JP2006201809A5 - - Google Patents

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Publication number
JP2006201809A5
JP2006201809A5 JP2006103543A JP2006103543A JP2006201809A5 JP 2006201809 A5 JP2006201809 A5 JP 2006201809A5 JP 2006103543 A JP2006103543 A JP 2006103543A JP 2006103543 A JP2006103543 A JP 2006103543A JP 2006201809 A5 JP2006201809 A5 JP 2006201809A5
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JP
Japan
Prior art keywords
range
treatment solution
ppm
carbon atoms
surfactant
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JP2006103543A
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English (en)
Japanese (ja)
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JP4354964B2 (ja
JP2006201809A (ja
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Priority claimed from US10/218,087 external-priority patent/US20040029395A1/en
Priority claimed from US10/616,662 external-priority patent/US7129199B2/en
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Publication of JP2006201809A publication Critical patent/JP2006201809A/ja
Publication of JP2006201809A5 publication Critical patent/JP2006201809A5/ja
Application granted granted Critical
Publication of JP4354964B2 publication Critical patent/JP4354964B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006103543A 2002-08-12 2006-04-04 現像パターンのつぶれ回避方法及び半導体デバイス製造の際の欠陥低減方法 Expired - Fee Related JP4354964B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/218,087 US20040029395A1 (en) 2002-08-12 2002-08-12 Process solutions containing acetylenic diol surfactants
US10/339,709 US20040029396A1 (en) 2002-08-12 2003-01-09 Process solutions containing surfactants
US10/616,662 US7129199B2 (en) 2002-08-12 2003-07-10 Process solutions containing surfactants

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003292481A Division JP4272013B2 (ja) 2002-08-12 2003-08-12 半導体デバイス製造の際の欠陥低減方法及び処理溶液

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009122006A Division JP4843068B2 (ja) 2002-08-12 2009-05-20 半導体デバイス製造の際のパターンつぶれ欠陥数の低減方法

Publications (3)

Publication Number Publication Date
JP2006201809A JP2006201809A (ja) 2006-08-03
JP2006201809A5 true JP2006201809A5 (enExample) 2006-09-28
JP4354964B2 JP4354964B2 (ja) 2009-10-28

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ID=30773450

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003292481A Expired - Fee Related JP4272013B2 (ja) 2002-08-12 2003-08-12 半導体デバイス製造の際の欠陥低減方法及び処理溶液
JP2006103543A Expired - Fee Related JP4354964B2 (ja) 2002-08-12 2006-04-04 現像パターンのつぶれ回避方法及び半導体デバイス製造の際の欠陥低減方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2003292481A Expired - Fee Related JP4272013B2 (ja) 2002-08-12 2003-08-12 半導体デバイス製造の際の欠陥低減方法及び処理溶液

Country Status (5)

Country Link
US (4) US7129199B2 (enExample)
EP (1) EP1389746A3 (enExample)
JP (2) JP4272013B2 (enExample)
KR (1) KR20040030253A (enExample)
TW (1) TWI247799B (enExample)

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