DE60232480D1 - Hochspannungs-Halbleiterbauelement - Google Patents

Hochspannungs-Halbleiterbauelement

Info

Publication number
DE60232480D1
DE60232480D1 DE60232480T DE60232480T DE60232480D1 DE 60232480 D1 DE60232480 D1 DE 60232480D1 DE 60232480 T DE60232480 T DE 60232480T DE 60232480 T DE60232480 T DE 60232480T DE 60232480 D1 DE60232480 D1 DE 60232480D1
Authority
DE
Germany
Prior art keywords
semiconductor device
voltage semiconductor
voltage
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232480T
Other languages
English (en)
Inventor
Masaaki Noda
Teruhisa Ikuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60232480D1 publication Critical patent/DE60232480D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE60232480T 2001-06-04 2002-06-04 Hochspannungs-Halbleiterbauelement Expired - Lifetime DE60232480D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001168746 2001-06-04

Publications (1)

Publication Number Publication Date
DE60232480D1 true DE60232480D1 (de) 2009-07-16

Family

ID=19010927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60232480T Expired - Lifetime DE60232480D1 (de) 2001-06-04 2002-06-04 Hochspannungs-Halbleiterbauelement

Country Status (5)

Country Link
US (1) US6989566B2 (de)
EP (1) EP1265285B1 (de)
KR (1) KR100535062B1 (de)
CN (1) CN1241263C (de)
DE (1) DE60232480D1 (de)

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JP2005005443A (ja) * 2003-06-11 2005-01-06 Toshiba Corp 高耐圧半導体装置
JP3998647B2 (ja) * 2004-02-12 2007-10-31 株式会社東芝 半導体チップおよび半導体チップのテスト方法
US7183626B2 (en) * 2004-11-17 2007-02-27 International Rectifier Corporation Passivation structure with voltage equalizing loops
US7306999B2 (en) * 2005-01-25 2007-12-11 Semiconductor Components Industries, L.L.C. High voltage sensor device and method therefor
US7955943B2 (en) * 2005-01-25 2011-06-07 Semiconductor Components Industries, Llc High voltage sensor device and method therefor
JP4906281B2 (ja) 2005-03-30 2012-03-28 オンセミコンダクター・トレーディング・リミテッド 半導体装置
JP4629490B2 (ja) * 2005-05-09 2011-02-09 三菱電機株式会社 誘電体分離型半導体装置
US20060255401A1 (en) * 2005-05-11 2006-11-16 Yang Robert K Increasing breakdown voltage in semiconductor devices with vertical series capacitive structures
US7535057B2 (en) * 2005-05-24 2009-05-19 Robert Kuo-Chang Yang DMOS transistor with a poly-filled deep trench for improved performance
US20070012983A1 (en) * 2005-07-15 2007-01-18 Yang Robert K Terminations for semiconductor devices with floating vertical series capacitive structures
JP4791113B2 (ja) * 2005-09-12 2011-10-12 オンセミコンダクター・トレーディング・リミテッド 半導体装置
US8080848B2 (en) 2006-05-11 2011-12-20 Fairchild Semiconductor Corporation High voltage semiconductor device with lateral series capacitive structure
JP4884830B2 (ja) * 2006-05-11 2012-02-29 三菱電機株式会社 半導体装置
KR101109601B1 (ko) * 2006-12-27 2012-01-31 삼성전자주식회사 적외선 송신 모듈 및 그 모듈을 구비한 시스템 온 칩
US20080296636A1 (en) * 2007-05-31 2008-12-04 Darwish Mohamed N Devices and integrated circuits including lateral floating capacitively coupled structures
KR100885495B1 (ko) * 2007-07-03 2009-02-24 삼성전자주식회사 고전력 어드레스 드라이버 및 이를 채택하는 디스플레이장치
KR101630734B1 (ko) 2007-09-21 2016-06-16 페어차일드 세미컨덕터 코포레이션 전력 소자
WO2009054286A1 (ja) * 2007-10-23 2009-04-30 Sharp Kabushiki Kaisha バックライト装置およびこれを備えた表示装置
US8207607B2 (en) * 2007-12-14 2012-06-26 Denso Corporation Semiconductor device with resin mold
US8193565B2 (en) 2008-04-18 2012-06-05 Fairchild Semiconductor Corporation Multi-level lateral floating coupled capacitor transistor structures
US8174067B2 (en) 2008-12-08 2012-05-08 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8106487B2 (en) * 2008-12-23 2012-01-31 Pratt & Whitney Rocketdyne, Inc. Semiconductor device having an inorganic coating layer applied over a junction termination extension
JP5535490B2 (ja) * 2009-01-30 2014-07-02 住友電工デバイス・イノベーション株式会社 半導体装置
JP5376365B2 (ja) * 2009-04-16 2013-12-25 三菱電機株式会社 半導体装置
JP2011029466A (ja) * 2009-07-28 2011-02-10 Hitachi Ltd 半導体装置
KR101049446B1 (ko) * 2009-11-13 2011-07-15 (주) 트리노테크놀로지 전력 반도체 소자
US8624302B2 (en) * 2010-02-05 2014-01-07 Fairchild Semiconductor Corporation Structure and method for post oxidation silicon trench bottom shaping
CN102064094B (zh) * 2010-11-10 2012-07-18 嘉兴斯达半导体股份有限公司 大厚度氧化层场板结构及其制造方法
CN102244100B (zh) * 2011-06-28 2016-01-06 上海华虹宏力半导体制造有限公司 Mos功率半导体器件
US8872278B2 (en) 2011-10-25 2014-10-28 Fairchild Semiconductor Corporation Integrated gate runner and field implant termination for trench devices
US8786021B2 (en) * 2012-09-04 2014-07-22 Macronix International Co., Ltd. Semiconductor structure having an active device and method for manufacturing and manipulating the same
CN103811402B (zh) * 2012-11-15 2016-08-17 上海华虹宏力半导体制造有限公司 一种超高压bcd工艺的隔离结构制作工艺方法
JP6089733B2 (ja) * 2013-01-30 2017-03-08 富士電機株式会社 半導体装置
US10147784B2 (en) 2014-05-15 2018-12-04 Texas Instruments Incorporated High voltage galvanic isolation device
US9299697B2 (en) * 2014-05-15 2016-03-29 Texas Instruments Incorporated High breakdown voltage microelectronic device isolation structure with improved reliability
CN105448987B (zh) * 2014-08-21 2018-07-03 中芯国际集成电路制造(上海)有限公司 半导体器件及其制作方法
US9806148B2 (en) 2015-04-07 2017-10-31 Texas Instruments Incorporated Device isolator with reduced parasitic capacitance
US10892360B2 (en) 2017-11-27 2021-01-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure with high voltage device
US11222945B2 (en) 2017-12-29 2022-01-11 Texas Instruments Incorporated High voltage isolation structure and method
WO2019202760A1 (ja) 2018-04-16 2019-10-24 パナソニックＩｐマネジメント株式会社 半導体装置
US11355460B1 (en) * 2020-12-07 2022-06-07 Infineon Technologies Ag Molded semiconductor package with high voltage isolation

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US4290077A (en) * 1979-05-30 1981-09-15 Xerox Corporation High voltage MOSFET with inter-device isolation structure
JPS5683076A (en) 1979-12-10 1981-07-07 Sharp Corp High tension mos field-effect transistor
DE3046749C2 (de) * 1979-12-10 1986-01-16 Sharp K.K., Osaka MOS-Transistor für hohe Betriebsspannungen
JPS58127361A (ja) 1982-01-25 1983-07-29 Hitachi Ltd 半導体装置
JPS61168253A (ja) 1985-01-19 1986-07-29 Sharp Corp 高耐圧ｍｏｓ電界効果半導体装置
US4811075A (en) * 1987-04-24 1989-03-07 Power Integrations, Inc. High voltage MOS transistors
JP2556172B2 (ja) 1990-05-31 1996-11-20 日本電気株式会社 多方向多重通信装置
KR950004674B1 (ko) 1992-05-28 1995-05-04 아시아자동차공업주식회사 이동식 액체용기의 에어브리더용 액체누출 방지장치
US5508540A (en) * 1993-02-19 1996-04-16 Hitachi, Ltd. Semiconductor integrated circuit device and process of manufacturing the same
US5500387A (en) * 1994-02-16 1996-03-19 Texas Instruments Incorporated Method of making high performance capacitors and/or resistors for integrated circuits
JP3547884B2 (ja) * 1995-12-30 2004-07-28 三菱電機株式会社 半導体装置及びその製造方法
DE19701189B4 (de) * 1996-01-18 2005-06-30 International Rectifier Corp., El Segundo Halbleiterbauteil
KR0175277B1 (ko) * 1996-02-29 1999-02-01 김광호 중첩된 필드플레이트구조를 갖는 전력반도체장치 및 그의 제조방법
DE19616151A1 (de) 1996-04-23 1997-10-30 Boehringer Mannheim Gmbh Videosystem zur Auswertung analytischer Testelemente
JPH10163489A (ja) 1996-11-29 1998-06-19 Matsushita Electric Works Ltd 半導体装置及びその製造方法
JP3425057B2 (ja) 1997-03-24 2003-07-07 ブラザー工業株式会社 パターン縫い作業データ処理装置
JPH11186419A (ja) 1997-12-25 1999-07-09 Toshiba Corp 不揮発性半導体記憶装置
JP4158219B2 (ja) * 1998-02-27 2008-10-01 株式会社デンソー 半導体装置の製造方法
US6534829B2 (en) 1998-06-25 2003-03-18 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same
JP3016762B2 (ja) 1998-06-25 2000-03-06 松下電子工業株式会社 半導体装置およびその製造方法
JP4960540B2 (ja) 1998-11-05 2012-06-27 富士電機株式会社 半導体装置
EP1011275A1 (de) 1998-12-17 2000-06-21 Telefonaktiebolaget Lm Ericsson Verfahren und Vorrichtung zur Ermittlung einer Signalisierungsadresse einer Mobilfunkvermittlungsstelle in einem zellularen Kommunikationssystem
US6603185B1 (en) * 1999-02-01 2003-08-05 Fuji Electric Co., Ltd. Voltage withstanding structure for a semiconductor device
JP3796998B2 (ja) * 1999-02-19 2006-07-12 松下電器産業株式会社 高耐圧半導体装置
US6376691B1 (en) 1999-09-01 2002-04-23 Symetrix Corporation Metal organic precursors for transparent metal oxide thin films and method of making same
US6236100B1 (en) * 2000-01-28 2001-05-22 General Electronics Applications, Inc. Semiconductor with high-voltage components and low-voltage components on a shared die
JP4024990B2 (ja) * 2000-04-28 2007-12-19 株式会社ルネサステクノロジ 半導体装置

Also Published As

Publication number Publication date
KR100535062B1 (ko) 2005-12-07
EP1265285A2 (de) 2002-12-11
US6989566B2 (en) 2006-01-24
KR20020092782A (ko) 2002-12-12
EP1265285A3 (de) 2005-07-13
CN1389918A (zh) 2003-01-08
CN1241263C (zh) 2006-02-08
US20020179974A1 (en) 2002-12-05
EP1265285B1 (de) 2009-06-03

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Legal Events

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8364 No opposition during term of opposition