JP2007150150A5 - - Google Patents
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- Publication number
- JP2007150150A5 JP2007150150A5 JP2005345347A JP2005345347A JP2007150150A5 JP 2007150150 A5 JP2007150150 A5 JP 2007150150A5 JP 2005345347 A JP2005345347 A JP 2005345347A JP 2005345347 A JP2005345347 A JP 2005345347A JP 2007150150 A5 JP2007150150 A5 JP 2007150150A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- power supply
- semiconductor device
- wiring
- supply wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 42
- 239000010410 layer Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- 239000011229 interlayer Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000000605 extraction Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005345347A JP4995455B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置 |
| TW095143265A TWI396256B (zh) | 2005-11-30 | 2006-11-22 | Semiconductor device |
| TW104120440A TWI570844B (zh) | 2005-11-30 | 2006-11-22 | Semiconductor device |
| TW102105612A TWI496245B (zh) | 2005-11-30 | 2006-11-22 | Semiconductor device |
| US11/604,855 US20070120258A1 (en) | 2005-11-30 | 2006-11-28 | Semiconductor device |
| CN2006101629073A CN1976032B (zh) | 2005-11-30 | 2006-11-29 | 半导体器件 |
| CN2009102052584A CN101685818B (zh) | 2005-11-30 | 2006-11-29 | 半导体器件 |
| CN2010102550934A CN101937916B (zh) | 2005-11-30 | 2006-11-29 | 半导体设备 |
| KR1020060119984A KR101336355B1 (ko) | 2005-11-30 | 2006-11-30 | 반도체장치 |
| US12/253,850 US7714357B2 (en) | 2005-11-30 | 2008-10-17 | Semiconductor device |
| US12/727,811 US8552561B2 (en) | 2005-11-30 | 2010-03-19 | Semiconductor device with output circuit arrangement |
| US14/011,704 US8946770B2 (en) | 2005-11-30 | 2013-08-27 | Semiconductor device with output circuit and pad |
| US14/591,817 US9093283B2 (en) | 2005-11-30 | 2015-01-07 | Semiconductor devices with output circuit and pad |
| US14/746,774 US9343460B2 (en) | 2005-11-30 | 2015-06-22 | Semiconductor device with output circuit and pad arrangements |
| US15/099,574 US9515019B2 (en) | 2005-11-30 | 2016-04-14 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005345347A JP4995455B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007150150A JP2007150150A (ja) | 2007-06-14 |
| JP2007150150A5 true JP2007150150A5 (cg-RX-API-DMAC7.html) | 2008-12-25 |
| JP4995455B2 JP4995455B2 (ja) | 2012-08-08 |
Family
ID=38086651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005345347A Expired - Lifetime JP4995455B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (7) | US20070120258A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4995455B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101336355B1 (cg-RX-API-DMAC7.html) |
| CN (3) | CN1976032B (cg-RX-API-DMAC7.html) |
| TW (3) | TWI396256B (cg-RX-API-DMAC7.html) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879666A (en) * | 1996-10-24 | 1999-03-09 | The Procter & Gamble Company | Methods and compositions for reducing body odor |
| JP4517843B2 (ja) * | 2004-12-10 | 2010-08-04 | エルピーダメモリ株式会社 | 半導体装置 |
| JP4995455B2 (ja) * | 2005-11-30 | 2012-08-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4975398B2 (ja) * | 2006-08-30 | 2012-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP5190913B2 (ja) * | 2007-01-15 | 2013-04-24 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| US20080296758A1 (en) * | 2007-05-30 | 2008-12-04 | Texas Instruments Incorporated | Protection and Connection of Devices Underneath Bondpads |
| JP2009054702A (ja) * | 2007-08-24 | 2009-03-12 | Panasonic Corp | 半導体集積回路 |
| JP5222509B2 (ja) | 2007-09-12 | 2013-06-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2009141064A (ja) * | 2007-12-05 | 2009-06-25 | Renesas Technology Corp | 半導体装置 |
| JP5342154B2 (ja) * | 2008-02-25 | 2013-11-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US8363365B2 (en) * | 2008-06-17 | 2013-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5362296B2 (ja) * | 2008-09-03 | 2013-12-11 | 矢崎総業株式会社 | 端子金具 |
| US8581423B2 (en) | 2008-11-17 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double solid metal pad with reduced area |
| JP2010147282A (ja) * | 2008-12-19 | 2010-07-01 | Renesas Technology Corp | 半導体集積回路装置 |
| US8222698B2 (en) * | 2009-06-29 | 2012-07-17 | Analog Devices, Inc. | Bond pad with integrated transient over-voltage protection |
| US8384214B2 (en) * | 2009-10-13 | 2013-02-26 | United Microelectronics Corp. | Semiconductor structure, pad structure and protection structure |
| JP5585366B2 (ja) * | 2009-10-22 | 2014-09-10 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
| US9520486B2 (en) | 2009-11-04 | 2016-12-13 | Analog Devices, Inc. | Electrostatic protection device |
| KR20110056005A (ko) * | 2009-11-20 | 2011-05-26 | 삼성전자주식회사 | 반도체 장치의 배선 구조체 |
| US8432651B2 (en) | 2010-06-09 | 2013-04-30 | Analog Devices, Inc. | Apparatus and method for electronic systems reliability |
| US8665571B2 (en) | 2011-05-18 | 2014-03-04 | Analog Devices, Inc. | Apparatus and method for integrated circuit protection |
| US8368116B2 (en) | 2010-06-09 | 2013-02-05 | Analog Devices, Inc. | Apparatus and method for protecting electronic circuits |
| US8416543B2 (en) | 2010-07-08 | 2013-04-09 | Analog Devices, Inc. | Apparatus and method for electronic circuit protection |
| US8553380B2 (en) | 2010-07-08 | 2013-10-08 | Analog Devices, Inc. | Apparatus and method for electronic circuit protection |
| US10199482B2 (en) | 2010-11-29 | 2019-02-05 | Analog Devices, Inc. | Apparatus for electrostatic discharge protection |
| US8466489B2 (en) | 2011-02-04 | 2013-06-18 | Analog Devices, Inc. | Apparatus and method for transient electrical overstress protection |
| US8592860B2 (en) | 2011-02-11 | 2013-11-26 | Analog Devices, Inc. | Apparatus and method for protection of electronic circuits operating under high stress conditions |
| US8680620B2 (en) | 2011-08-04 | 2014-03-25 | Analog Devices, Inc. | Bi-directional blocking voltage protection devices and methods of forming the same |
| US8947841B2 (en) | 2012-02-13 | 2015-02-03 | Analog Devices, Inc. | Protection systems for integrated circuits and methods of forming the same |
| US8829570B2 (en) | 2012-03-09 | 2014-09-09 | Analog Devices, Inc. | Switching device for heterojunction integrated circuits and methods of forming the same |
| US8946822B2 (en) | 2012-03-19 | 2015-02-03 | Analog Devices, Inc. | Apparatus and method for protection of precision mixed-signal electronic circuits |
| US8610251B1 (en) | 2012-06-01 | 2013-12-17 | Analog Devices, Inc. | Low voltage protection devices for precision transceivers and methods of forming the same |
| US8637899B2 (en) | 2012-06-08 | 2014-01-28 | Analog Devices, Inc. | Method and apparatus for protection and high voltage isolation of low voltage communication interface terminals |
| US8796729B2 (en) | 2012-11-20 | 2014-08-05 | Analog Devices, Inc. | Junction-isolated blocking voltage devices with integrated protection structures and methods of forming the same |
| US9123540B2 (en) | 2013-01-30 | 2015-09-01 | Analog Devices, Inc. | Apparatus for high speed signal processing interface |
| US8860080B2 (en) | 2012-12-19 | 2014-10-14 | Analog Devices, Inc. | Interface protection device with integrated supply clamp and method of forming the same |
| US9006781B2 (en) | 2012-12-19 | 2015-04-14 | Analog Devices, Inc. | Devices for monolithic data conversion interface protection and methods of forming the same |
| US9275991B2 (en) | 2013-02-13 | 2016-03-01 | Analog Devices, Inc. | Apparatus for transceiver signal isolation and voltage clamp |
| US9773732B2 (en) * | 2013-03-06 | 2017-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for packaging pad structure |
| US9147677B2 (en) | 2013-05-16 | 2015-09-29 | Analog Devices Global | Dual-tub junction-isolated voltage clamp devices for protecting low voltage circuitry connected between high voltage interface pins and methods of forming the same |
| US9171832B2 (en) | 2013-05-24 | 2015-10-27 | Analog Devices, Inc. | Analog switch with high bipolar blocking voltage in low voltage CMOS process |
| JP5604602B2 (ja) * | 2014-01-07 | 2014-10-08 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| JP6347685B2 (ja) * | 2014-07-08 | 2018-06-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5916820B2 (ja) * | 2014-08-25 | 2016-05-11 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| US9484739B2 (en) | 2014-09-25 | 2016-11-01 | Analog Devices Global | Overvoltage protection device and method |
| US9478608B2 (en) | 2014-11-18 | 2016-10-25 | Analog Devices, Inc. | Apparatus and methods for transceiver interface overvoltage clamping |
| US10068894B2 (en) | 2015-01-12 | 2018-09-04 | Analog Devices, Inc. | Low leakage bidirectional clamps and methods of forming the same |
| US10181719B2 (en) | 2015-03-16 | 2019-01-15 | Analog Devices Global | Overvoltage blocking protection device |
| US9673187B2 (en) | 2015-04-07 | 2017-06-06 | Analog Devices, Inc. | High speed interface protection apparatus |
| JP6849927B2 (ja) * | 2016-03-28 | 2021-03-31 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| US9831233B2 (en) | 2016-04-29 | 2017-11-28 | Analog Devices Global | Apparatuses for communication systems transceiver interfaces |
| US10734806B2 (en) | 2016-07-21 | 2020-08-04 | Analog Devices, Inc. | High voltage clamps with transient activation and activation release control |
| JP6790705B2 (ja) * | 2016-10-13 | 2020-11-25 | セイコーエプソン株式会社 | 回路装置、発振器、電子機器及び移動体 |
| US10249609B2 (en) | 2017-08-10 | 2019-04-02 | Analog Devices, Inc. | Apparatuses for communication systems transceiver interfaces |
| US10700056B2 (en) | 2018-09-07 | 2020-06-30 | Analog Devices, Inc. | Apparatus for automotive and communication systems transceiver interfaces |
| US10784212B2 (en) | 2018-12-28 | 2020-09-22 | Micron Technology, Inc. | Semiconductor devices having crack-inhibiting structures |
| US10811365B2 (en) * | 2018-12-28 | 2020-10-20 | Micron Technology, Inc. | Semiconductor devices having crack-inhibiting structures |
| US11387648B2 (en) | 2019-01-10 | 2022-07-12 | Analog Devices International Unlimited Company | Electrical overstress protection with low leakage current for high voltage tolerant high speed interfaces |
| JP7613029B2 (ja) * | 2020-09-09 | 2025-01-15 | 株式会社ソシオネクスト | 半導体装置 |
| US11973075B2 (en) * | 2021-02-22 | 2024-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual substrate side ESD diode for high speed circuit |
| JPWO2022215485A1 (cg-RX-API-DMAC7.html) | 2021-04-08 | 2022-10-13 | ||
| WO2023037467A1 (ja) * | 2021-09-09 | 2023-03-16 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| WO2024029040A1 (ja) * | 2022-08-04 | 2024-02-08 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| JPWO2024047820A1 (cg-RX-API-DMAC7.html) * | 2022-08-31 | 2024-03-07 | ||
| WO2024241869A1 (ja) * | 2023-05-24 | 2024-11-28 | 株式会社ソシオネクスト | 半導体集積回路装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3989038B2 (ja) * | 1996-04-17 | 2007-10-10 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| JPH113984A (ja) * | 1997-06-13 | 1999-01-06 | Hitachi Ltd | 半導体集積回路装置 |
| US6803302B2 (en) * | 1999-11-22 | 2004-10-12 | Freescale Semiconductor, Inc. | Method for forming a semiconductor device having a mechanically robust pad interface |
| JP2001185552A (ja) * | 1999-12-27 | 2001-07-06 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| JP3727220B2 (ja) * | 2000-04-03 | 2005-12-14 | Necエレクトロニクス株式会社 | 半導体装置 |
| JP2001358297A (ja) * | 2000-06-14 | 2001-12-26 | Nec Corp | 静電保護回路 |
| JP2002016069A (ja) * | 2000-06-29 | 2002-01-18 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| JP3386042B2 (ja) * | 2000-08-02 | 2003-03-10 | 日本電気株式会社 | 半導体装置 |
| JP3861669B2 (ja) * | 2001-11-22 | 2006-12-20 | ソニー株式会社 | マルチチップ回路モジュールの製造方法 |
| JP2003163267A (ja) * | 2001-11-29 | 2003-06-06 | Mitsubishi Electric Corp | 半導体装置 |
| JP3932896B2 (ja) * | 2002-01-09 | 2007-06-20 | ソニー株式会社 | 半導体装置 |
| JP2003289104A (ja) * | 2002-03-28 | 2003-10-10 | Ricoh Co Ltd | 半導体装置の保護回路及び半導体装置 |
| US6717270B1 (en) | 2003-04-09 | 2004-04-06 | Motorola, Inc. | Integrated circuit die I/O cells |
| WO2004097916A1 (ja) * | 2003-04-30 | 2004-11-11 | Fujitsu Limited | 半導体装置の製造方法、半導体ウエハおよび半導体装置 |
| JP2005045016A (ja) * | 2003-07-22 | 2005-02-17 | Nec Electronics Corp | 半導体集積回路 |
| JP4483231B2 (ja) * | 2003-08-27 | 2010-06-16 | ソニー株式会社 | 磁気メモリ装置の製造方法 |
| US7453128B2 (en) * | 2003-11-10 | 2008-11-18 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
| JP2005150248A (ja) * | 2003-11-12 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
| JP4913329B2 (ja) * | 2004-02-09 | 2012-04-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US6953997B1 (en) * | 2004-06-04 | 2005-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device with improved bonding pad connection and placement |
| JP2006202866A (ja) * | 2005-01-19 | 2006-08-03 | Nec Electronics Corp | 半導体装置 |
| JP4995455B2 (ja) * | 2005-11-30 | 2012-08-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2005
- 2005-11-30 JP JP2005345347A patent/JP4995455B2/ja not_active Expired - Lifetime
-
2006
- 2006-11-22 TW TW095143265A patent/TWI396256B/zh active
- 2006-11-22 TW TW102105612A patent/TWI496245B/zh active
- 2006-11-22 TW TW104120440A patent/TWI570844B/zh active
- 2006-11-28 US US11/604,855 patent/US20070120258A1/en not_active Abandoned
- 2006-11-29 CN CN2006101629073A patent/CN1976032B/zh active Active
- 2006-11-29 CN CN2009102052584A patent/CN101685818B/zh active Active
- 2006-11-29 CN CN2010102550934A patent/CN101937916B/zh active Active
- 2006-11-30 KR KR1020060119984A patent/KR101336355B1/ko active Active
-
2008
- 2008-10-17 US US12/253,850 patent/US7714357B2/en active Active
-
2010
- 2010-03-19 US US12/727,811 patent/US8552561B2/en not_active Expired - Fee Related
-
2013
- 2013-08-27 US US14/011,704 patent/US8946770B2/en active Active
-
2015
- 2015-01-07 US US14/591,817 patent/US9093283B2/en active Active
- 2015-06-22 US US14/746,774 patent/US9343460B2/en active Active
-
2016
- 2016-04-14 US US15/099,574 patent/US9515019B2/en active Active
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