 2020-04-06 | 삼성디스플레이 주식회사 | 폴더블 디스플레이 장치 및 그의 제조 방법 |
| CN106597697A (zh) | 2013-12-02 | 2017-04-26 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
| US20150197063A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Device, method, and system of three-dimensional printing |
| KR102509883B1 (ko) * | 2015-06-29 | 2023-03-13 | 아이피지 포토닉스 코포레이션 | 비정질 실리콘 기재의 균일한 결정화를 위한 섬유 레이저-기반 시스템 |
| JP2017037178A (ja) | 2015-08-10 | 2017-02-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| KR102460551B1 (ko) * | 2015-10-29 | 2022-10-31 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
| JP6416140B2 (ja) * | 2016-02-12 | 2018-10-31 | 信越化学工業株式会社 | 多結晶シリコン棒および多結晶シリコン棒の選別方法 |
| CN105609537B (zh) * | 2016-03-09 | 2019-07-05 | 京东方科技集团股份有限公司 | 发光显示器件及其制造方法 |
| US10586817B2 (en) | 2016-03-24 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and separation apparatus |
| JP2017207744A (ja) | 2016-05-11 | 2017-11-24 | 株式会社半導体エネルギー研究所 | 表示装置、モジュール、及び電子機器 |
| KR102605208B1 (ko) | 2016-06-28 | 2023-11-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| WO2018020333A1 (en) | 2016-07-29 | 2018-02-01 | Semiconductor Energy Laboratory Co., Ltd. | Separation method, display device, display module, and electronic device |
| TW201808628A (zh) | 2016-08-09 | 2018-03-16 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
| JP6797042B2 (ja) * | 2017-02-02 | 2020-12-09 | 株式会社ジャパンディスプレイ | 表示装置 |
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| WO2019028064A1 (en) * | 2017-07-31 | 2019-02-07 | Ipg Photonics Corporation | FIBER LASER APPARATUS AND PART PROCESSING METHOD |
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| CN108535806B (zh) * | 2018-05-14 | 2019-12-27 | 台州学院 | 一种带有金属衬底的微型集成波导分束器件及其加工制备方法 |
| EP3730005B1 (de) * | 2019-04-24 | 2023-01-25 | Vorwerk & Co. Interholding GmbH | Verfahren zur generierung zumindest eines rezeptvorschlags, küchengerät sowie system zum zubereiten von speisen |
| WO2021021426A1 (en) * | 2019-07-31 | 2021-02-04 | Cummins Emission Solutions Inc. | Systems and methods for recovering catalyst performance |
Family Cites Families (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3437863B2 (ja) * | 1993-01-18 | 2003-08-18 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
| US4727044A (en) * | 1984-05-18 | 1988-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor with laser recrystallized source and drain |
| JPH05299339A (ja) | 1991-03-18 | 1993-11-12 | Semiconductor Energy Lab Co Ltd | 半導体材料およびその作製方法 |
| US5753542A (en) | 1985-08-02 | 1998-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air |
| US5962869A (en) | 1988-09-28 | 1999-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor material and method for forming the same and thin film transistor |
| DE69127395T2 (de) * | 1990-05-11 | 1998-01-02 | Asahi Glass Co Ltd | Verfahren zum Herstellen eines Dünnfilm-Transistors mit polykristallinem Halbleiter |
| KR950001360B1 (ko) | 1990-11-26 | 1995-02-17 | 가부시키가이샤 한도오따이 에네루기 겐큐쇼 | 전기 광학장치와 그 구동방법 |
| JPH0824104B2 (ja) | 1991-03-18 | 1996-03-06 | 株式会社半導体エネルギー研究所 | 半導体材料およびその作製方法 |
| US5899709A (en) * | 1992-04-07 | 1999-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor device using anodic oxidation |
| CN100465742C (zh) * | 1992-08-27 | 2009-03-04 | 株式会社半导体能源研究所 | 有源矩阵显示器 |
| US5643801A (en) * | 1992-11-06 | 1997-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing method and alignment |
| TW226478B (en) * | 1992-12-04 | 1994-07-11 | Semiconductor Energy Res Co Ltd | Semiconductor device and method for manufacturing the same |
| DE69416363T2 (de) * | 1993-03-23 | 1999-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Abbildendes festkörperbauteil und herstellungsverfahren dafür |
| US5529937A (en) * | 1993-07-27 | 1996-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating thin film transistor |
| US5663077A (en) * | 1993-07-27 | 1997-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a thin film transistor in which the gate insulator comprises two oxide films |
| JP2762215B2 (ja) * | 1993-08-12 | 1998-06-04 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタおよび半導体装置の作製方法 |
| TW264575B (enExample) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
| JP3562590B2 (ja) * | 1993-12-01 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置作製方法 |
| JP3254072B2 (ja) * | 1994-02-15 | 2002-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3192546B2 (ja) * | 1994-04-15 | 2001-07-30 | シャープ株式会社 | 半導体装置およびその製造方法 |
| EP1335419A3 (en) * | 1994-06-15 | 2003-08-27 | Seiko Epson Corporation | Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device |
| TW273639B (en) * | 1994-07-01 | 1996-04-01 | Handotai Energy Kenkyusho Kk | Method for producing semiconductor device |
| TW280943B (enExample) * | 1994-07-15 | 1996-07-11 | Sharp Kk | |
| JP3599290B2 (ja) | 1994-09-19 | 2004-12-08 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP3421882B2 (ja) * | 1994-10-19 | 2003-06-30 | ソニー株式会社 | 多結晶半導体薄膜の作成方法 |
| JP3364081B2 (ja) * | 1995-02-16 | 2003-01-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3091904B2 (ja) * | 1995-10-05 | 2000-09-25 | 株式会社日本製鋼所 | レーザーアニール処理装置 |
| JP4001645B2 (ja) * | 1995-11-22 | 2007-10-31 | 株式会社半導体エネルギー研究所 | 結晶性珪素膜作製方法およびレーザー照射装置 |
| JP3580033B2 (ja) * | 1996-06-20 | 2004-10-20 | ソニー株式会社 | 薄膜半導体装置及びその製造方法とレーザアニール装置 |
| US5998838A (en) * | 1997-03-03 | 1999-12-07 | Nec Corporation | Thin film transistor |
| JP3642546B2 (ja) * | 1997-08-12 | 2005-04-27 | 株式会社東芝 | 多結晶半導体薄膜の製造方法 |
| JPH11145056A (ja) | 1997-11-07 | 1999-05-28 | Sony Corp | 半導体材料 |
| US6312979B1 (en) * | 1998-04-28 | 2001-11-06 | Lg.Philips Lcd Co., Ltd. | Method of crystallizing an amorphous silicon layer |
| US6255148B1 (en) * | 1998-07-13 | 2001-07-03 | Fujitsu Limited | Polycrystal thin film forming method and forming system |
| JP2000058839A (ja) * | 1998-08-05 | 2000-02-25 | Semiconductor Energy Lab Co Ltd | 半導体素子からなる半導体回路を備えた半導体装置およびその作製方法 |
| JP2000174282A (ja) | 1998-12-03 | 2000-06-23 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP4307635B2 (ja) | 1999-06-22 | 2009-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2001319891A (ja) * | 2000-05-10 | 2001-11-16 | Nec Corp | 薄膜処理方法及び薄膜処理装置 |
| US6602765B2 (en) * | 2000-06-12 | 2003-08-05 | Seiko Epson Corporation | Fabrication method of thin-film semiconductor device |
| JP2002083974A (ja) | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP4389359B2 (ja) * | 2000-06-23 | 2009-12-24 | 日本電気株式会社 | 薄膜トランジスタ及びその製造方法 |
| US6875674B2 (en) | 2000-07-10 | 2005-04-05 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with fluorine concentration |
| US7045444B2 (en) * | 2000-12-19 | 2006-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device that includes selectively adding a noble gas element |
| US6858480B2 (en) * | 2001-01-18 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP4709442B2 (ja) * | 2001-08-28 | 2011-06-22 | 株式会社 日立ディスプレイズ | 薄膜トランジスタの製造方法 |
| JP4275336B2 (ja) * | 2001-11-16 | 2009-06-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4084039B2 (ja) * | 2001-11-19 | 2008-04-30 | 株式会社 液晶先端技術開発センター | 薄膜半導体装置及びその製造方法 |
| JP2003168646A (ja) | 2001-12-04 | 2003-06-13 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP3992976B2 (ja) | 2001-12-21 | 2007-10-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4271413B2 (ja) * | 2002-06-28 | 2009-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6908797B2 (en) | 2002-07-09 | 2005-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| US7605023B2 (en) * | 2002-08-29 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for a semiconductor device and heat treatment method therefor |
| TWI253179B (en) * | 2002-09-18 | 2006-04-11 | Sanyo Electric Co | Method for making a semiconductor device |
| JP4627961B2 (ja) * | 2002-09-20 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4744059B2 (ja) * | 2002-11-22 | 2011-08-10 | シャープ株式会社 | 半導体薄膜、半導体薄膜の形成方法、半導体装置およびディスプレイ装置。 |
| JP4360826B2 (ja) * | 2003-04-24 | 2009-11-11 | シャープ株式会社 | 半導体膜およびその製造方法 |
| TWI372463B (en) | 2003-12-02 | 2012-09-11 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device |
| JP5159021B2 (ja) | 2003-12-02 | 2013-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1553643A3 (en) | 2003-12-26 | 2009-01-21 | Sel Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and method for manufacturing crystalline semiconductor film |
| JP4437404B2 (ja) * | 2004-01-08 | 2010-03-24 | シャープ株式会社 | 半導体装置とその製造方法 |
| JP2005217209A (ja) * | 2004-01-30 | 2005-08-11 | Hitachi Ltd | レーザアニール方法およびレーザアニール装置 |
| US7247813B2 (en) * | 2004-10-13 | 2007-07-24 | Advanced Lcd Technologies Development Center Co., Ltd. | Crystallization apparatus using pulsed laser beam |
| EP1716964B1 (en) | 2005-04-28 | 2009-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device and laser irradiation apparatus |
| WO2007046290A1 (en) * | 2005-10-18 | 2007-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8278739B2 (en) | 2006-03-20 | 2012-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor film, semiconductor device, and method for manufacturing thereof |
| TWI298183B (en) * | 2006-05-16 | 2008-06-21 | Ind Tech Res Inst | Method for forming poly-silicon film |
-
2006
- 2006-10-05 WO PCT/JP2006/320362 patent/WO2007046290A1/en not_active Ceased
- 2006-10-05 KR KR1020087011872A patent/KR101299604B1/ko not_active Expired - Fee Related
- 2006-10-12 US US11/546,447 patent/US7709309B2/en not_active Expired - Fee Related
- 2006-10-17 JP JP2006282447A patent/JP5159081B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-17 US US12/725,483 patent/US8058709B2/en not_active Expired - Fee Related
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