JP6790705B2 - 回路装置、発振器、電子機器及び移動体 - Google Patents
回路装置、発振器、電子機器及び移動体 Download PDFInfo
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- JP6790705B2 JP6790705B2 JP2016201489A JP2016201489A JP6790705B2 JP 6790705 B2 JP6790705 B2 JP 6790705B2 JP 2016201489 A JP2016201489 A JP 2016201489A JP 2016201489 A JP2016201489 A JP 2016201489A JP 6790705 B2 JP6790705 B2 JP 6790705B2
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Classifications
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
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- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
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Description
図1は、本実施形態の回路装置100のレイアウト構成例である。回路装置100は、第1〜第4のパッド、第1〜第4の静電保護回路を含む。回路装置100は集積回路装置であり、図1には集積回路装置の半導体チップ(回路が形成されたシリコン基板)の平面視図を示す。なお、本実施形態は図1の構成に限定されず、その構成要素の一部を省略したり、他の構成要素を追加したりする等の種々の変形実施が可能である。
図5は、本実施形態の回路装置100の詳細なレイアウト構成例である。なお以下では回路装置100がTCXOの回路装置である場合を例に説明するが、これに限定されず、図1のレイアウト構成例は種々の回路装置に適用可能である。また、本実施形態は図5の構成に限定されず、その構成要素の一部を省略したり、他の構成要素を追加したりする等の種々の変形実施が可能である。
図6は、本実施形態の回路装置100の詳細な構成例のブロック図である。回路装置100は、温度センサー160、温度補償回路150、制御回路130、記憶部140(不揮発性メモリー)、発振回路110、クロック信号出力回路180、電圧生成回路170(バイアス生成回路)を含む。なお回路装置の構成は図6の構成には限定されず、その一部の構成要素を省略したり(例えば温度センサー160等)、他の構成要素を追加するなどの種々の変形実施が可能である。
図7は、発振回路110の詳細な構成例である。発振回路110は、発振部12(発振回路本体)、バッファー14(プリバッファー、増幅部)を含む。なお、本実施形態は図7の構成に限定されず、その構成要素の一部を省略したり、他の構成要素を追加したりする等の種々の変形実施が可能である。
図8は、クロック信号出力回路180の詳細な構成例である。なお、本実施形態は図8の構成に限定されず、その構成要素の一部を省略したり、他の構成要素を追加したりする等の種々の変形実施が可能である。例えば、以下ではクロック信号出力回路180がクリップドサイン波のクロック信号を出力する場合を例に説明するが、これに限定されない。例えば、クロック信号出力回路180は矩形波(例えばCMOSレベル)のクロック信号を出力する回路であってもよい。
図9は、温度補償回路150の詳細な構成例である。温度補償回路150は、基準温度調整回路15、0次成分発生回路220、1次成分発生回路230、3次成分発生回路240、高次成分発生回路250、1次成分ゲイン調整回路260、3次成分ゲイン調整回路270、高次成分ゲイン調整回路280、加算回路200を含む。なお、本実施形態は図9の構成に限定されず、その構成要素の一部を省略したり、他の構成要素を追加したりする等の種々の変形実施が可能である。
図10は、本実施形態の回路装置500を含む発振器400の構成例である。発振器400は、回路装置500と、発振子XTAL(振動子、振動片)と、を含む。回路装置500は、上述した回路装置100又は回路装置120に対応する。また発振器400は、回路装置100、発振子XTALが収容されるパッケージ410を含むことができる。なお発振器は図10の構成に限定されず、これらの一部の構成要素を省略したり、他の構成要素を追加するなどの種々の変形実施が可能である。
15…基準温度調整回路、20…第2のパッド配置領域、30…回路配置領域、
100…回路装置、110…発振回路、120…回路装置、130…制御回路、
140…記憶部、150…温度補償回路、160…温度センサー、
170…電圧生成回路、180…クロック信号出力回路、200…加算回路、
206…自動車、207…車体、208…制御装置、209…車輪、
220…0次成分発生回路、230…1次成分発生回路、240…3次成分発生回路、
250…高次成分発生回路、260…1次成分ゲイン調整回路、
270…3次成分ゲイン調整回路、280…高次成分ゲイン調整回路、
400…発振器、410…パッケージ、412…ベース部、414…リッド部、
500…回路装置、510…通信部、520…処理部、530…操作部、
540…表示部、550…記憶部、
BIS…領域、CKOUT…領域、CLKO…端子(パッド)、
CN1…第1のコーナー、CN2…第2のコーナー、CN3…第3のコーナー、
CN3…第4のコーナー、D1…第1の方向、D2…第2の方向、
ESD、ESD1〜ESD6…配置領域、HN1…第1の辺、HN2…第2の辺、
HN3…第3の辺、HN4…第4の辺、KC1〜KC4…回路配置領域のコーナー、
MEM…領域、OSC…領域、PAD,PAD1〜PAD6…パッド領域、
PCAP…領域、SP…配置領域、TCMP…領域、VCNT…端子(パッド)、
VDD…端子(パッド)、VSS…端子(パッド)、XI…端子(パッド)、
XO…端子(パッド)、XTAL…発振子
Claims (15)
- 回路装置の第1の辺に沿った第1のパッド配置領域に配置される第1のパッド及び第2のパッドと、
前記第1の辺に対向する前記回路装置の第2の辺に沿った第2のパッド配置領域に配置される第3のパッド及び第4のパッドと、
前記第1のパッド配置領域と前記第2のパッド配置領域との間の回路配置領域に配置され、前記第1のパッドに接続される第1の静電保護回路と、
前記回路配置領域に配置され、前記第2のパッドに接続される第2の静電保護回路と、
前記回路配置領域に配置され、前記第3のパッドに接続される第3の静電保護回路と、
前記回路配置領域に配置され、前記第4のパッドに接続される第4の静電保護回路と、
を含み、
前記回路装置の第3の辺は、前記第1の辺及び前記第2の辺に交差する辺であり、前記回路装置の第4の辺は、前記第3の辺に対向する辺である場合に、
前記第1のパッドは、前記第1の辺と前記第3の辺とが交差する第1のコーナーの領域に配置され、
前記第2のパッドは、前記第1の辺と前記第4の辺とが交差する第2のコーナーの領域に配置され、
前記第3のパッドは、前記第2の辺と前記第3の辺とが交差する第3のコーナーの領域に配置され、
前記第4のパッドは、前記第2の辺と前記第4の辺とが交差する第4のコーナーの領域に配置されることを特徴とする回路装置。 - 請求項1に記載の回路装置において、
前記第1のパッドと前記第1の静電保護回路は、前記第1のパッド配置領域と前記回路配置領域との間の第1の境界を挟んで配置され、
前記第2のパッドと前記第2の静電保護回路は、前記第1の境界を挟んで配置され、
前記第3のパッドと前記第3の静電保護回路は、前記第2のパッド配置領域と前記回路配置領域との間の第2の境界を挟んで配置され、
前記第4のパッドと前記第4の静電保護回路は、前記第2の境界を挟んで配置されることを特徴とする回路装置。 - 請求項1又は2に記載の回路装置において、
発振子を発振させる発振回路と、
前記発振回路の発振信号に基づくクロック信号を出力するクロック信号出力回路と、
前記発振回路の発振周波数の温度補償を行う温度補償回路と、
を含み、
前記回路配置領域には、前記発振回路、前記クロック信号出力回路及び前記温度補償回路が配置されることを特徴とする回路装置。 - 請求項3に記載の回路装置において、
前記第1のパッドは、低電位側電源が供給されるパッドであり、
前記第2のパッドは、前記発振周波数の制御電圧が入力されるパッドであり、
前記第3のパッドは、前記クロック信号が出力されるパッドであり、
前記第4のパッドは、高電位側電源が供給されるパッドあることを特徴とする回路装置。 - 請求項4に記載の回路装置において、
前記第1のパッド配置領域において、前記第1のパッドと前記第2のパッドとの間に配置される第5のパッドと、
前記第2のパッド配置領域において、前記第3のパッドと前記第4のパッドとの間に配置される第6のパッドと、
を含み、
前記第5のパッドは、前記発振子の一端に接続されるパッドであり、
前記第6のパッドは、前記発振子の他端に接続されるパッドであることを特徴とする回路装置。 - 請求項5に記載の回路装置において、
前記第5のパッドに接続される第5の静電保護回路を含み、
前記第5の静電保護回路は、前記第1のパッド配置領域に配置されることを特徴とする回路装置。 - 請求項5又は6に記載の回路装置において、
前記発振周波数の温度補償用のパラメーター情報を記憶する不揮発性メモリーを含み、
前記第1の辺から前記第2の辺へと向かう方向を第1の方向とした場合に、
前記不揮発性メモリーは、前記第5のパッドの前記第1の方向に配置されることを特徴とする回路装置。 - 請求項3乃至7のいずれか一項に記載の回路装置において、
前記発振回路は、前記第1の静電保護回路と前記第3の静電保護回路の間の領域に配置されることを特徴とする回路装置。 - 請求項1乃至8のいずれか一項に記載の回路装置において、
前記第1のパッド配置領域及び前記第2のパッド配置領域の少なくとも一方には、高電位電源と低電位電源との間に設けられる電源間キャパシターが配置されることを特徴とする回路装置。 - 請求項1乃至9のいずれか一項に記載の回路装置において、
前記第1〜第4の静電保護回路の各々は、パッドが配置可能なサイズの配置領域に配置されることを特徴とする回路装置。 - 請求項10に記載の回路装置において、
前記第1のパッドの面積は、前記第1の静電保護回路の前記配置領域の面積よりも大きく、
前記第2のパッドの面積は、前記第2の静電保護回路の前記配置領域の面積よりも大きく、
前記第3のパッドの面積は、前記第3の静電保護回路の前記配置領域の面積よりも大きく、
前記第4のパッドの面積は、前記第4の静電保護回路の前記配置領域の面積よりも大きいことを特徴とする回路装置。 - 請求項1乃至11のいずれか一項に記載の回路装置において、
前記第1〜第4のパッドは、前記回路装置のコーナーの領域に配置され、
前記第1〜第4の静電保護回路は、前記回路配置領域のコーナーの領域に配置されることを特徴とする回路装置。 - 請求項1乃至12のいずれか一項に記載の回路装置と、
発振子と、
を含むことを特徴とする発振器。 - 請求項1乃至12のいずれか一項に記載の回路装置を含むことを特徴とする電子機器。
- 請求項1乃至12のいずれか一項に記載の回路装置を含むことを特徴とする移動体。
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