DE60218475D1 - Elektrischer gegenstand mit dielektrischer epoxyschicht, die mit aminophenylfluorenen gehärtet ist - Google Patents

Elektrischer gegenstand mit dielektrischer epoxyschicht, die mit aminophenylfluorenen gehärtet ist

Info

Publication number
DE60218475D1
DE60218475D1 DE60218475T DE60218475T DE60218475D1 DE 60218475 D1 DE60218475 D1 DE 60218475D1 DE 60218475 T DE60218475 T DE 60218475T DE 60218475 T DE60218475 T DE 60218475T DE 60218475 D1 DE60218475 D1 DE 60218475D1
Authority
DE
Germany
Prior art keywords
fluorese
phenyl
amino
epoxy layer
layer hardened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60218475T
Other languages
English (en)
Other versions
DE60218475T2 (de
Inventor
Nelson B O'bryan Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE60218475D1 publication Critical patent/DE60218475D1/de
Application granted granted Critical
Publication of DE60218475T2 publication Critical patent/DE60218475T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Epoxy Resins (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60218475T 2001-07-10 2002-06-06 Elektrischer gegenstand mit dielektrischer epoxyschicht, die mit aminophenylfluorenen gehärtet ist Expired - Lifetime DE60218475T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US902302 1992-06-22
US09/902,302 US6577492B2 (en) 2001-07-10 2001-07-10 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
PCT/US2002/017897 WO2003007319A2 (en) 2001-07-10 2002-06-06 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes

Publications (2)

Publication Number Publication Date
DE60218475D1 true DE60218475D1 (de) 2007-04-12
DE60218475T2 DE60218475T2 (de) 2007-11-29

Family

ID=25415643

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60218475T Expired - Lifetime DE60218475T2 (de) 2001-07-10 2002-06-06 Elektrischer gegenstand mit dielektrischer epoxyschicht, die mit aminophenylfluorenen gehärtet ist

Country Status (11)

Country Link
US (1) US6577492B2 (de)
EP (1) EP1407463B1 (de)
JP (2) JP2004537165A (de)
KR (1) KR100898091B1 (de)
AT (1) ATE355598T1 (de)
AU (1) AU2002314943A1 (de)
CA (1) CA2453107A1 (de)
DE (1) DE60218475T2 (de)
HK (1) HK1065162A1 (de)
MY (1) MY122881A (de)
WO (1) WO2003007319A2 (de)

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US7025607B1 (en) 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7541265B2 (en) * 2005-01-10 2009-06-02 Endicott Interconnect Technologies, Inc. Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
EP1996860A2 (de) * 2006-01-31 2008-12-03 3M Innovative Properties Company Led-beleuchtungsbaugruppe mit entsprechender folienkonstruktion
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
JP5261896B2 (ja) * 2006-07-27 2013-08-14 ダイキン工業株式会社 コーティング組成物
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
US20100105806A1 (en) * 2008-10-24 2010-04-29 3M Innovative Properties Company Passive electrical article
KR101095136B1 (ko) * 2009-04-23 2011-12-16 삼성전기주식회사 인쇄회로기판용 수지 조성물 및 이를 이용한 인쇄회로기판
SG175763A1 (en) 2009-05-01 2011-12-29 3M Innovative Properties Co Passive electrical article
US9247645B2 (en) * 2009-11-06 2016-01-26 3M Innovative Properties Company Dielectric material with non-halogenated curing agent
WO2013091197A1 (en) * 2011-12-21 2013-06-27 3M Innovative Properties Company Resin composition and dielectric layer and capacitor produced therefrom
CN105308122A (zh) * 2013-04-10 2016-02-03 大阪燃气化学有限公司 包含芴化合物的树脂组合物和成形体、以及波长色散调节剂和树脂的波长色散调节方法
JP6278650B2 (ja) * 2013-09-27 2018-02-14 京セラ株式会社 サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ
GB201421373D0 (en) 2014-12-02 2015-01-14 Cytec Ind Inc Modified amine curing agents, their preparation and use in curable compositions
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
FR3033941B1 (fr) * 2015-03-18 2017-04-21 Commissariat Energie Atomique Cellule de test d'appareillage de caracterisation de cellule de pile a combustible et procede de fabrication d'une telle cellule de test
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法

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Also Published As

Publication number Publication date
EP1407463A2 (de) 2004-04-14
KR100898091B1 (ko) 2009-05-18
US20030030966A1 (en) 2003-02-13
JP5016005B2 (ja) 2012-09-05
DE60218475T2 (de) 2007-11-29
CA2453107A1 (en) 2003-01-23
EP1407463B1 (de) 2007-02-28
HK1065162A1 (en) 2005-02-08
ATE355598T1 (de) 2006-03-15
MY122881A (en) 2006-05-31
JP2004537165A (ja) 2004-12-09
JP2010004055A (ja) 2010-01-07
KR20040030801A (ko) 2004-04-09
WO2003007319A3 (en) 2003-04-24
AU2002314943A1 (en) 2003-01-29
WO2003007319A2 (en) 2003-01-23
US6577492B2 (en) 2003-06-10

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Legal Events

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