DE60200455D1 - Thermisch aushärtbare Harzverbindung und Halbleitervorrichtung, die dieselbe verwendet - Google Patents

Thermisch aushärtbare Harzverbindung und Halbleitervorrichtung, die dieselbe verwendet

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Publication number
DE60200455D1
DE60200455D1 DE60200455T DE60200455T DE60200455D1 DE 60200455 D1 DE60200455 D1 DE 60200455D1 DE 60200455 T DE60200455 T DE 60200455T DE 60200455 T DE60200455 T DE 60200455T DE 60200455 D1 DE60200455 D1 DE 60200455D1
Authority
DE
Germany
Prior art keywords
same
semiconductor device
thermosetting resin
resin compound
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60200455T
Other languages
English (en)
Other versions
DE60200455T2 (de
Inventor
Hiroshi Noro
Mitsuaki Fusumada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001037728A external-priority patent/JP2002241469A/ja
Priority claimed from JP2001037726A external-priority patent/JP4721309B2/ja
Priority claimed from JP2001037725A external-priority patent/JP4753329B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE60200455D1 publication Critical patent/DE60200455D1/de
Application granted granted Critical
Publication of DE60200455T2 publication Critical patent/DE60200455T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE2002600455 2001-02-14 2002-02-14 Thermisch aushärtbare Harzverbindung und Halbleitervorrichtung, die dieselbe verwendet Expired - Fee Related DE60200455T2 (de)

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JP2001037728A JP2002241469A (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001037728 2001-02-14
JP2001037726 2001-02-14
JP2001037726A JP4721309B2 (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001037725 2001-02-14
JP2001037725A JP4753329B2 (ja) 2001-02-14 2001-02-14 熱硬化性樹脂組成物および半導体装置
JP2001301054 2001-09-28
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KR20020067436A (ko) 2002-08-22
CN1239607C (zh) 2006-02-01
EP1233446A2 (de) 2002-08-21
US20020151106A1 (en) 2002-10-17
SG111042A1 (en) 2005-05-30
KR100592204B1 (ko) 2006-06-23
US6617046B2 (en) 2003-09-09
EP1233446B1 (de) 2004-05-12
TW574739B (en) 2004-02-01
DE60200455T2 (de) 2005-05-12
EP1233446A3 (de) 2003-02-05
MY122912A (en) 2006-05-31

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