JP5280024B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5280024B2 JP5280024B2 JP2007221426A JP2007221426A JP5280024B2 JP 5280024 B2 JP5280024 B2 JP 5280024B2 JP 2007221426 A JP2007221426 A JP 2007221426A JP 2007221426 A JP2007221426 A JP 2007221426A JP 5280024 B2 JP5280024 B2 JP 5280024B2
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Description
(第1実施形態)
本実施形態の半導体装置を、図1の概略上面図、図2の透視斜視図により説明する。なお、図2においては、複数の電極パッド12、接続プラグ15および配線18のみを図示する。
半導体チップ10はロジックIC、メモリICのいずれであってもよく、混載されていてもよい。
そのため、半導体チップ10にクラック20が生じると、第1電極パッド12aおよび第2電極パッド12b間の配線18が断線することになる。したがって、第1電極パッド12aと第2電極パッド12bとの間の抵抗値を測定することにより、クラック20の発生を検知することができる。
そのため、半導体チップ10にクラックが生じると、第1電極パッド12aと第2電極パッド12bとの間の配線が確実に断線することになる。したがって、第1電極パッド12aと第2電極パッド12bとの間の抵抗値を測定することにより、クラック20の発生を効率よく検知することができる。
この構成により、第2配線部16は最上層に位置しなくなるので、アルミ等のマイグレートやヒロックによる断線を抑制することができる。そのため、半導体装置の製品信頼性が向上する。
即ち、配線18の電極パッドが接続されない側の一端を、VDD、GNDなどあらかじめその役割を定められた端子(プルアップ/プルダウンを含む)に接続することもできる。
そのため、平面視において、配線が占有する面積を減少させることができ、チップ面積の使用効率が向上する。さらに、第1配線部14と第2配線部16とが積層する箇所が存在するので、クラック20等の検知能力がより向上する。
本実施形態においては、図3に示すように、第1配線部14よりも下層に形成された第2配線部16は、矩形状の半導体チップ10のコーナー領域に存在する。かかるコーナー領域には、最上層に設けられた第1配線部14は存在しない。配線18は、Al、AlCu,Cu、AlSiCu等の少なくとも1つを含む。
本実施形態によれば、半導体チップ10のコーナー領域において、第2配線部16が最上層以外の層に存在する。そのため、配線18の金属配線スライドの発生を抑制することができる。
本実施形態の半導体装置において、図4に示すように、半導体チップ10の一辺に沿って設けられた電極パッド12の直下に、第2配線部16が位置する。
本実施形態によれば、第2配線部16の一部が電極パッド12の直下に位置しているので、第2配線部16を発熱させ、半導体チップ10の自己発熱における製品信頼性の検査を行うことができる。そのため、自己発熱検査用の測定装置を用意する必要がない。
本実施形態においては、図5に示すように、第1半導体チップ11の配線18と第2半導体チップ34の配線42とが、第1電極パッド12a,第1電極パッド36aを介して直列に接続されている。第1半導体チップ11および第2半導体チップ34は、パッケージ基板24上に積層されている。
11 第1半導体チップ
12 電極パッド
12a 第1電極パッド
12b 第2電極パッド
14 第1配線部
15 接続プラグ
16 第2配線部
18 配線
20 クラック
24 パッケージ基板
26 電極パッド
26a 第1電極パッド
26b 第2電極パッド
30 ボンディングワイヤ
34 第2半導体チップ
36 電極パッド
38 第1配線部
40 第2配線部
42 配線
Claims (8)
- 多層配線構造を有する矩形の半導体チップと、
前記半導体チップ上面において、該半導体チップの外周縁に沿って形成された複数の電極パッドと、
複数の前記電極パッドから選択された2つの電極パッドに接続するとともに、平面視において、前記半導体チップの全ての辺を閉じた配線と、を備え、
前記配線は、第1配線と、前記第1配線よりも下層に位置する第2配線とを含み、
前記2つの電極パッドは、直接、前記第1配線で互いに接続されておらず、
前記第1配線と前記第2配線とは接続プラグを介して直列に接続されており、
前記半導体チップの全てのコーナーには、前記接続プラグを介して前記第1配線と前記第2配線の繋ぎ換えを行うことにより、前記第2配線のみが配置されており、かつ前記第1配線はいずれの前記コーナーにも配置されていない半導体装置。 - 請求項1に記載の半導体装置において、
前記第1配線は最上層に形成されている半導体装置。 - 請求項2に記載の半導体装置において、
前記配線に接続する前記電極パッドの少なくとも一方が、該配線のみに接続している半導体装置。 - 請求項3に記載の半導体装置において、
前記配線と接続する2つの前記電極パッドが、前記半導体チップの異なる辺に沿ってそれぞれ形成されている半導体装置。 - 請求項4に記載の半導体装置において、
平面視において、前記第1配線と前記第2配線の少なくとも一部が重なっている半導体装置。 - 請求項5に記載の半導体装置において、
前記第2配線の少なくとも一部が、前記電極パッドの直下に形成されている半導体装置。 - 請求項6に記載の半導体装置が基板上に複数搭載されており、
複数の前記半導体装置の前記配線が前記電極パッドを介して直列に接続されている半導体装置。 - 請求項1〜7のいずれか一項に記載の半導体装置において、
前記配線は、前記半導体チップを一周以上している半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007221426A JP5280024B2 (ja) | 2007-08-28 | 2007-08-28 | 半導体装置 |
US12/222,601 US8310066B2 (en) | 2007-08-28 | 2008-08-12 | Semiconductor apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007221426A JP5280024B2 (ja) | 2007-08-28 | 2007-08-28 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2009054862A JP2009054862A (ja) | 2009-03-12 |
JP5280024B2 true JP5280024B2 (ja) | 2013-09-04 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007221426A Expired - Fee Related JP5280024B2 (ja) | 2007-08-28 | 2007-08-28 | 半導体装置 |
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US (1) | US8310066B2 (ja) |
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JP5096840B2 (ja) * | 2007-08-28 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8159254B2 (en) * | 2008-02-13 | 2012-04-17 | Infineon Technolgies Ag | Crack sensors for semiconductor devices |
JP2012243910A (ja) | 2011-05-18 | 2012-12-10 | Elpida Memory Inc | 半導体チップのクラックのチェックテスト構造を有する半導体装置 |
JP6054029B2 (ja) | 2011-12-22 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体チップおよび半導体装置 |
JP2013197576A (ja) | 2012-03-23 | 2013-09-30 | Elpida Memory Inc | 半導体装置 |
US9343381B2 (en) * | 2013-05-22 | 2016-05-17 | Infineon Technologies Ag | Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component |
CN103474435A (zh) * | 2013-09-17 | 2013-12-25 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法 |
KR101839405B1 (ko) * | 2015-05-07 | 2018-03-16 | 주식회사 엘지화학 | 메모리 칩의 파손 여부를 감지하는 검출 소자를 포함하는 보호회로 및 이를 포함하는 이차전지 팩 |
US10241151B2 (en) * | 2017-07-26 | 2019-03-26 | Nxp Usa, Inc. | Die crack detector and method therefor |
KR102595332B1 (ko) * | 2018-06-07 | 2023-10-27 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
JP7093436B1 (ja) * | 2021-03-01 | 2022-06-29 | 華邦電子股▲ふん▼有限公司 | 集積回路、クラック状態検出器およびクラック状態検出方法 |
CN116859206B (zh) * | 2023-09-04 | 2024-01-30 | 湖南大学 | 一种功率模块中键合界面最小剩余长度预测方法 |
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JPH03272143A (ja) * | 1990-03-22 | 1991-12-03 | Mitsubishi Electric Corp | 半導体集積装置 |
JPH04199651A (ja) * | 1990-11-29 | 1992-07-20 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JPH06244254A (ja) * | 1993-02-22 | 1994-09-02 | Hitachi Ltd | 半導体集積回路素子 |
JP2000031221A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | 半導体集積回路装置、およびそのテスト方法 |
US6744081B2 (en) * | 2002-10-30 | 2004-06-01 | Lsi Logic Corporation | Interleaved termination ring |
JP2005277338A (ja) * | 2004-03-26 | 2005-10-06 | Nec Electronics Corp | 半導体装置及びその検査方法 |
JP4202970B2 (ja) | 2004-06-10 | 2008-12-24 | 株式会社東芝 | 半導体装置及びその製造方法、半導体装置の欠陥検出方法 |
US7250311B2 (en) * | 2005-02-23 | 2007-07-31 | International Business Machines Corporation | Wirebond crack sensor for low-k die |
US7397103B2 (en) * | 2005-09-28 | 2008-07-08 | Agere Systems, Inc. | Semiconductor with damage detection circuitry |
JP2007165392A (ja) * | 2005-12-09 | 2007-06-28 | Toshiba Corp | 半導体装置 |
KR100750192B1 (ko) * | 2006-05-04 | 2007-08-17 | 삼성전자주식회사 | 크랙 검사 회로를 갖는 반도체 칩 및 이를 이용한 크랙검사 방법 |
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US20090057925A1 (en) | 2009-03-05 |
US8310066B2 (en) | 2012-11-13 |
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