JP2006106479A5 - - Google Patents
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- JP2006106479A5 JP2006106479A5 JP2004294980A JP2004294980A JP2006106479A5 JP 2006106479 A5 JP2006106479 A5 JP 2006106479A5 JP 2004294980 A JP2004294980 A JP 2004294980A JP 2004294980 A JP2004294980 A JP 2004294980A JP 2006106479 A5 JP2006106479 A5 JP 2006106479A5
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- optical device
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- chip
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- 230000003287 optical effect Effects 0.000 claims description 126
- 239000000758 substrate Substances 0.000 claims description 103
- 238000000034 method Methods 0.000 claims description 56
- 230000001681 protective effect Effects 0.000 claims description 46
- 238000007789 sealing Methods 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- 239000011265 semifinished product Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004294980A JP5128047B2 (ja) | 2004-10-07 | 2004-10-07 | 光デバイス及び光デバイスの生産方法 |
| TW094133496A TWI274657B (en) | 2004-10-07 | 2005-09-27 | Transparent member, optical device using transparent member and method of manufacturing optical device |
| US11/243,967 US20060078246A1 (en) | 2004-10-07 | 2005-10-06 | Transparent member, optical device using transparent member and method of manufacturing optical device |
| US11/480,377 US7682853B2 (en) | 2004-10-07 | 2006-07-05 | Transparent member, optical device using transparent member and method of manufacturing optical device |
| US12/163,669 US8222059B2 (en) | 2004-10-07 | 2008-06-27 | Method transparent member, optical device using transparent member and method of manufacturing optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004294980A JP5128047B2 (ja) | 2004-10-07 | 2004-10-07 | 光デバイス及び光デバイスの生産方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011115421A Division JP2011187979A (ja) | 2011-05-24 | 2011-05-24 | 保護用全体部材付の全体基板及びその製造方法 |
| JP2011115422A Division JP2011171765A (ja) | 2011-05-24 | 2011-05-24 | 光デバイス及び光デバイスの組立方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006106479A JP2006106479A (ja) | 2006-04-20 |
| JP2006106479A5 true JP2006106479A5 (enExample) | 2007-06-14 |
| JP5128047B2 JP5128047B2 (ja) | 2013-01-23 |
Family
ID=36145415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004294980A Expired - Lifetime JP5128047B2 (ja) | 2004-10-07 | 2004-10-07 | 光デバイス及び光デバイスの生産方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US20060078246A1 (enExample) |
| JP (1) | JP5128047B2 (enExample) |
| TW (1) | TWI274657B (enExample) |
Families Citing this family (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| US9070850B2 (en) * | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| JP4741383B2 (ja) * | 2006-02-17 | 2011-08-03 | 富士通セミコンダクター株式会社 | 電子部品の樹脂封止方法 |
| US20070216049A1 (en) * | 2006-03-20 | 2007-09-20 | Heptagon Oy | Method and tool for manufacturing optical elements |
| US20070216048A1 (en) * | 2006-03-20 | 2007-09-20 | Heptagon Oy | Manufacturing optical elements |
| US20070216046A1 (en) * | 2006-03-20 | 2007-09-20 | Heptagon Oy | Manufacturing miniature structured elements with tool incorporating spacer elements |
| US20070216047A1 (en) * | 2006-03-20 | 2007-09-20 | Heptagon Oy | Manufacturing an optical element |
| KR100789951B1 (ko) * | 2006-06-09 | 2008-01-03 | 엘지전자 주식회사 | 발광 유닛 제작 장치 및 방법 |
| US20100072640A1 (en) * | 2006-06-09 | 2010-03-25 | Heptagon Oy | Manufacturing a replication tool, sub-master or replica |
| DE102006039705A1 (de) * | 2006-08-18 | 2008-02-28 | Schott Ag | Linsenvorsatz für einen Scheinwerfer |
| JP2008205149A (ja) * | 2007-02-20 | 2008-09-04 | Towa Corp | 発光体の形成方法及び金型 |
| TWI351115B (en) * | 2007-05-18 | 2011-10-21 | Everlight Electronics Co Ltd | Light-emitting diode module and the manufacturing method thereof |
| JP2009047949A (ja) * | 2007-08-21 | 2009-03-05 | Alps Electric Co Ltd | 光学素子の製造方法 |
| JPWO2009028226A1 (ja) * | 2007-08-28 | 2010-11-25 | シャープ株式会社 | 光学部材の製造方法、光学部材製造用母材、転写型、表示装置用照明装置、表示装置、テレビ受信装置 |
| JP2009117536A (ja) * | 2007-11-05 | 2009-05-28 | Towa Corp | 樹脂封止発光体及びその製造方法 |
| US8384997B2 (en) * | 2008-01-21 | 2013-02-26 | Primesense Ltd | Optical pattern projection |
| CN101984767B (zh) * | 2008-01-21 | 2014-01-29 | 普莱姆森斯有限公司 | 用于使零级减少的光学设计 |
| DE102008014927A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement |
| US8461613B2 (en) * | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
| TWI384651B (zh) * | 2008-08-20 | 2013-02-01 | Au Optronics Corp | 發光二極體結構及其製造方法 |
| CN102401911B (zh) | 2008-10-31 | 2014-05-21 | 柯尼卡美能达精密光学株式会社 | 晶片透镜及其制造方法 |
| JP2010123620A (ja) * | 2008-11-17 | 2010-06-03 | Stanley Electric Co Ltd | 半導体装置の製造方法 |
| JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ｌｅｄランプの製造方法 |
| US9416926B2 (en) | 2009-04-28 | 2016-08-16 | Cree, Inc. | Lens with inner-cavity surface shaped for controlled light refraction |
| US10422503B2 (en) | 2009-10-30 | 2019-09-24 | Ideal Industries Lighting Llc | One-piece multi-lens optical member and method of manufacture |
| US10119662B2 (en) | 2009-04-28 | 2018-11-06 | Cree, Inc. | Lens with controlled light refraction |
| US9915409B2 (en) | 2015-02-19 | 2018-03-13 | Cree, Inc. | Lens with textured surface facilitating light diffusion |
| US8434883B2 (en) | 2009-05-11 | 2013-05-07 | SemiOptoelectronics Co., Ltd. | LLB bulb having light extracting rough surface pattern (LERSP) and method of fabrication |
| US20120086035A1 (en) * | 2009-05-11 | 2012-04-12 | SemiLEDs Optoelectronics Co., Ltd. | LED Device With A Light Extracting Rough Structure And Manufacturing Methods Thereof |
| US9028097B2 (en) | 2009-10-30 | 2015-05-12 | Cree, Inc. | LED apparatus and method for accurate lens alignment |
| US9404634B2 (en) | 2009-10-30 | 2016-08-02 | Cree, Inc. | LED light fixture with facilitated lensing alignment and method of manufacture |
| US8348461B2 (en) * | 2009-10-30 | 2013-01-08 | Ruud Lighting, Inc. | LED apparatus and method for accurate lens alignment |
| TW201116400A (en) * | 2009-11-09 | 2011-05-16 | Forward Electronics Co Ltd | Method for forming fluorescent glue layer of light emitting diode |
| JP5588310B2 (ja) * | 2009-11-15 | 2014-09-10 | プライムセンス リミテッド | ビームモニタ付き光学プロジェクタ |
| JP5512262B2 (ja) * | 2009-12-26 | 2014-06-04 | 株式会社朝日ラバー | レンズアレイシート及びそれのダイシング方法 |
| US20110187878A1 (en) * | 2010-02-02 | 2011-08-04 | Primesense Ltd. | Synchronization of projected illumination with rolling shutter of image sensor |
| US20110188054A1 (en) * | 2010-02-02 | 2011-08-04 | Primesense Ltd | Integrated photonics module for optical projection |
| WO2011102056A1 (ja) * | 2010-02-19 | 2011-08-25 | コニカミノルタオプト株式会社 | 撮像レンズユニット |
| US9036158B2 (en) | 2010-08-11 | 2015-05-19 | Apple Inc. | Pattern projector |
| US9098931B2 (en) | 2010-08-11 | 2015-08-04 | Apple Inc. | Scanning projectors and image capture modules for 3D mapping |
| EP2643659B1 (en) | 2010-11-19 | 2019-12-25 | Apple Inc. | Depth mapping using time-coded illumination |
| US9131136B2 (en) | 2010-12-06 | 2015-09-08 | Apple Inc. | Lens arrays for pattern projection and imaging |
| JP5562273B2 (ja) | 2011-03-02 | 2014-07-30 | Ｔｏｗａ株式会社 | 光電子部品の製造方法及び製造装置 |
| CN102694081B (zh) * | 2011-03-21 | 2014-11-05 | 展晶科技(深圳)有限公司 | 发光二极管制造方法 |
| DE202011000852U1 (de) * | 2011-04-12 | 2011-06-09 | Flextronics Automotive GmbH & Co.KG, 72636 | LED-Leuchte |
| JP5316911B2 (ja) * | 2011-06-24 | 2013-10-16 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
| US20130037931A1 (en) * | 2011-08-08 | 2013-02-14 | Leo M. Higgins, III | Semiconductor package with a heat spreader and method of making |
| US8749796B2 (en) | 2011-08-09 | 2014-06-10 | Primesense Ltd. | Projectors of structured light |
| US8908277B2 (en) | 2011-08-09 | 2014-12-09 | Apple Inc | Lens array projector |
| JP5658108B2 (ja) * | 2011-08-23 | 2015-01-21 | Ｔｏｗａ株式会社 | 反射体付基板の製造方法及び製造装置 |
| DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
| KR101284796B1 (ko) * | 2011-10-05 | 2013-07-10 | (주)포인트엔지니어링 | 캔 패지키 타입의 광 디바이스 제조 방법 및 이에 의해 제조된 광 디바이스 |
| CN103165763B (zh) * | 2011-12-14 | 2015-07-08 | 赛恩倍吉科技顾问（深圳）有限公司 | 发光二极管的制造方法 |
| CN104094424B (zh) * | 2012-02-10 | 2016-12-21 | 皇家飞利浦有限公司 | 形成芯片级led封装的模制透镜及其制造方法 |
| US9329080B2 (en) | 2012-02-15 | 2016-05-03 | Aplle Inc. | Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis |
| US9157790B2 (en) | 2012-02-15 | 2015-10-13 | Apple Inc. | Integrated optoelectronic modules with transmitter, receiver and beam-combining optics for aligning a beam axis with a collection axis |
| JP5867817B2 (ja) * | 2012-02-21 | 2016-02-24 | セイコーインスツル株式会社 | 光学デバイスの製造方法 |
| US9618185B2 (en) | 2012-03-08 | 2017-04-11 | Flextronics Ap, Llc | LED array for replacing flourescent tubes |
| CN104221059B (zh) | 2012-03-22 | 2017-05-10 | 苹果公司 | 基于衍射感测镜子位置 |
| US20140001496A1 (en) | 2012-06-27 | 2014-01-02 | Flextronics Ap, Llc | Relampable led structure |
| US9366394B2 (en) | 2012-06-27 | 2016-06-14 | Flextronics Ap, Llc | Automotive LED headlight cooling system |
| US20140003777A1 (en) * | 2012-07-02 | 2014-01-02 | Commscope, Inc. Of North Carolina | Light focusing structures for fiber optic communications systems and methods of fabricating the same using semiconductor processing and micro-machining techniques |
| JP6078846B2 (ja) * | 2012-11-06 | 2017-02-15 | アピックヤマダ株式会社 | Ｌｅｄ実装品の製造方法、ｌｅｄ実装品の樹脂モールド方法、およびｌｅｄ製造装置 |
| US9920901B2 (en) | 2013-03-15 | 2018-03-20 | Cree, Inc. | LED lensing arrangement |
| JP6182916B2 (ja) | 2013-03-15 | 2017-08-23 | 日亜化学工業株式会社 | 発光装置の封止部材の取り外し方法 |
| US10400984B2 (en) | 2013-03-15 | 2019-09-03 | Cree, Inc. | LED light fixture and unitary optic member therefor |
| WO2014203110A1 (en) | 2013-06-19 | 2014-12-24 | Primesense Ltd. | Integrated structured-light projector |
| CN104347785A (zh) * | 2013-08-07 | 2015-02-11 | 广州众恒光电科技有限公司 | 一种模具法荧光粉胶层涂覆工艺 |
| JP2013225713A (ja) * | 2013-08-08 | 2013-10-31 | Towa Corp | 光デバイスの生産方法 |
| US9395067B2 (en) | 2013-10-07 | 2016-07-19 | Flextronics Ap, Llc | Method of and apparatus for enhanced thermal isolation of low-profile LED lighting fixtures |
| WO2015063370A1 (en) * | 2013-11-04 | 2015-05-07 | Ledil Oy | Light guide with grooves for dividing by bending |
| US9528906B1 (en) | 2013-12-19 | 2016-12-27 | Apple Inc. | Monitoring DOE performance using total internal reflection |
| CN111063787A (zh) * | 2014-01-23 | 2020-04-24 | 亮锐控股有限公司 | 具有自对准预制透镜的发光设备 |
| JP6338409B2 (ja) * | 2014-03-14 | 2018-06-06 | アルパッド株式会社 | 発光装置及びその製造方法 |
| KR101572495B1 (ko) * | 2014-08-20 | 2015-12-02 | 주식회사 루멘스 | 발광 소자 패키지의 제조 방법과, 발광 소자 패키지용 정렬 지그와, 발광 소자 패키지용 리드 프레임 스트립 및 발광 소자 패키지용 렌즈 스트립 |
| US9757912B2 (en) | 2014-08-27 | 2017-09-12 | Cree, Inc. | One-piece multi-lens optical member with ultraviolet inhibitor and method of manufacture |
| US10207440B2 (en) | 2014-10-07 | 2019-02-19 | Cree, Inc. | Apparatus and method for formation of multi-region articles |
| DE102014115622A1 (de) * | 2014-10-28 | 2016-05-12 | Osram Opto Semiconductors Gmbh | Herstellung eines Leuchtmoduls für eine Hinterleuchtungsvorrichtung |
| US9470394B2 (en) | 2014-11-24 | 2016-10-18 | Cree, Inc. | LED light fixture including optical member with in-situ-formed gasket and method of manufacture |
| KR102322336B1 (ko) * | 2015-02-06 | 2021-11-05 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
| EP3096167A1 (en) * | 2015-05-18 | 2016-11-23 | OSRAM GmbH | A method of producing lighting devices and optical component for use therein |
| US10012831B2 (en) | 2015-08-03 | 2018-07-03 | Apple Inc. | Optical monitoring of scan parameters |
| US20170075205A1 (en) * | 2015-09-13 | 2017-03-16 | Apple Inc. | Integrated light pipe for optical projection |
| KR102396332B1 (ko) | 2015-09-22 | 2022-05-12 | 삼성전자주식회사 | Led 디스플레이용 미세간격 코팅부재 및 이를 이용한 코팅방법 |
| US10073004B2 (en) | 2016-09-19 | 2018-09-11 | Apple Inc. | DOE defect monitoring utilizing total internal reflection |
| US20180182939A1 (en) * | 2016-12-22 | 2018-06-28 | Rayvio Corporation | Package for an ultraviolet emitting device |
| US20180323354A1 (en) * | 2017-05-07 | 2018-11-08 | Yang Wang | Light emitting device and method for manufacturing light emitting device |
| US10153614B1 (en) | 2017-08-31 | 2018-12-11 | Apple Inc. | Creating arbitrary patterns on a 2-D uniform grid VCSEL array |
| KR102334936B1 (ko) * | 2017-11-08 | 2021-12-02 | 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 | 자외선 led 패키징 구조 |
| WO2019151826A1 (ko) * | 2018-02-05 | 2019-08-08 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 발광장치 |
| US11422292B1 (en) | 2018-06-10 | 2022-08-23 | Apple Inc. | Super-blazed diffractive optical elements with sub-wavelength structures |
| TW202002335A (zh) * | 2018-06-12 | 2020-01-01 | 同欣電子工業股份有限公司 | 光學裝置及其製造方法 |
| US10667341B1 (en) | 2018-09-16 | 2020-05-26 | Apple Inc. | Light projector with integrated integrity sensor |
| CN109216532B (zh) * | 2018-11-01 | 2023-09-12 | 上海悦威电子设备有限公司 | 一种紫外led石英透镜装配结构及方法 |
| US11681019B2 (en) | 2019-09-18 | 2023-06-20 | Apple Inc. | Optical module with stray light baffle |
| US11506762B1 (en) | 2019-09-24 | 2022-11-22 | Apple Inc. | Optical module comprising an optical waveguide with reference light path |
| US11754767B1 (en) | 2020-03-05 | 2023-09-12 | Apple Inc. | Display with overlaid waveguide |
| US12125953B2 (en) | 2020-11-30 | 2024-10-22 | Nichia Corporation | Method for manufacturing light emitting device, light emitting device, and light emitting module |
| WO2022197339A1 (en) | 2021-03-17 | 2022-09-22 | Apple Inc. | Waveguide-based transmitters with adjustable lighting |
| CN117529689A (zh) * | 2021-07-28 | 2024-02-06 | 奥林巴斯株式会社 | 透镜单元的制造方法、透镜单元、摄像装置以及内窥镜 |
| KR102704303B1 (ko) * | 2021-12-07 | 2024-09-09 | 주식회사 네패스라웨 | 대면적 패널 구조체의 제조 장치 및 이를 이용한 대면적 패널 구조체의 제조 방법 |
Family Cites Families (84)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2796634A (en) | 1953-12-21 | 1957-06-25 | Ibm | Reverse forming process for making shaped articles from plastic sheet material |
| JPS611067A (ja) | 1984-06-13 | 1986-01-07 | Stanley Electric Co Ltd | プリント基板に装着されたｌｅｄチツプのモ−ルド方法 |
| US5238640A (en) | 1984-12-10 | 1993-08-24 | Sumitomo Chemical Co., Limited | Method of manufacturing a laminated body |
| US4944908A (en) | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
| US5169677A (en) | 1989-10-27 | 1992-12-08 | Brother Kogyo Kabushiki Kaisha | Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus |
| US5147821A (en) | 1990-09-28 | 1992-09-15 | Motorola, Inc. | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
| JPH04348088A (ja) | 1991-05-24 | 1992-12-03 | Nec Corp | 光電変換装置 |
| JP2912988B2 (ja) | 1992-06-23 | 1999-06-28 | アルプス電気株式会社 | 真空成形金型 |
| JP3575812B2 (ja) | 1992-07-31 | 2004-10-13 | 住友化学工業株式会社 | 多層成形品およびその製造方法 |
| JP2968896B2 (ja) | 1993-02-16 | 1999-11-02 | 高島屋日発工業株式会社 | 表皮一体積層体の製造法およびこれに用いる金型装置 |
| WO1995018708A1 (en) | 1994-01-06 | 1995-07-13 | Otsuka Kagaku Kabushiki Kaisha | Resin composition for a mold, mold and molding method using the same mold |
| KR100437437B1 (ko) * | 1994-03-18 | 2004-06-25 | 히다치 가세고교 가부시끼가이샤 | 반도체 패키지의 제조법 및 반도체 패키지 |
| JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
| US5744087A (en) | 1994-09-26 | 1998-04-28 | Becton, Dickinson And Company | Medical articles and method therefor |
| US5846477A (en) | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| US5795529A (en) | 1995-05-31 | 1998-08-18 | Acushnet Company | Fast thermal response mold |
| JPH09123206A (ja) | 1995-10-30 | 1997-05-13 | Towa Kk | 電子部品の樹脂封止成形装置 |
| US5876765A (en) | 1995-11-09 | 1999-03-02 | Micron Technology, Inc. | Injection molding equipment for encapsulating semiconductor die and the like |
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| US5776514A (en) | 1996-09-20 | 1998-07-07 | Johnson & Johnson Vision Products, Inc. | On-demand fast cycle mold |
| JP3282988B2 (ja) | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
| JP3017470B2 (ja) | 1997-07-11 | 2000-03-06 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
| EP0971401B1 (en) | 1998-07-10 | 2010-06-09 | Apic Yamada Corporation | Method of manufacturing semiconductor devices and a resin molding machine therefor |
| JP3680005B2 (ja) * | 1998-07-10 | 2005-08-10 | アピックヤマダ株式会社 | 半導体装置の製造方法及び樹脂封止装置 |
| JP3494586B2 (ja) | 1999-03-26 | 2004-02-09 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP4416218B2 (ja) | 1999-09-14 | 2010-02-17 | アピックヤマダ株式会社 | 樹脂封止方法及び樹脂封止装置 |
| JP2001168117A (ja) | 1999-12-06 | 2001-06-22 | Idemitsu Petrochem Co Ltd | 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法 |
| JP2001176902A (ja) | 1999-12-16 | 2001-06-29 | Apic Yamada Corp | 樹脂封止方法 |
| JP3581814B2 (ja) | 2000-01-19 | 2004-10-27 | Ｔｏｗａ株式会社 | 樹脂封止方法及び樹脂封止装置 |
| JP2001223285A (ja) * | 2000-02-09 | 2001-08-17 | Rohm Co Ltd | チップ型半導体装置及びその製造方法 |
| JP3956335B2 (ja) | 2000-03-06 | 2007-08-08 | シャープ株式会社 | 樹脂注型用金型を用いた半導体装置の製造方法 |
| US20020014693A1 (en) | 2000-03-21 | 2002-02-07 | Pollock Jeffrey James | Molded array package for facilitating device singulation |
| EP1204151A4 (en) * | 2000-04-24 | 2006-10-18 | Rohm Co Ltd | SIDE-EMITTING LUMINAIRE DIODE AND MANUFACTURING METHOD |
| US20030039717A1 (en) | 2000-05-01 | 2003-02-27 | Hwang C. Robin | Injection molding of thermoplastic parts |
| JP4230679B2 (ja) | 2000-06-26 | 2009-02-25 | 株式会社東芝 | 半導体樹脂モールド装置および半導体樹脂モールド方法 |
| JP4484329B2 (ja) | 2000-07-21 | 2010-06-16 | アピックヤマダ株式会社 | 樹脂封止方法及び樹脂封止装置 |
| US6439869B1 (en) | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Apparatus for molding semiconductor components |
| US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| JP2002166448A (ja) | 2000-12-01 | 2002-06-11 | Sony Corp | 成形用金型装置および成形方法 |
| AUPR245601A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM09) |
| US6734571B2 (en) | 2001-01-23 | 2004-05-11 | Micron Technology, Inc. | Semiconductor assembly encapsulation mold |
| DE10107743A1 (de) | 2001-02-16 | 2002-09-05 | Webasto Vehicle Sys Int Gmbh | Vorrichtung zum Umschäumen einer transparenten Scheibe für ein Fahrzeugdach |
| JP2002314100A (ja) * | 2001-04-19 | 2002-10-25 | Yazaki Corp | 樹脂封止型半導体装置の製造方法 |
| JP2002319711A (ja) * | 2001-04-20 | 2002-10-31 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| US6949771B2 (en) * | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
| US6989412B2 (en) | 2001-06-06 | 2006-01-24 | Henkel Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
| JP4789350B2 (ja) * | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
| JP3844196B2 (ja) * | 2001-06-12 | 2006-11-08 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
| TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
| EP1416219B1 (en) * | 2001-08-09 | 2016-06-22 | Everlight Electronics Co., Ltd | Led illuminator and card type led illuminating light source |
| US6531328B1 (en) * | 2001-10-11 | 2003-03-11 | Solidlite Corporation | Packaging of light-emitting diode |
| JP2003163382A (ja) | 2001-11-29 | 2003-06-06 | Matsushita Electric Ind Co Ltd | 受光素子または発光素子用パッケージ |
| JP2003244077A (ja) * | 2002-02-18 | 2003-08-29 | Sharp Corp | リモコン送信機能付き赤外線通信用モジュール |
| ATE401184T1 (de) | 2002-03-25 | 2008-08-15 | Awm Mold Tech Ag | Spritzgusswerkzeug für die herstellung von scheibenförmigen informationsträgern |
| JP3709175B2 (ja) | 2002-05-02 | 2005-10-19 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法 |
| TW546799B (en) * | 2002-06-26 | 2003-08-11 | Lingsen Precision Ind Ltd | Packaged formation method of LED and product structure |
| JP2004088713A (ja) * | 2002-06-27 | 2004-03-18 | Olympus Corp | 撮像レンズユニットおよび撮像装置 |
| JP4174263B2 (ja) | 2002-08-12 | 2008-10-29 | アピックヤマダ株式会社 | 樹脂モールド方法 |
| US6599768B1 (en) | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
| JP4268389B2 (ja) | 2002-09-06 | 2009-05-27 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| CN100440544C (zh) * | 2002-09-17 | 2008-12-03 | 安特约恩股份有限公司 | 照相装置、制造照相装置的方法以及晶片尺度的封装 |
| JP2004134672A (ja) * | 2002-10-11 | 2004-04-30 | Sony Corp | 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置 |
| JP4262468B2 (ja) | 2002-10-30 | 2009-05-13 | アピックヤマダ株式会社 | 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具 |
| TW200414572A (en) * | 2002-11-07 | 2004-08-01 | Matsushita Electric Industrial Co Ltd | LED lamp |
| CN100352069C (zh) * | 2002-11-25 | 2007-11-28 | 松下电器产业株式会社 | Led照明光源 |
| JP4519398B2 (ja) | 2002-11-26 | 2010-08-04 | Ｔｏｗａ株式会社 | 樹脂封止方法及び半導体装置の製造方法 |
| JP4052939B2 (ja) | 2002-12-17 | 2008-02-27 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP4336499B2 (ja) | 2003-01-09 | 2009-09-30 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP2004233482A (ja) * | 2003-01-29 | 2004-08-19 | Sanyo Electric Co Ltd | カメラモジュールの製造方法 |
| US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
| US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
| JP4731102B2 (ja) | 2003-05-09 | 2011-07-20 | Ｔｏｗａ株式会社 | 樹脂封止用型及び樹脂封止方法 |
| JP4106003B2 (ja) * | 2003-09-03 | 2008-06-25 | 松下電器産業株式会社 | 固体撮像装置の製造方法 |
| JP2005112499A (ja) * | 2003-10-03 | 2005-04-28 | Hitachi Ltd | 物品残量在庫管理発注システムおよびそれを用いた物品受発注管理システム |
| KR100586944B1 (ko) * | 2003-12-26 | 2006-06-07 | 삼성전기주식회사 | 고출력 발광다이오드 패키지 및 제조방법 |
| JP4373237B2 (ja) | 2004-02-13 | 2009-11-25 | Ｔｏｗａ株式会社 | 半導体チップの樹脂封止成形方法および樹脂封止成形用金型 |
| WO2005104247A1 (ja) * | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源 |
| JP5004410B2 (ja) | 2004-04-26 | 2012-08-22 | Ｔｏｗａ株式会社 | 光素子の樹脂封止成形方法および樹脂封止成形装置 |
| WO2005106978A1 (ja) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Industrial Co., Ltd. | 発光装置およびその製造方法 |
| KR100576866B1 (ko) * | 2004-06-16 | 2006-05-10 | 삼성전기주식회사 | 발광다이오드 및 그 제조방법 |
| US6881980B1 (en) * | 2004-06-17 | 2005-04-19 | Chunghwa Picture Tubes, Ltd. | Package structure of light emitting diode |
| US7473933B2 (en) * | 2004-10-29 | 2009-01-06 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
| US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
| US7985357B2 (en) | 2005-07-12 | 2011-07-26 | Towa Corporation | Method of resin-sealing and molding an optical device |
-
2004
- 2004-10-07 JP JP2004294980A patent/JP5128047B2/ja not_active Expired - Lifetime
-
2005
- 2005-09-27 TW TW094133496A patent/TWI274657B/zh not_active IP Right Cessation
- 2005-10-06 US US11/243,967 patent/US20060078246A1/en not_active Abandoned
-
2006
- 2006-07-05 US US11/480,377 patent/US7682853B2/en not_active Expired - Fee Related
-
2008
- 2008-06-27 US US12/163,669 patent/US8222059B2/en not_active Expired - Lifetime
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