JP2006202848A - 半導体装置とその製造方法 - Google Patents
半導体装置とその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000010410 layer Substances 0.000 claims abstract description 107
- 239000011229 interlayer Substances 0.000 claims abstract description 51
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 49
- 239000010937 tungsten Substances 0.000 claims abstract description 49
- 239000001257 hydrogen Substances 0.000 claims abstract description 46
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 46
- 239000003990 capacitor Substances 0.000 claims abstract description 44
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 18
- 229910010037 TiAlN Inorganic materials 0.000 claims description 7
- 150000002431 hydrogen Chemical class 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 238000006722 reduction reaction Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 230
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 35
- 238000000137 annealing Methods 0.000 description 19
- 230000004888 barrier function Effects 0.000 description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 17
- 239000010936 titanium Substances 0.000 description 17
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- 239000003963 antioxidant agent Substances 0.000 description 11
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- 239000013039 cover film Substances 0.000 description 10
- 238000002955 isolation Methods 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
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- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
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- 238000007254 oxidation reaction Methods 0.000 description 6
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
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- 238000006243 chemical reaction Methods 0.000 description 4
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- 238000002425 crystallisation Methods 0.000 description 3
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- 229910018182 Al—Cu Inorganic materials 0.000 description 2
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- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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Abstract
強誘電体キャパシタ上部にWプラグを採用することにより生じた上部電極コンタクト周辺の新たな問題を解決する。
【解決手段】
半導体装置は、半導体基板と、前記半導体基板に形成され、絶縁ゲートとその両側のソース/ドレインを有するMOSトランジスタと、前記半導体基板上方に形成され、下部電極、強誘電体層、上部電極を有する強誘電体キャパシタと、前記上部電極上に形成され、上部電極の厚さの1/2以下の厚さを有し、水素耐性のある金属膜と、前記強誘電体キャパシタと金属膜を埋め込む層間絶縁膜と、前記層間絶縁膜を貫通し、前記金属膜に達し、導電性グルー膜とタングステン体とを含む導電性プラグと、前記層間絶縁膜上に形成され、前記導電性プラグに接続されたアルミ配線と、を有する。
【選択図】 図8
Description
本発明の他の目的は、新規な構造を有する、強誘電体キャパシタを有する半導体装置とその製造方法を提供することである。
半導体基板と、
前記半導体基板に形成され、絶縁ゲートとその両側のソース/ドレインを有するMOSトランジスタと、
前記半導体基板上方に形成され、下部電極、強誘電体層、上部電極を有する強誘電体キャパシタと、
前記上部電極上に形成され、上部電極の厚さの1/2以下の厚さを有し、水素耐性のある金属膜と、
前記強誘電体キャパシタと金属膜を埋め込む層間絶縁膜と、
前記層間絶縁膜を貫通し、前記金属膜に達し、導電性グルー膜とタングステン体とを含む導電性プラグと、
前記層間絶縁膜上に形成され、前記導電性プラグに接続されたアルミ配線と、
を有する半導体装置が提供される。
(a)半導体基板にMOSトランジスタを形成する工程と、
(b)前記MOSトランジスタを埋め込んで、前記半導体基板上方に下部絶縁層を形成する工程と、
(c)前記下部絶縁層を貫通し、前記MOSトランジスタに接続された導電性プラグを形成する工程と、
(d)前記下部絶縁層上に、下部電極層、強誘電体層、上部電極層、前記上部電極層の厚さの1/2以下の厚さと、水素耐性とを有する金属膜の積層を形成する工程と、
(e)前記積層をパターニングして、下部電極、強誘電体膜、上部電極、金属膜を含む強誘電体キャパシタ構造を形成する工程と、
(f)前記強誘電体キャパシタ構造を埋め込む層間絶縁膜を形成する工程と、
(g)前記層間絶縁膜を貫通し、前記金属膜に達するタングステンプラグを形成する工程と、
(h)前記層間絶縁膜上に、前記タングステンプラグに接続されたアルミ配線を形成する工程と、
を含む半導体装置の製造方法が提供される。
図2Aに戻って、カバー膜9の上に厚さ1000nmのプラズマTEOS酸化シリコン膜30を堆積し、化学機械研磨(CMP)により厚さ700nmとなるまで研磨する。このようにして、第1層間絶縁膜が形成される。
図2Dに示すように、酸化防止膜50は、例えば、厚さ100nmの酸化窒化シリコン(SiON)膜51と厚さ130nmのプラズマCVDによるTEOS酸化シリコン膜52の積層で形成する。
図7Bに示すように、グルー膜230として、Ti膜231をスパッタリングで成膜し、その上にTiN膜232をCVDで成膜してもよい。TiN膜をCVDで成膜した時は、その後400℃以上のN2/H2プラズマアニールを行い、含有する炭素を除去する。上部電極120の上には水素遮蔽Pt膜200が形成されているので、水素雰囲気中のアニールを行なっても、酸化貴金属の上部電極120の還元は生じない。
2 素子分離領域(STI)
3 ウェル
4 ゲート絶縁膜
5 ゲート電極
6 エクステンション領域
7 サイドウォールスペーサ
8 ソース/ドレイン領域
9 カバー層
30 (第1の)層間絶縁膜
40 タングステンプラグ
41 グルー膜
41a Ti層
41b TiN層
42 W膜
50 酸化防止膜
51 SiON膜
52 TEOS酸化シリコン膜
55 酸化防止膜
60 アルミナ膜
70 アルミナ膜
80 (第2の)層間絶縁膜
90 (下部導電性プラグに対する)コンタクト孔
100 下部電極
110 強誘電体膜
120 上部電極
130 アルミニウム配線
140 下部バリアメタル層
141 Ti層
142 TiN層
150 アルミニウム主配線層
160 上部バリアメタル層
161 Ti層
162 TiN層
200 水素遮蔽金属膜(Pt膜)
210 (上部電極に対する)コンタクト孔
220 (下部電極に対する)コンタクト孔
230 グルー膜
231 Ti層
232 TiN層
240 W膜
250 タングステンプラグ
270 カバー膜
280 カバー膜
300 (第3の)層間絶縁膜
310 タングステンプラグ
Claims (10)
- 半導体基板と、
前記半導体基板に形成され、絶縁ゲートとその両側のソース/ドレインを有するMOSトランジスタと、
前記半導体基板上方に形成され、下部電極、強誘電体層、上部電極を有する強誘電体キャパシタと、
前記上部電極上に形成され、上部電極の厚さの1/2以下の厚さを有し、水素耐性のある金属膜と、
前記強誘電体キャパシタと金属膜を埋め込む層間絶縁膜と、
前記層間絶縁膜を貫通し、前記金属膜に達し、導電性グルー膜とタングステン体とを含む導電性プラグと、
前記層間絶縁膜上に形成され、前記導電性プラグに接続されたアルミ配線と、
を有する半導体装置。 - 前記金属膜は、Pt膜またはIr膜である請求項1記載の半導体装置。
- 前記導電性グルー膜がTiAlN層を含む請求項1または2記載の半導体装置。
- 前記下部電極と前記金属膜がPt膜である請求項1〜3のいずれか1項記載の半導体装置。
- 前記強誘電体層がPZT層であり、前記上部電極がIrOx層である請求項1〜4のいずれか1項記載の半導体装置。
- (a)半導体基板にMOSトランジスタを形成する工程と、
(b)前記MOSトランジスタを埋め込んで、前記半導体基板上方に下部絶縁層を形成する工程と、
(c)前記下部絶縁層を貫通し、前記MOSトランジスタに接続された導電性プラグを形成する工程と、
(d)前記下部絶縁層上に、下部電極層、強誘電体層、上部電極層、前記上部電極層の厚さの1/2以下の厚さと、水素耐性とを有する金属膜の積層を形成する工程と、
(e)前記積層をパターニングして、下部電極、強誘電体膜、上部電極、金属膜を含む強誘電体キャパシタ構造を形成する工程と、
(f)前記強誘電体キャパシタ構造を埋め込む層間絶縁膜を形成する工程と、
(g)前記層間絶縁膜を貫通し、前記金属膜に達するタングステンプラグを形成する工程と、
(h)前記層間絶縁膜上に、前記タングステンプラグに接続されたアルミ配線を形成する工程と、
を含む半導体装置の製造方法。 - 前記工程(g)が、
(g−1)前記層間絶縁膜を貫通するコンタクト孔を形成する工程と、
(g−2)前記コンタクト孔内面を覆う導電性グルー膜を形成する工程と、
(g−3)前記導電性グルー膜上に還元反応を利用してタングステン層を形成する工程と、
(g−4)前記層間絶縁膜上の不要の導電層を除去して、前記コンタクト孔にタングステンプラグを残す工程と、
を含む請求項6記載の半導体装置の製造方法。 - 前記工程(g−3)が水素を供給してタングステン層を成膜する本成長工程と、本成長工程に先立ち、水素供給量を抑制してタングステン層を成長する初期成長工程とを含む請求項7記載の半導体装置の製造方法。
- 前記工程(e)は、下部電極層と、強誘電体層と、上部電極層と金属膜の組合せと、を夫々別のマスクを用いてひな壇型にエッチングする請求項6〜8のいずれか1項記載の半導体装置の製造方法。
- 前記工程(g)が、前記下部電極に接続されたタングステンプラグも形成する請求項9記載の半導体装置の製造方法。
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KR1020050039667A KR100692466B1 (ko) | 2005-01-18 | 2005-05-12 | 반도체 장치와 그 제조 방법 |
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TWI270197B (en) | 2007-01-01 |
US20060157762A1 (en) | 2006-07-20 |
US7518173B2 (en) | 2009-04-14 |
KR100692466B1 (ko) | 2007-03-09 |
KR20060083839A (ko) | 2006-07-21 |
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