JP2004537165A - アミノフェニルフルオレンで硬化したエポキシ誘電体層を有するコンデンサ - Google Patents

アミノフェニルフルオレンで硬化したエポキシ誘電体層を有するコンデンサ Download PDF

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Publication number
JP2004537165A
JP2004537165A JP2003512995A JP2003512995A JP2004537165A JP 2004537165 A JP2004537165 A JP 2004537165A JP 2003512995 A JP2003512995 A JP 2003512995A JP 2003512995 A JP2003512995 A JP 2003512995A JP 2004537165 A JP2004537165 A JP 2004537165A
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JP
Japan
Prior art keywords
epoxy resin
dielectric layer
resin composition
capacitor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003512995A
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English (en)
Japanese (ja)
Other versions
JP2004537165A5 (enExample
Inventor
ビー．ジュニア オブライエン，ネルソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2004537165A publication Critical patent/JP2004537165A/ja
Publication of JP2004537165A5 publication Critical patent/JP2004537165A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2003512995A 2001-07-10 2002-06-06 アミノフェニルフルオレンで硬化したエポキシ誘電体層を有するコンデンサ Withdrawn JP2004537165A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/902,302 US6577492B2 (en) 2001-07-10 2001-07-10 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
PCT/US2002/017897 WO2003007319A2 (en) 2001-07-10 2002-06-06 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009176651A Division JP5016005B2 (ja) 2001-07-10 2009-07-29 アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ

Publications (2)

Publication Number Publication Date
JP2004537165A true JP2004537165A (ja) 2004-12-09
JP2004537165A5 JP2004537165A5 (enExample) 2006-01-05

Family

ID=25415643

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003512995A Withdrawn JP2004537165A (ja) 2001-07-10 2002-06-06 アミノフェニルフルオレンで硬化したエポキシ誘電体層を有するコンデンサ
JP2009176651A Expired - Lifetime JP5016005B2 (ja) 2001-07-10 2009-07-29 アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009176651A Expired - Lifetime JP5016005B2 (ja) 2001-07-10 2009-07-29 アミノフェニルフルオレンで硬化したエポキシ誘導体層を有するコンデンサ

Country Status (10)

Country Link
US (1) US6577492B2 (enExample)
EP (1) EP1407463B1 (enExample)
JP (2) JP2004537165A (enExample)
KR (1) KR100898091B1 (enExample)
AT (1) ATE355598T1 (enExample)
AU (1) AU2002314943A1 (enExample)
CA (1) CA2453107A1 (enExample)
DE (1) DE60218475T2 (enExample)
MY (1) MY122881A (enExample)
WO (1) WO2003007319A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254942A (ja) * 2009-04-23 2010-11-11 Samsung Electro-Mechanics Co Ltd プリント基板樹脂組成物及びこれを用いたプリント基板
WO2014168108A1 (ja) * 2013-04-10 2014-10-16 大阪ガスケミカル株式会社 フルオレン化合物を含む樹脂組成物および成形体並びに波長分散調整剤および樹脂の波長分散調整方法
TWI659943B (zh) * 2014-12-02 2019-05-21 美商塞特工業公司 改質胺固化劑、其製備方法及其於可固化組合物中的用途

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US7025607B1 (en) 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7541265B2 (en) * 2005-01-10 2009-06-02 Endicott Interconnect Technologies, Inc. Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
JP5261896B2 (ja) * 2006-07-27 2013-08-14 ダイキン工業株式会社 コーティング組成物
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
WO2010048297A2 (en) * 2008-10-24 2010-04-29 3M Innovative Properties Company Passive electrical article
JP5732045B2 (ja) 2009-05-01 2015-06-10 スリーエム イノベイティブ プロパティズ カンパニー 受動電気物品
KR101770007B1 (ko) * 2009-11-06 2017-08-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 비할로겐화된 경화제를 갖는 유전체 재료
US9455088B2 (en) 2011-12-21 2016-09-27 3M Innovative Properties Company Resin composition and dielectric layer and capacitor produced therefrom
JP6278650B2 (ja) * 2013-09-27 2018-02-14 京セラ株式会社 サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
FR3033941B1 (fr) * 2015-03-18 2017-04-21 Commissariat Energie Atomique Cellule de test d'appareillage de caracterisation de cellule de pile a combustible et procede de fabrication d'une telle cellule de test
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3790869A (en) * 1971-11-10 1974-02-05 Omron Tateisi Electronics Co Humidity sensitive semiconductor device
DE2834906C2 (de) 1978-08-09 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Elektrische Hochfrequenz-Folienschaltung und Verfahren zu ihrer Herstellung
JPS5844789A (ja) 1981-09-10 1983-03-15 株式会社アサヒ化学研究所 プリント配線板に誘電体を形成する方法
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
CA1264476A (en) * 1985-05-30 1990-01-16 William J. Schultz Epoxy resin curing agent, process, and composition
JPS62163387A (ja) 1986-01-14 1987-07-20 株式会社　アサヒ化学研究所 基板に蓄電回路を形成する方法
JPH0791365B2 (ja) * 1987-03-06 1995-10-04 新日鐵化学株式会社 エポキシ樹脂組成物
SE458004C (sv) 1987-10-09 1991-10-07 Carmis Enterprises Sa Anordning foer elektrisk avkoppling av integrerade kretsar
JPH01100998A (ja) 1987-10-14 1989-04-19 Seiko Epson Corp 多層配線基板
JP2621342B2 (ja) 1988-05-20 1997-06-18 日本電気株式会社 多層配線基板
JPH0241312A (ja) 1988-07-29 1990-02-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物
JPH0265194A (ja) 1988-08-30 1990-03-05 Ibiden Co Ltd 厚膜素子を有するプリント配線板の製造方法
US5010641A (en) 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5079069A (en) 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH03136396A (ja) 1989-10-23 1991-06-11 Matsushita Electric Ind Co Ltd 電子回路部品とその製造方法及び電子回路装置
US5051275A (en) * 1989-11-09 1991-09-24 At&T Bell Laboratories Silicone resin electronic device encapsulant
US5027253A (en) 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
JP3019541B2 (ja) 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
US5183972A (en) 1991-02-04 1993-02-02 Microelectronics And Computer Technology Corporation Copper/epoxy structures
JPH04361565A (ja) 1991-06-10 1992-12-15 Fujitsu Ltd 半導体装置の製造方法
US5162977A (en) 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
US5161083A (en) 1991-09-09 1992-11-03 Lucas Ledex Inc. Solenoid actuator with position feedback system
US5261153A (en) 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
JPH0637256A (ja) 1992-07-15 1994-02-10 Fuji Electric Co Ltd 半導体装置の製造方法
JPH0690086A (ja) 1992-08-31 1994-03-29 Teijin Ltd 電子部品の接続方法
JPH06104578A (ja) 1992-09-22 1994-04-15 Ngk Spark Plug Co Ltd 多層配線基板及びその製造方法
JPH06125180A (ja) 1992-10-09 1994-05-06 Ngk Spark Plug Co Ltd キャパシタ内蔵多層配線基板
JP2901451B2 (ja) 1993-02-26 1999-06-07 京セラ株式会社 ジョセフソン素子搭載用回路基板
US5571970A (en) * 1993-03-30 1996-11-05 Honda Motor Co., Ltd. Pressure sensor
JPH06297634A (ja) 1993-04-19 1994-10-25 Toshiba Chem Corp 銅張積層板及び多層銅張積層板
JPH06318597A (ja) 1993-05-07 1994-11-15 Nec Kyushu Ltd 半導体装置
JPH0730257A (ja) 1993-07-13 1995-01-31 Fujitsu Ltd コンデンサ内蔵薄膜多層配線板
JP3154594B2 (ja) 1993-07-13 2001-04-09 日本特殊陶業株式会社 キャパシタ内蔵多層配線基板とその製造方法
JP3821870B2 (ja) * 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
US5469324A (en) 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
US5701032A (en) 1994-10-17 1997-12-23 W. L. Gore & Associates, Inc. Integrated circuit package
JPH08148321A (ja) 1994-11-21 1996-06-07 Minnesota Mining & Mfg Co <3M> 磁性組成物および樹脂結合型磁石
JPH08198952A (ja) 1995-01-19 1996-08-06 Hodogaya Chem Co Ltd 可撓性を有するエポキシ樹脂組成物
US5796587A (en) 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same
US5745335A (en) 1996-06-27 1998-04-28 Gennum Corporation Multi-layer film capacitor structures and method
EP0902048B1 (en) 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254942A (ja) * 2009-04-23 2010-11-11 Samsung Electro-Mechanics Co Ltd プリント基板樹脂組成物及びこれを用いたプリント基板
WO2014168108A1 (ja) * 2013-04-10 2014-10-16 大阪ガスケミカル株式会社 フルオレン化合物を含む樹脂組成物および成形体並びに波長分散調整剤および樹脂の波長分散調整方法
TWI659943B (zh) * 2014-12-02 2019-05-21 美商塞特工業公司 改質胺固化劑、其製備方法及其於可固化組合物中的用途

Also Published As

Publication number Publication date
KR20040030801A (ko) 2004-04-09
CA2453107A1 (en) 2003-01-23
US6577492B2 (en) 2003-06-10
JP5016005B2 (ja) 2012-09-05
HK1065162A1 (en) 2005-02-08
EP1407463A2 (en) 2004-04-14
WO2003007319A3 (en) 2003-04-24
AU2002314943A1 (en) 2003-01-29
DE60218475T2 (de) 2007-11-29
JP2010004055A (ja) 2010-01-07
ATE355598T1 (de) 2006-03-15
WO2003007319A2 (en) 2003-01-23
KR100898091B1 (ko) 2009-05-18
MY122881A (en) 2006-05-31
US20030030966A1 (en) 2003-02-13
EP1407463B1 (en) 2007-02-28
DE60218475D1 (de) 2007-04-12

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