JP5535490B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5535490B2 JP5535490B2 JP2009020255A JP2009020255A JP5535490B2 JP 5535490 B2 JP5535490 B2 JP 5535490B2 JP 2009020255 A JP2009020255 A JP 2009020255A JP 2009020255 A JP2009020255 A JP 2009020255A JP 5535490 B2 JP5535490 B2 JP 5535490B2
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- semiconductor chip
- guard ring
- electrode pad
- outer periphery
- electrode
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- 239000004065 semiconductor Substances 0.000 title claims description 189
- 239000004020 conductor Substances 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000005684 electric field Effects 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 11
- 230000005012 migration Effects 0.000 description 11
- 238000013508 migration Methods 0.000 description 11
- 230000007257 malfunction Effects 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 230000005669 field effect Effects 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Description
12 活性領域
14 ドレイン電極パッド
16 ゲート電極パッド
18 ガードリング
18a 第1のガードリング
18b 第2のガードリング
20 絶縁膜
22 第1端部
24 第2端部
25 水分侵入領域
26 導電体
28 Au析出領域
30 ソース電極パッド
32 ドレイン電極
34 ソース電極
36 ゲート電極
38 貫通電極
40 バスバー電極
41 配線
42 第1のガードリングの端部
44 第2のガードリングの端部
46 電界効果トランジスタ
50 電極
60 ガードリング絶縁部
100 半導体装置
Claims (5)
- 半導体チップと、
前記半導体チップの外周辺に沿って設けられた第1電極と、
前記第1電極に対向する前記半導体チップの外周辺に沿って設けられ、前記半導体チップの裏面電位との電位差が前記第1電極よりも大きい第2電極と、
前記半導体チップの外周辺と前記第1電極との間、および前記半導体チップの外周辺と前記第2電極との間を通り前記半導体チップの外周全体に沿って設けられてなる導電性のガードリングと、
前記ガードリングの一部領域を排することで、前記ガードリングを互いに絶縁された複数の単位領域に分割するための、複数のガードリング絶縁部と、を有し、
前記第1電極側及び前記第2電極側のいずれか一方に設けられた前記ガードリングの前記単位領域の端部は、前記第1電極側及び前記第2電極側の他方に設けられた前記ガードリングの前記単位領域の端部より前記半導体チップの外周辺側に配置されてなることを特徴とする半導体装置。 - 半導体チップと、
前記半導体チップの外周辺に沿って設けられた第1電極と、
前記第1電極に対向する前記半導体チップの外周辺に沿って設けられ、前記半導体チップの裏面電位との電位差が前記第1電極よりも大きい第2電極と、
前記半導体チップの外周辺と前記第2電極との間を通り、前記半導体チップ上であって、前記第1電極側の外周辺を除く前記半導体チップの外周辺に沿って設けられた導電性のガードリングと、を有し、
前記ガードリングの両端部は、前記ガードリング以外で互いに電気的に接続されていないことを特徴とする半導体装置。 - 前記ガードリング絶縁部の少なくとも1つは、前記第1および第2電極とは別に設けられた前記半導体チップの裏面電位と実質的に同電位の電極と、前記半導体チップの外周との間に設けられてなることを特徴とする請求項1記載の半導体装置。
- 前記半導体チップの外周を除く領域は絶縁膜によって被覆されてなり、前記ガードリングは、前記半導体チップの外周における前記絶縁膜によって被覆されない領域、および前記絶縁膜上の両方に連続して設けられてなることを特徴とする請求項1から3のいずれか一項記載の半導体装置。
- 前記ガードリングは、Ti、Ta、およびPtの何れかからなることを特徴とする請求項1から4のいずれか一項記載の半導体装置。
Priority Applications (2)
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---|---|---|---|
JP2009020255A JP5535490B2 (ja) | 2009-01-30 | 2009-01-30 | 半導体装置 |
US12/690,973 US8461667B2 (en) | 2009-01-30 | 2010-01-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009020255A JP5535490B2 (ja) | 2009-01-30 | 2009-01-30 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010177550A JP2010177550A (ja) | 2010-08-12 |
JP2010177550A5 JP2010177550A5 (ja) | 2012-03-15 |
JP5535490B2 true JP5535490B2 (ja) | 2014-07-02 |
Family
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Family Applications (1)
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JP2009020255A Active JP5535490B2 (ja) | 2009-01-30 | 2009-01-30 | 半導体装置 |
Country Status (2)
Country | Link |
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US (1) | US8461667B2 (ja) |
JP (1) | JP5535490B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5535490B2 (ja) * | 2009-01-30 | 2014-07-02 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
IT1397222B1 (it) | 2009-12-30 | 2013-01-04 | St Microelectronics Srl | Metodo per controllare il corretto posizionamento di sonde di test su terminazioni di dispositivi elettronici integrati su semiconduttore e relativo dispositivo elettronico. |
JP5607096B2 (ja) * | 2012-03-23 | 2014-10-15 | 株式会社東芝 | 窒化物半導体装置 |
CN102832178A (zh) * | 2012-09-18 | 2012-12-19 | 上海工程技术大学 | 一种用于集成电路芯片的密封环结构 |
CN103633046B (zh) * | 2013-12-13 | 2017-03-15 | 苏州能讯高能半导体有限公司 | 半导体器件及其制造方法 |
JP6478395B2 (ja) * | 2015-03-06 | 2019-03-06 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
JP7380310B2 (ja) | 2019-02-28 | 2023-11-15 | 住友電工デバイス・イノベーション株式会社 | 電界効果トランジスタ及び半導体装置 |
WO2022143786A1 (zh) * | 2020-12-31 | 2022-07-07 | 苏州能讯高能半导体有限公司 | 一种半导体器件及其制备方法 |
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2009
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2010
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US20100193894A1 (en) | 2010-08-05 |
JP2010177550A (ja) | 2010-08-12 |
US8461667B2 (en) | 2013-06-11 |
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